FAIRCHILD FGB40N60SM

FGB40N60SM
tm
600V, 40A Field Stop IGBT
Features
General Description
o
• Maximum Junction Temperature : TJ =175 C
Using Novel Field Stop IGBT Technology, Fairchild’s new series
of Field Stop 2nd generation IGBTs offer the optimum performance for welding and PFC applications where low conduction
and switching losses are essential.
• Positive Temperaure Co-efficient for easy parallel operating
• High current capability
• Low saturation voltage: VCE(sat) =1.9V(Typ.) @ IC = 40A
• High input impedance
• Fast switching
• Tighten Parameter Distribution
• RoHS compliant
• IR Reflow Only
Applications
• Welding, PFC
C
COLLECTOR
(FLANGE)
G
TO-263AB/D2-PAK
G C
E
E
Absolute Maximum Ratings
Symbol
Description
Ratings
Units
VCES
Collector to Emitter Voltage
600
V
VGES
Gate to Emitter Voltage
± 20
V
IC
ICM (1)
PD
TJ
25oC
Collector Current
@ TC =
80
A
Collector Current
@ TC = 100oC
40
A
120
A
Maximum Power Dissipation
@ TC = 25oC
349
W
Maximum Power Dissipation
@ TC = 100oC
Pulsed Collector Current
Operating Junction Temperature
Tstg
Storage Temperature Range
TL
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
174
W
-55 to +175
o
-55 to +175
oC
300
C
o
C
Notes:
1: Repetitive rating: Pulse width limited by max. junction temperature
©2011 Fairchild Semiconductor Corporation
FGB40N60SM Rev. A
1
www.fairchildsemi.com
FGB40N60SM 600V, 40A Field Stop IGBT
November 2011
Symbol
RθJC(IGBT)
Parameter
Typ.
Max.
-
0.43
o
C/W
62.5
o
C/W
Thermal Resistance, Junction to Case
RθJA
Thermal Resistance, Junction to Ambient
-
Units
Package Marking and Ordering Information
Device Marking
Device
Package
Reel Size
Tape Width
Quantity
FGB40N60SM
FGB40N60SM
TO-263AB/D2-PAK
-
-
50
Electrical Characteristics of the IGBT
Symbol
Parameter
TC = 25°C unless otherwise noted
Test Conditions
Min.
Typ.
Max.
Units
Off Characteristics
BVCES
Collector to Emitter Breakdown Voltage
VGE = 0V, IC = 250µA
600
-
-
V
∆BVCES
∆TJ
Temperature Coefficient of Breakdown
Voltage
VGE = 0V, IC = 250µA
-
0.6
-
V/oC
ICES
Collector Cut-Off Current
VCE = VCES, VGE = 0V
-
-
250
µA
IGES
G-E Leakage Current
VGE = VGES, VCE = 0V
-
-
±400
nA
3.5
4.5
6.0
V
On Characteristics
VGE(th)
G-E Threshold Voltage
IC = 250µA, VCE = VGE
IC = 40A, VGE = 15V
-
1.9
2.3
V
VCE(sat)
Collector to Emitter Saturation Voltage
IC = 40A, VGE = 15V,
TC = 175oC
-
2.1
-
V
-
1880
-
pF
-
180
-
pF
-
50
-
pF
Dynamic Characteristics
Cies
Input Capacitance
Coes
Output Capacitance
Cres
Reverse Transfer Capacitance
VCE = 30V, VGE = 0V,
f = 1MHz
Switching Characteristics
td(on)
Turn-On Delay Time
-
12
16
ns
tr
Rise Time
-
20
28
ns
td(off)
Turn-Off Delay Time
-
92
120
ns
tf
Fall Time
-
13
17
ns
Eon
Turn-On Switching Loss
-
0.87
1.30
mJ
Eoff
Turn-Off Switching Loss
-
0.26
0.34
mJ
VCC = 400V, IC = 40A,
RG = 6Ω, VGE = 15V,
Inductive Load, TC = 25oC
Ets
Total Switching Loss
-
1.13
1.64
mJ
td(on)
Turn-On Delay Time
-
15
-
ns
tr
Rise Time
-
22
-
ns
td(off)
Turn-Off Delay Time
-
116
-
ns
tf
Fall Time
-
16
-
ns
Eon
Turn-On Switching Loss
-
0.97
-
mJ
Eoff
Turn-Off Switching Loss
-
0.60
-
mJ
Ets
Total Switching Loss
-
1.57
-
mJ
FGB40N60SM Rev. A
VCC = 400V, IC = 40A,
RG = 6Ω, VGE = 15V,
Inductive Load, TC = 175oC
2
www.fairchildsemi.com
FGB40N60SM 600V, 40A Field Stop IGBT
Thermal Characteristics
Symbol
Qg
Parameter
(Continued)
Test Conditions
Total Gate Charge
Qge
Gate to Emitter Charge
Qgc
Gate to Collector Charge
FGB40N60SM Rev. A
VCE = 400V, IC = 40A,
VGE = 15V
3
Min.
