STMICROELECTRONICS STW80N06-10

STW80N06-10
®
N - CHANNEL ENHANCEMENT MODE
"ULTRA HIGH DENSITY" POWER MOS TRANSISTOR
PRELIMINARY DATA
TYPE
V DSS
R DS(on)
ID
STW80N06-10
60 V
< 0.010 Ω
80 A
■
■
■
■
■
■
■
■
TYPICAL RDS(on) = 0.0085 Ω
AVALANCHE RUGGED TECHNOLOGY
100% AVALANCHE TESTED
REPETITIVE AVALANCHE DATA AT 100oC
HIGH CURRENT CAPABILITY
175oC OPERATING TEMPERATURE
HIGH dV/dt RUGGEDNESS
APPLICATION ORIENTED
CHARACTERIZATION
1
2
3
TO-247
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
■ POWER MOTOR CONTROL
■ DC-DC & DC-AC CONVERTERS
■ SYNCRONOUS RECTIFICATION
■
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
VDS
V DGR
V GS
Parameter
Value
Unit
Drain-source Voltage (V GS = 0)
60
V
Drain- gate Voltage (R GS = 20 kΩ)
60
V
± 20
V
80
A
Gate-source Voltage
o
ID
Drain Current (continuous) at T c = 25 C
ID
o
IDM (•)
P tot
dV/dt( 1 )
T stg
Tj
Drain Current (continuous) at T c = 100 C
60
A
Drain Current (pulsed)
320
A
Total Dissipation at T c = 25 o C
180
W
Derating Factor
1.2
W/ o C
5
V/ns
Peak Diode Recovery voltage slope
Storage Temperature
Max. Operating Junction Temperature
-65 to 175
o
C
175
o
C
(•) Pulse width limited by safe operating area
October 1998
1/5
STW80N06-10
THERMAL DATA
R thj-case
R thj-amb
R thc-sink
Tl
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Thermal Resistance Case-sink
Maximum Lead Temperature For Soldering Purpose
o
0.83
62.5
0.5
300
Max
Max
Typ
C/W
C/W
o
C/W
o
C
o
AVALANCHE CHARACTERISTICS
Symbol
Parameter
Max Value
Unit
IAR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T j max, δ < 1%)
60
A
E AS
Single Pulse Avalanche Energy
(starting T j = 25 o C, I D = I AR , V DD = 25 V)
600
mJ
E AR
Repetitive Avalanche Energy
(pulse width limited by T j max, δ < 1%)
150
mJ
IAR
Avalanche Current, Repetitive or Not-Repetitive
(T c = 100 o C, pulse width limited by T j max, δ < 1%)
42
A
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symbol
V (BR)DSS
Parameter
Drain-source
Breakdown Voltage
Test Conditions
I D = 250 µA
V GS = 0
I DSS
Zero Gate Voltage
V DS = Max Rating
Drain Current (V GS = 0) V DS = Max Rating x 0.8
IGSS
Gate-body Leakage
Current (V DS = 0)
Min.
Typ.
Max.
60
Unit
V
T c = 125 o C
V GS = ± 20 V
10
100
µA
µA
± 100
nA
ON (∗)
Symbol
Parameter
Test Conditions
V GS(th)
Gate Threshold Voltage V DS = V GS
R DS(on)
Static Drain-source On
Resistance
I D(on)
I D = 250 µA
V GS = 10V I D = 40 A
V GS = 10V I D = 40 A
Min.
Typ.
Max.
Unit
2
3
4
V
0.0085
0.01
0.02
Ω
Ω
T c = 100 o C
On State Drain Current V DS > I D(on) x R DS(on)max
V GS = 10 V
80
A
DYNAMIC
Symbol
g fs (∗)
C iss
C oss
C rss
2/5
Parameter
Test Conditions
Forward
Transconductance
V DS > I D(on) x R DS(on)max
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V DS = 25 V
f = 1 MHz
I D = 40 A
V GS = 0
Min.
Typ.
Max.
Unit
25
S
5900
900
230
pF
pF
pF
STW80N06-10
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol
t d(on)
tr
(di/dt) on
Qg
Q gs
Q gd
Typ.
Max.
Unit
Turn-on Time
Rise Time
Parameter
V DD = 30 V
ID = 40 A
R G = 4.7 Ω
V GS = 10 V
(see test circuit, figure 3)
Test Conditions
32
160
42
200
ns
ns
Turn-on Current Slope
V DD = 48 V
I D = 80 A
R G = 50 Ω
V GS = 10 V
(see test circuit, figure 5)
240
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 40 V
230
30
60
280
nC
nC
nC
Typ.
Max.
Unit
35
175
240
46
230
300
ns
ns
ns
Typ.
Max.
Unit
80
320
A
A
1.5
V
125
ns
0.6
µC
10
A
I D = 80 A
Min.
V GS = 10 V
A/µs
SWITCHING OFF
Symbol
tr(Voff)
tf
tc
Parameter
Off-voltage Rise Time
Fall Time
Cross-over Time
Test Conditions
Min.
V DD = 48 V I D = 40 A
R G = 4.7 Ω VGS = 10 V
(see test circuit, figure 5)
SOURCE DRAIN DIODE
Symbol
Parameter
Test Conditions
ISD
I SDM (•)
Source-drain Current
Source-drain Current
(pulsed)
V SD (∗)
Forward On Voltage
I SD = 80 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 80 A
di/dt = 100 A/µs
V DD = 30 V
T j = 150 o C
(see test circuit, figure 5)
t rr
Q rr
I RRM
V GS = 0
Min.
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
(1) ISD ≤ 60 A, di/dt ≤ 200 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
3/5
STW80N06-10
TO-247 MECHANICAL DATA
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
MAX.
A
4.7
5.3
0.185
0.209
D
2.2
2.6
0.087
0.102
E
0.4
0.8
0.016
0.031
F
1
1.4
0.039
0.055
F3
2
2.4
0.079
0.094
F4
3
3.4
0.118
0.134
G
10.9
0.429
H
15.3
15.9
0.602
0.626
L
19.7
20.3
0.776
0.779
L3
14.2
14.8
0.559
0.413
L4
34.6
1.362
L5
5.5
0.217
0.582
M
2
3
0.079
0.118
Dia
3.55
3.65
0.140
0.144
P025P
4/5
STW80N06-10
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a trademark of STMicroelectronics
© 1998 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
http://www.st.com
.
5/5