TPD4125AK TOSHIBA Intelligent Power Device High Voltage Monolithic Silicon Power IC TPD4125AK The TPD4125AK is a DC brush less motor driver using high voltage PWM control. It is fabricated by high voltage SOI process. It is three-shunt resistor circuit for current sensing. It contains level shift high-side driver, low-side driver, IGBT outputs, FRDs and protective functions for under voltage protection circuits and thermal shutdown circuit. It is easy to control a DC brush less motor by just putting logic inputs from a MPU or motor controller to the TPD4125AK. HDIP26-P-1332-2.00 Weigh: 3.8 g (typ.) Features • High voltage power side and low voltage signal side terminal are separated. • It is the best for current sensing in three shunt resistance. • Bootstrap circuit gives simple high-side supply. • Bootstrap diodes are built in. • A dead time can be set as a minimum of 1.4 μs, and it is the best for a Sine-wave from drive. • 3-phase bridge output using IGBTs. • FRDs are built in. • Included under voltage protection and thermal shutdown. • The regulator of 7 V (typ.) is built in. • Package: 26-pin DIP. This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product, ensure that the environment is protected against electrostatic discharge. 1 2008-05-16 2 GND 16 VCC 15 NC 14 VREG 13 NC 12 DIAG 11 SD 10 LW 9 LV 8 LU 7 HW 6 HV 5 HU 4 NC 3 NC 2 GND 1 17 U 18 BSU 19 IS1 20 IS2 21 BSV 22 V 23 VBB 24 BSW 25 W 26 IS3 TPD4125AK Pin Assignment Marking Lot Code (Weekly code) TPD4125AK TPD4125K Part No. (or abbreviation code) 2008-05-16 TPD4125AK Block Diagram VCC 15 18 BSU 21 BSV 24 BSW VREG 13 23 VBB 7V Regulator UnderUnderUndervoltage voltage voltage Protection Protection Protection Undervoltage Protection High-side Level Shift Driver HU 4 HV 5 HW 6 22 V LU 7 25 W LV 8 LW 9 SD Input Control Thermal Shutdown 17 U Low-side Driver 10 26 IS3 DIAG 11 20 IS2 19 IS1 1/16 GND 3 2008-05-16 TPD4125AK Pin Description Pin No. Symbol 1 GND 2 NC 3 NC Pin Description Ground pin. Unused pin, which is not connected to the chip internally. Unused pin, which is not connected to the chip internally. The control terminal of IGBT by the high side of U. It turns off less than 1.5V. It turns on more than 3.5V. The control terminal of IGBT by the high side of V. It turns off less than 1.5V. It turns on more than 3.5V. The control terminal of IGBT by the high side of W. It turns off less than 1.5V. It turns on more than 3.5V. The control terminal of IGBT by the low side of U. It turns off less than 1.5V. It turns on more than 3.5V. The control terminal of IGBT by the low side of V. It turns off less than 1.5V. It turns on more than 3.5V. The control terminal of IGBT by the low side of W. It turns off less than 1.5V. It turns on more than 3.5V. 4 HU 5 HV 6 HW 7 LU 8 LV 9 LW 10 SD 11 DIAG 12 NC 13 VREG 14 NC Unused pin, which is not connected to the chip internally. 15 VCC Control power supply pin. (15V typ.) 16 GND 17 U 18 BSU U-phase bootstrap capacitor connecting pin. 19 IS1 U-phase IGBT emitter and FRD anode pin. 20 IS2 V-phase IGBT emitter and FRD anode pin. 21 BSV V-phase bootstrap capacitor connecting pin. 22 V 23 VBB High-voltage power supply input pin. 24 BSW W-phase bootstrap capacitor connecting pin. 25 W W-phase output pin. 26 IS3 W-phase IGBT emitter and FRD anode pin. Input pin of external protection. (“L” active, It doesn't have hysteresis) With the diagnostic output terminal of open drain, a pull-up is carried out by resistance. It turns on at the time of unusual. Unused pin, which is not connected to the chip internally. 