Typ.
Max
Units
-
119
180
nC
-
13
20
nC
-
58
90
nC
www.fairchildsemi.com
FGB40N60SM 600V, 40A Field Stop IGBT
Electrical Characteristics of the IGBT
Figure 1. Typical Output Characteristics
120
o
TC = 25 C
20V
15V
120
12V
o
TC = 175 C
100
10V
80
60
VGE = 8V
40
12V
10V
80
60
VGE = 8V
40
20
20
0
0
2
4
Collector-Emitter Voltage, VCE [V]
0
6
0
Figure 3. Typical Saturation Voltage
Characteristics
2
4
Collector-Emitter Voltage, VCE [V]
6
Figure 4. Transfer Characteristics
120
120
Common Emitter
VCE = 20V
Common Emitter
VGE = 15V
o
o
TC = 25 C
o
TC = 175 C
80
TC = 25 C
Collector Current, IC [A]
100
Collector Current, IC [A]
20V
15V
100
Collector Current, IC [A]
Collector Current, IC [A]
Figure 2. Typical Output Characteristics
60
40
90 T = 175oC
C
60
30
20
0
0
0
1
2
3
Collector-Emitter Voltage, VCE [V]
0
4
Figure 5. Saturation Voltage vs. Case
Temperature at Variant Current Level
Collector-Emitter Voltage, VCE [V]
Collector-Emitter Voltage, VCE [V]
20
Common Emitter
VGE = 15V
80A
2.0
40A
1.5
IC = 20A
1.0
25
4
12
Common Emitter
o
TC = -40 C
16
12
8
40A
80A
4
IC = 20A
0
50
75
100
125
150
175
o
Collector-EmitterCase Temperature, TC [ C]
FGB40N60SM Rev. A
4
6
8
10
Gate-Emitter Voltage,VGE [V]
Figure 6. Saturation Voltage vs. VGE
3.0
2.5
2
4
8
12
16
Gate-Emitter Voltage, VGE [V]
20
www.fairchildsemi.com
FGB40N60SM 600V, 40A Field Stop IGBT
Typical Performance Characteristics
Figure 7. Saturation Voltage vs. VGE
20
20
Common Emitter
Common Emitter
o
TC = 25 C
Collector-Emitter Voltage, VCE [V]
Collector-Emitter Voltage, VCE [V]
Figure 8. Saturation Voltage vs. VGE
16
12
8
40A
80A
4
IC = 20A
0
o
TC = 175 C
16
12
8
80A
4
40A
IC = 20A
0
4
8
12
16
Gate-Emitter Voltage, VGE [V]
4
20
Figure 9. Capacitance Characteristics
8
12
16
Gate-Emitter Voltage, VGE [V]
20
Figure 10. Gate charge Characteristics
15
4000
Common Emitter
Common Emitter
VGE = 0V, f = 1MHz
Gate-Emitter Voltage, VGE [V]
o
o
TC = 25 C
Capacitance [pF]
3000
Cies
2000
1000
Coes
TC = 25 C
400V
12
VCC = 200V
300V
9
6
3
Cres
0
0
0.1
1
10
Collector-Emitter Voltage, VCE [V]
0
30
Figure 11. SOA Characteristics
40
80
Gate Charge, Qg [nC]
Figure 12. Turn-on Characteristics vs.
Gate Resistance
100
300
10µs
100
tr
100µs
1ms
Switching Time [ns]
Collector Current, Ic [A]
120
10 ms
10
DC
1
*Notes:
0.1
td(on)
10
Common Emitter
VCC = 400V, VGE = 15V
IC = 40A
o
o
1. TC = 25 C
TC = 25 C
o
o
2. TJ = 175 C
3. Single Pulse
0.01
1
FGB40N60SM Rev. A
10
100
Collector-Emitter Voltage, VCE [V]
TC = 175 C
1
0
1000
5
10
20
30
40
Gate Resistance, RG [Ω]
50
www.fairchildsemi.com
FGB40N60SM 600V, 40A Field Stop IGBT
Typical Performance Characteristics
Figure 13. Turn-off Characteristics vs.
Gate Resistance
Figure 14. Turn-on Characteristics vs.
Collector Current
1000
1000
Common Emitter
VGE = 15V, RG = 6Ω
o
TC = 25 C
100
tf
Common Emitter
VCC = 400V, VGE = 15V
IC = 40A
10
o
Switching Time [ns]
Switching Time [ns]
td(off)
TC = 175 C
100
tr
10
td(on)
o
TC = 25 C
o
TC = 175 C
1
0
10
20
30
40
1
20
50
30
40
50
60
70
80
Collector Current, IC [A]
Gate Resistance, RG [Ω]
Figure 15. Turn-off Characteristics vs.
