FAIRCHILD FGA180N33ATDTU

FGA180N33ATD
330 V PDP Trench IGBT
Features
General Description
• High Current Capability
Using novel trench IGBT Technology, Fairchild®’s new series of
trench IGBTs offer the optimum performance for PDP TV applications where low conduction and switching losses are essential.
• Low Saturation Voltage: VCE(sat) = 1.68 V @ IC = 180 A
• High Input Impedance
• RoHS Complaint
Applications
• PDP TV
C
G
TO-3P
E
G DS
Absolute Maximum Ratings
Symbol
Description
VCES
Collector to Emitter Voltage
VGES
Gate to Emitter Voltage
IC
ICM (1)
PD
Ratings
Unit
330
V
± 30
V
Collector Current
@ TC = 25oC
180
A
Pulsed Collector Current
@ TC = 25oC
450
A
25oC
Maximum Power Dissipation
@ TC =
Maximum Power Dissipation
@ TC = 100oC
390
W
156
W
TJ
Operating Junction Temperature
-55 to +150
o
Tstg
Storage Temperature Range
-55 to +150
oC
TL
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
300
oC
C
Notes:
1: Repetitive test, pulse width = 100usec, Duty = 0.1
* IC_pulse limited by max Tj
Thermal Characteristics
Symbol
Parameter
Typ.
Max.
Unit
RθJC(IGBT)
Thermal Resistance, Junction to Case
-
0.32
oC/W
RθJC(Diode)
Thermal Resistance, Junction to Case
-
0.82
o
40
o
RθJA
Thermal Resistance, Junction to Ambient
©2011 Fairchild Semiconductor Corporation
FGA180N33ATD Rev. C0
-
1
C/W
C/W
www.fairchildsemi.com
FGA180N33ATD 330 V PDP Trench IGBT
April 2013
Packaging
Device Marking
Device
Package
Type
Qty per Tube
Max Qty per
Box
FGA180N33ATD
FGA180N33ATDTU
TO-3P
Tube
30ea
-
Electrical Characteristics of the IGBT
Symbol
Parameter
TC = 25°C unless otherwise noted
Test Conditions
Min.
Typ.
Max.
Unit
Off Characteristics
BVCES
Collector to Emitter Breakdown Voltage
VGE = 0V, IC = 400µA
330
-
-
V
ICES
Collector Cut-Off Current
VCE = VCES, VGE = 0V
-
-
400
µA
IGES
G-E Leakage Current
VGE = VGES, VCE = 0V
-
-
±400
nA
IC = 250uA, VCE = VGE
2.5
4.0
5.5
V
On Characteristics
VGE(th)
VCE(sat)
G-E Threshold Voltage
Collector to Emitter Saturation Voltage
IC = 40A, VGE = 15V
-
1.1
1.4
V
IC = 180A, VGE = 15V,
-
1.68
-
V
IC = 180A, VGE = 15V
TC = 125oC
-
1.89
-
V
-
3880
-
pF
-
305
-
pF
-
180
-
pF
-
27
-
ns
-
80
-
ns
-
108
-
ns
-
180
240
ns
-
26
-
ns
-
75
-
ns
Dynamic Characteristics
Cies
Input Capacitance
Coes
Output Capacitance
Cres
Reverse Transfer Capacitance
VCE = 30V, VGE = 0V,
f = 1MHz
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
Qg
Total Gate Charge
Qge
Gate to Emitter Charge
Qgc
Gate to Collector Charge
©2011 Fairchild Semiconductor Corporation
FGA180N33ATD Rev. C0
VCC = 200V, IC = 40A,
RG = 5Ω, VGE = 15V,
Resistive Load, TC = 25oC
VCC = 200V, IC = 40A,
RG = 5Ω, VGE = 15V,
Resistive Load, TC = 125oC
VCE = 200V, IC = 40A,
VGE = 15V
2
-
112
-
ns
-
250
300
ns
-
169
-
nC
-
22
-
nC
-
69
-
nC
www.fairchildsemi.com
FGA180N33ATD 330 V PDP Trench IGBT
Package Marking and Ordering Information
Symbol
Parameter
VFM
Diode Forward Voltage
trr
Diode Reverse Recovery Time
Irr
Diode Peak Reverse Recovery Cyrrent
Qrr
Diode Reverse Recovery Charge
TC = 25°C unless otherwise noted
Test Conditions
IF = 20A
IES =20A,
dI/dt = 200A/µs
Min.
