STMICROELECTRONICS STD30NE06LT4

STD30NE06L

N - CHANNEL 60V - 0.025 Ω - 30A TO-252
STripFET POWER MOSFET
TYPE
V DSS
R DS(o n)
ID
STD30NE06L
60 V
< 0.03 Ω
30 A
■
■
■
■
■
■
TYPICAL RDS(on) = 0.025 Ω
EXCEPTIONAL dv/dt CAPABILITY
100% AVALANCHE TESTED
LOW GATE CHARGE 100oC
APPLICATION ORIENTED
CHARACTERIZATION
ADD SUFFIX ”T4” FOR ORDERING IN TAPE
& REEL
DESCRIPTION
This Power MOSFET is the latest development of
STMicroelectronics unique ”Single Feature
Size” strip-based process. The resulting transistor shows extremely high packing density for low
on-resistance, rugged avalanche characteristics
and less critical alignment steps therefore a remarkable manufacturing reproducibility.
3
1
DPAK
TO-252
(Suffix ”T4”)
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ SOLENOID AND RELAY DRIVERS
■ MOTOR CONTROL, AUDIO AMPLIFIERS
■ DC-DC & DC-AC CONVERTERS
ABSOLUTE MAXIMUM RATINGS
Symb ol
V DS
V DGR
VGS
Value
Unit
Drain-source Voltage (VGS = 0)
Parameter
60
V
Drain- gate Voltage (R GS = 20 kΩ)
60
V
± 20
V
30
A
Drain Current (continuous) at Tc = 100 o C
21
A
Drain Current (pulsed)
120
A
G ate-source Voltage
ID
Drain Current (continuous) at Tc = 25 oC
ID
I DM (•)
P tot
o
T otal Dissipation at Tc = 25 C
Derating Factor
dv/ dt (1 ) Peak Diode Recovery voltage slope
T st g
Tj
Storage Temperature
Max. Operating Junction Temperature
(•) Pulse width limited by safe operating area
May 1999
55
W
0.37
W /o C
7
V/ns
-65 to 175
o
C
175
o
C
( 1) ISD ≤30A, di/dt ≤ 300 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
1/8
STD30NE06L
THERMAL DATA
R th j-pc b
R thj -amb
R t hj-s ink
Tl
Thermal Resistance Junction-PC Board
Max
Thermal Resistance Junction-ambient
Max
Thermal Resistance Case-sink
T yp
Maximum Lead Temperature F or Soldering Purpose
o
2.72
100
1.5
275
C/W
C/W
o
C/W
o
C
o
AVALANCHE CHARACTERISTICS
Symbo l
Parameter
Max Value
Unit
IAR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max)
30
A
E AS
Single Pulse Avalanche Energy
(starting Tj = 25 o C, ID = IAR , V DD = 25 V)
100
mJ
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symbo l
V (BR)DSS
Parameter
Drain-source
Breakdown Voltage
Test Con ditions
I D = 250 µA
V GS = 0
I DSS
V DS = Max Rating
Zero Gate Voltage
Drain Current (V GS = 0) V DS = Max Rating
IGSS
Gate-body Leakage
Current (VDS = 0)
Min.
Typ.
Max.
60
Unit
V
T c = 125 oC
V GS = ± 20 V
1
10
µA
µA
± 100
nA
Max.
Unit
ON (∗)
Symbo l
Parameter
Test Con ditions
ID = 250 µA
V GS(th)
Gate Threshold Voltage V DS = V GS
R DS(on)
Static Drain-source On
Resistance
V GS = 10 V
V GS = 5 V
I D(o n)
On State Drain Current
V DS > ID(o n) x R DS(on )ma x
V GS = 10 V
Min.
1
ID = 15 A
I D = 15 A
Typ.
1.7
2.5
V
0.022
0.025
0.028
0.030
Ω
Ω
30
A
DYNAMIC
Symbo l
g f s (∗)
C iss
C os s
C rss
2/8
Parameter
Test Con ditions
Forward
Transconductance
V DS > ID(o n) x R DS(on )ma x
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V DS = 25 V
f = 1 MHz
I D = 15 A
V GS = 0 V
Min.
Typ.
Max.
Unit
15
25
S
2370
350
90
pF
pF
pF
STD30NE06L
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbo l
Typ.
Max.
Unit
t d(on)
tr
Turn-on Delay T ime
Rise Time
Parameter
V DD = 30 V
I D = 15 A
R G = 4.7 Ω
V GS = 5 V
(Resistive Load, see fig. 3)
Test Con ditions
Min.
27
100
50
135
ns
ns
Qg
Q gs
Q gd
Total G ate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 30 V ID = 30 A V GS = 5 V
31
13
13.5
41
nC
nC
nC
Typ.
Max.
Unit
20
45
72
27
60
100
ns
ns
ns
Typ.
Max.
Unit
30
120
A
A
1.5
V
SWITCHING OFF
Symbo l
tr (Voff)
tf
tc
Parameter
Off-voltage Rise T ime
Fall T ime
Cross-over Time
Test Con ditions
Min.
V DD = 48 V
I D = 30 A
V GS = 5 V
R G = 4.7 Ω
(Induct ive Load, see fig. 5)
SOURCE DRAIN DIODE
Symbo l
Parameter
Test Con ditions
ISD
I SDM (•)
Source-drain Current
Source-drain Current
(pulsed)
V SD (∗)
Forward On Voltage
I SD = 30 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 30 A
di/dt = 100 A/µs
o
T j = 150 C
V DD = 30 V
(see test circuit, fig. 5)
t rr
Q rr
I RRM
Min.
V GS = 0
55
ns
0.1
µC
3.5
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Safe Operating Area
Thermal Impedance
3/8
STD30NE06L
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
4/8
STD30NE06L
Normalized Gate Threshold Voltage vs
Temperature
Normalized On Resistance vs Temperature
Source-drain Diode Forward Characteristics
5/8
STD30NE06L
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
6/8
STD30NE06L
TO-252 (DPAK) MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
2.2
2.4
0.086
0.094
A1
0.9
1.1
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.9
0.025
0.035
B2
5.2
5.4
0.204
0.212
C
0.45
0.6
0.017
0.023
C2
0.48
0.6
0.019
0.023
D
6
6.2
0.236
0.244
E
6.4
6.6
0.252
0.260
G
4.4
4.6
0.173
0.181
H
9.35
10.1
0.368
0.397
L2
0.8
L4
0.031
0.6
1
0.023
0.039
A1
C2
A
H
A2
C
DETAIL ”A”
L2
D
=
1
=
G
2
=
=
=
E
=
B2
3
B
DETAIL ”A”
L4
0068772-B
7/8
STD30NE06L
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibil ity for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specific ation mentioned in this publication are
subjec t to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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 1999 STMicroelectronics – Printed in Italy – All Rights Reserved
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8/8
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