Collector Current
Figure 16. Switching Loss vs.
Gate Resistance
1000
5
Switching Loss [mJ]
Switching Time [ns]
td(off)
100
tf
10
Common Emitter
VGE = 15V, RG = 6Ω
o
Eon
1
Eoff
Common Emitter
VCC = 400V, VGE = 15V
IC = 40A
o
TC = 25 C
TC = 25 C
o
o
TC = 175 C
1
20
30
40
50
60
TC = 175 C
70
0.1
80
0
Collector Current, IC [A]
Figure 17. Switching Loss vs.
Collector Current
10
20
30
40
Gate Resistance, RG [Ω]
50
Figure 18. Turn off Switching
SOA Characteristics
200
6
Collector Current, IC [A]
Switching Loss [mJ]
100
Eon
1
Eoff
Common Emitter
VGE = 15V, RG = 6Ω
o
TC = 25 C
10
Safe Operating Area
o
o
TC = 175 C
0.1
20
30
40
50
60
70
VGE = 15V, TC = 175 C
1
80
1
Collector Current, IC [A]
FGB40N60SM Rev. A
10
100
1000
Collector-Emitter Voltage, VCE [V]
6
www.fairchildsemi.com
FGB40N60SM 600V, 40A Field Stop IGBT
Typical Performance Characteristics
Figure 19. Current Derating
Figure 20. Load Current Vs. Frequency
90
o
TJ < 175 C, D = 0.5, VCE = 400V
VGE = 15/0V, RG = 6Ω
100
70
60
50
40
30
20
90
80
70
o
Tc = 75 C
60
o
Tc = 100 C
50
40
30
20
10
0
25
Square Wave
110
Collector Current, IC [A]
Collector Current, IC [A]
120
Common Emitter
VGE = 15V
80
10
0
1k
50
75
100
125
150
175
o
Collector-EmitterCase Temperature, TC [ C]
10k
100k
Switching Frequency, f [Hz]
1M
Figure 21.Transient Thermal Impedance of IGBT
Thermal Response [Zthjc]
1
0.5
0.1
0.01
0.2
0.1
0.05
0.02
0.01
single pulse
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
0.001
-5
10
-4
10
-3
-2
10
10
-1
10
0
10
Rectangular Pulse Duration [sec]
FGB40N60SM Rev. A
7
www.fairchildsemi.com
FGB40N60SM 600V, 40A Field Stop IGBT
Typical Performance Characteristics
FGB40N60SM 600V, 40A Field Stop IGBT
Mechanical Dimensions
TO-263AB/D2-PAK
FGB40N60SM Rev. A
8
www.fairchildsemi.com
tm
tm
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,
www.Fairchildsemi.com, under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild
Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of
up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and
warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is
committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I47
FGB40N60SM Rev. A
9
www.fairchildsemi.com
FGB40N60SM 600V, 40A Field Stop IGBT
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
AccuPower™
PowerTrench®
FRFET®
The Power Franchise®
®
Auto-SPM™
Global Power ResourceSM
PowerXS™
Build it Now™
Green FPS™
Programmable Active Droop™
®
Green FPS™ e-Series™
CorePLUS™
QFET
TinyBoost™
CorePOWER™
Gmax™
QS™
TinyBuck™
GTO™
Quiet Series™
CROSSVOLT™
TinyCalc™
IntelliMAX™
CTL™
RapidConfigure™
TinyLogic®
ISOPLANAR™
Current Transfer Logic™
™
TINYOPTO™
®
MegaBuck™
DEUXPEED
TinyPower™
MICROCOUPLER™
Dual Cool™
Saving our world, 1mW/W/kW at a time™
TinyPWM™
EcoSPARK®
MicroFET™
SignalWise™
TinyWire™
EfficentMax™
MicroPak™
SmartMax™
TriFault Detect™
MicroPak2™
SMART START™
®
TRUECURRENT™*
MillerDrive™
SPM®
µSerDes™
®
MotionMax™
STEALTH™
Fairchild
®
Motion-SPM™
SuperFET™
Fairchild Semiconductor
OptiHiT™
SuperSOT™-3
FACT Quiet Series™
UHC®
OPTOLOGIC®
SuperSOT™-6
FACT®
®
Ultra FRFET™
®
SuperSOT™-8
OPTOPLANAR
FAST
®
UniFET™
SupreMOS™
FastvCore™
VCX™
SyncFET™
FETBench™
VisualMax™
Sync-Lock™
FlashWriter® *
PDP SPM™
XS™
®*
FPS™
Power-SPM™
F-PFS™