Typ.
Max
TC = 25oC
-
1.2
1.6
TC = 125oC
-
1.04
-
TC = 25oC
-
27
-
o
TC = 125 C
-
39
-
TC = 25oC
-
3.5
-
-
6.0
-
TC = 25oC
-
48
-
o
-
117
-
TC =
©2011 Fairchild Semiconductor Corporation
FGA180N33ATD Rev. C0
125oC
TC = 125 C
3
Unit
V
ns
A
nC
www.fairchildsemi.com
FGA180N33ATD 330 V PDP Trench IGBT
Electrical Characteristics of the Diode
Figure 1. Typical Output Characteristics
Figure 2. Typical Output Characteristics
200
200
o
o
Collector Current, IC [A]
20V
TC = 125 C
10V
9V
20V
8V
150
Collector Current, IC [A]
TC = 25 C
15V
12V
100
7V
50
10V
9V
150
8V
15V
12V
100
7V
50
VGE = 6V
VGE = 6V
0
0
0
2
4
Collector-Emitter Voltage, VCE [V]
6
0
Figure 3. Typical Saturation Voltage
Characteristics
200
Common Emitter
VCE = 20V
Common Emitter
VGE = 15V
o
o
TC = 25 C
150
Collector Current, IC [A]
Collector Current, IC [A]
6
Figure 4. Transfer Characteristics
200
o
TC = 125 C
100
50
TC = 25 C
150
o
TC = 125 C
100
50
0
0
0
1
2
Collector-Emitter Voltage, VCE [V]
2
3
Figure 5. Saturation Voltage vs. Case
Temperature at Variant Current Level
Common Emitter
180A
1.5
90A
1.2
40A
0.9
o
TC = 25 C
16
12
8
180A
90A
4
40A
IC = 20A
IC = 20A
0.6
25
0
50
75
100
125
150
o
Collector-EmitterCase Temperature, TC [ C]
©2011 Fairchild Semiconductor Corporation
FGA180N33ATD Rev. C0
10
20
Common Emitter
VGE = 15V
1.8
4
6
8
Gate-Emitter Voltage,VGE [V]
Figure 6. Saturation Voltage vs. VGE
Collector-Emitter Voltage, VCE [V]
2.1
Collector-Emitter Voltage, VCE [V]
2
4
Collector-Emitter Voltage, VCE [V]
4
0
4
8
12
16
Gate-Emitter Voltage, VGE [V]
20
www.fairchildsemi.com
FGA180N33ATD 330 V PDP Trench IGBT
Typical Performance Characteristics
Figure 7. Saturation Voltage vs. VGE
Figure 8. Capacitance Characteristics
6000
20
Common Emitter
VGE = 0V, f = 1MHz
Common Emitter
o
16
TC = 25 C
Cies
Capacitance [pF]
Collector-Emitter Voltage, VCE [V]
o
TC = 125 C
12
8
180A
4000
Coes
2000
90A
40A
4
Cres
IC = 20A
0
0
0
4
8
12
16
Gate-Emitter Voltage, VGE [V]
1
20
Figure 9. Gate charge Characteristics
10
Collector-Emitter Voltage, VCE [V]
30
Figure 10. SOA Characteristics
1000
15
IC MAX (Pulse)
Common Emitter
TC = 25 C
10µs
12
Collector Current, Ic [A]
Gate-Emitter Voltage, VGE [V]
o
VCC = 100V
200V
9
6
3
100
100µs
1ms
10ms
10
IC MAX (Continuous)
DC Operation
*Notes:
1
o
1. TC = 25 C
o
2. TJ = 150 C
3. Single Pulse
0.1
0
0
30
60
90
120
Gate Charge, Qg [nC]
150
1
180
Figure 11. Turn-on Characteristics vs.
Gate Resistance
10
100
Collector-Emitter Voltage, VCE [V]
Figure 12. Turn-off Characteristics vs.
Gate Resistance
5000
500
Common Emitter
VCC = 200V, VGE = 15V
IC = 40A
Switching Time [ns]
o
Switching Time [ns]
1000
tr
100
td(on)
Common Emitter
VCC = 200V, VGE = 15V
IC = 40A
td(off)
TC = 25 C
o
TC = 125 C
1000
tf
o
TC = 25 C
100
o
TC = 125 C
70
10
0
20
40
60
80
Gate Resistance, RG [Ω]
©2011 Fairchild Semiconductor Corporation
FGA180N33ATD Rev. C0
100
0
20
40
60
80
100
Gate Resistance, RG [Ω]
5
www.fairchildsemi.com
FGA180N33ATD 330 V PDP Trench IGBT
Typical Performance Characteristics
Figure 13. Turn-on Characteristics vs.
Collector Current
Figure 14. Turn-off Characteristics vs.
Collector Current
1000
2000
Common Emitter
VGE = 15V, RG = 15Ω
o
TC = 25 C
1000
tf
o
Switching Time [ns]
Switching Time [ns]
TC = 125 C
tr
100
td(off)
10
td(on)
Common Emitter
VGE = 15V, RG = 15Ω
o
TC = 25 C
o
TC = 125 C
100
10
30
60
90
120
150
1
10
180
30
60
Collector Current, IC [A]
Figure 15. Turn off Switching SOA Characteristics
120
150
180
Figure 16. Forward Characteristics
100
500
100
Forward Current, IF [A]
Collector Current, IC [A]
90
Collector Current, IC [A]
10
o
TJ = 25 C
10
o
TJ = 125 C
o
TC = 25 C
Safe Operating Area
o
TC = 125 C
o
VGE = 15V, TC = 125 C
1
1
10
100
Collector-Emitter Voltage, VCE [V]
©2011 Fairchild Semiconductor Corporation
FGA180N33ATD Rev. C0
1
0.0
400
6
0.5
1.0
1.5
2.0
Forward Voltage, VF [V]
2.5
www.fairchildsemi.com
FGA180N33ATD 330 V PDP Trench IGBT
Typical Performance Characteristics
Figure 19. Reverse Recovery Current
Figure 20. Stored Charge
60
Stored Recovery Charge, Qrr [nC]
Reverse Recovery Currnet, Irr [A]
4
200A/µs
3
2
di/dt = 100A/µs
1
5
10
15
20
25
30
Forward Current, IF [A]
35
40
35
40
200A/µs
50
40
30
di/dt = 100A/µs
20
10
5
10
15
20
25
30
Forward Current, IF [A]
35
40
Figure 21.Reverse Recovery Time
Reverse Recovery Time, trr [ns]
40
di/dt = 100A/µs
30
200A/µs
20
10
5
10
15
20
25
30
Forward Current, IF [A]
Figure 22.Transient Thermal Impedance of IGBT
Thermal Response [Zthjc]
1
0.5
0.1
0.2
0.1
0.05
PDM
0.01 0.02
t1
0.01
single pulse
1E-3
1E-5
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
1E-4
1E-3
0.01
0.1
1
Rectangular Pulse Duration [sec]
©2011 Fairchild Semiconductor Corporation
FGA180N33ATD Rev. C0
7
www.fairchildsemi.com
FGA180N33ATD 330 V PDP Trench IGBT
Typical Performance Characteristics
FGA180N33ATD 330 V PDP Trench IGBT
Mechanical Dimensions
TO-3PN
Dimensions in Millimeters
©2011 Fairchild Semiconductor Corporation
FGA180N33ATD Rev. C0
8
www.fairchildsemi.com
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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THEREIN, WHICH COVERS THESE PRODUCTS.
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As used here in:
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intended for surgical implant into the body or (b) support or sustain life,
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instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Definition
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I64
©2011 Fairchild Semiconductor Corporation
FGA180N33ATD Rev. C0
9
www.fairchildsemi.com
FGA180N33ATD 330 V PDP Trench IGBT
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