7V regulator output pin. Ground pin. U-phase output pin. V-phase output pin. 4 2008-05-16 TPD4125AK Equivalent Circuit of Input Pins Internal circuit diagram of HU, HV, HW, LU, LV, LW input pins 5 kΩ 5 kΩ 200 kΩ HU/HV/HW LU/LV/LW 2 kΩ To internal circuit 6.5 V 6.5 V 6.5 V 6.5 V Internal circuit diagram of SD pin SD 5 kΩ 200 kΩ VREG 5 kΩ 2 kΩ To internal circuit 6.5 V 6.5 V 6.5 V 6.5 V Internal circuit diagram of DIAG pin 1.8 kΩ DIAG To internal circuit 26 V 26 V 5 2008-05-16 TPD4125AK Timing Chart HU HV HW Input Voltage LU LV LW VU Output voltage VV VW 6 2008-05-16 TPD4125AK Truth Table Input Mode Normal Thermal shutdown VCC Under-voltage VBS Under-voltage SD HU HV HW High side LU LV LW SD Low side U phase V phase W phase U phase V phase W phase DIAG H L L L H L H ON OFF OFF OFF ON OFF OFF H L L L L H H ON OFF OFF OFF OFF ON OFF L H L L L H H OFF ON OFF OFF OFF ON OFF L H L H L L H OFF ON OFF ON OFF OFF OFF L L H H L L H OFF OFF ON ON OFF OFF OFF L L H L H L H OFF OFF ON OFF ON OFF OFF H L L L H L H OFF OFF OFF OFF OFF OFF ON H L L L L H H OFF OFF OFF OFF OFF OFF ON L H L L L H H OFF OFF OFF OFF OFF OFF ON L H L H L L H OFF OFF OFF OFF OFF OFF ON L L H H L L H OFF OFF OFF OFF OFF OFF ON L L H L H L H OFF OFF OFF OFF OFF OFF ON H L L L H L H OFF OFF OFF OFF OFF OFF ON H L L L L H H OFF OFF OFF OFF OFF OFF ON L H L L L H H OFF OFF OFF OFF OFF OFF ON L H L H L L H OFF OFF OFF OFF OFF OFF ON L L H H L L H OFF OFF OFF OFF OFF OFF ON L L H L H L H OFF OFF OFF OFF OFF OFF ON H L L L H L H OFF OFF OFF OFF ON OFF OFF H L L L L H H OFF OFF OFF OFF OFF ON OFF L H L L L H H OFF OFF OFF OFF OFF ON OFF L H L H L L H OFF OFF OFF ON OFF OFF OFF L L H H L L H OFF OFF OFF ON OFF OFF OFF L L H L H L H OFF OFF OFF OFF ON OFF OFF * * * * * * L OFF OFF OFF OFF OFF OFF ON 7 2008-05-16 TPD4125AK Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit VBB 500 V VCC 18 V Output current (DC) Iout 3 A Output current (pulse) Ioutp 4 A Input voltage VIN -0.5 to 7 V VREG current IREG 50 mA PC(IGBT) 40 W PC(FRD) 26 W Tjopr -20 to 135 °C Junction temperature Tj 150 °C Storage temperature Tstg -55 to 150 °C Power supply voltage Power dissipation (IGBT 1 phase (Tc = 25°C) ) Power dissipation (FRD1 phase (Tc = 25°C) ) Operating temperature Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristics Thermal resistance, junction to case Thermal resistance, junction to case Symbol Condition Max Unit Rth(j-c) FRD FRD 1 phase drive 4.8 ℃/W Rth(j-c)IGBT IGBT 1 phase drive 3.1 ℃/W 8 2008-05-16 TPD4125AK Electrical Characteristics (Ta = 25°C) Characteristics Operating power supply voltage Current dissipation Input voltage SD input voltage Input current SD Input current Output saturation voltage FRD forward voltage BSD forward voltage Regulator voltage Symbol Test Condition Min Typ. Max VBB ⎯ 50 280 450 VCC ⎯ 13.5 15 16.5 Unit V IBB VBB = 450 V ⎯ ⎯ 0.5 ICC VCC = 15 V ⎯ 0.8 5 IBS (ON) VBS = 15 V, high side ON ⎯ 220 410 IBS (OFF) VBS = 15 V, high side OFF ⎯ 200 370 VIH VIN = “H”, VCC = 15 V 3.5 ⎯ ⎯ VIL VIN = “L” , VCC = 15 V ⎯ ⎯ 1.5 VSD VCC = 15 V ⎯ 2.5 ⎯ IIH VIN = 5 V ⎯ ⎯ 150 IIL VIN = 0 V ⎯ ⎯ 100 ISDH VIN = 5 V ⎯ ⎯ 100 ISDL VIN = 0 V ⎯ ⎯ 150 VCEsatH VCC = 15 V, IC = 1.5 A, high side ⎯ 2.4 3 VCEsatL VCC = 15 V, IC = 1.5 A, low side ⎯ 2.4 3 VFH IF = 1.5 A, high side ⎯ 1.6 2.0 VFL IF = 1.5 A, low side ⎯ 1.6 2.0 IF = 500 μA ⎯ 0.9 1.2 V VCC = 15 V, IO = 30 mA 6.5 7 7.5 V VF (BSD) VREG mA μA V V μA μA V V TSD VCC = 15 V 135 ⎯ 185 °C Thermal shutdown hysteresis ΔTSD VCC = 15 V ⎯ 50 ⎯ °C VCC under voltage protection VCCUVD ⎯ 10 11 12 V VCC under voltage protection recovery VCCUVR ⎯ 10.5 11.5 12.5 V VBS under voltage protection VBSUVD ⎯ 8 9 9.5 V VBS under voltage protection recovery VBSUVR ⎯ 8.5 9.5 10.5 V DIAG saturation voltage VDIAGsat IDIAG = 5 mA ⎯ ⎯ 0.5 V Thermal shutdown temperature Output on delay time ton VBB = 280 V, VCC = 15 V, IC = 1.5 A ⎯ 1.3 3 μs Output off delay time toff VBB = 280 V, VCC = 15 V, IC = 1.5 A ⎯ 1.0 3 μs tdead VBB = 280 V, VCC = 15 V, IC = 1.5 A 1.4 ⎯ ⎯ μs trr VBB = 280 V, VCC = 15 V, IC = 1.5 A ⎯ 200 ⎯ ns Dead time FRD reverse recovery time 9 2008-05-16 TPD4125AK Application Circuit Example 15V VCC 15 + C4 18 21 C5 24 + C6 C7 VREG 13 7V Regulator UnderUnderUndervoltage voltage voltage Protection Protection Protection Undervoltage Protection HU Control IC HV or HW Microcomputer LU LV LW 4 5 6 Input Control 9 Thermal Shutdown BSW VBB C1 C2 C3 C 17 22 25 U M V W Low-side Driver 26 IS3 DIAG 11 R1 BSV High-side Level Shift Driver 7 8 23 BSU 20 IS2 10 SD 19 R2 IS1 R R R 1/16 GND 10 2008-05-16 TPD4125AK External Parts Typical external parts are shown in the following table. Part Typical Purpose Remarks C1, C2, C3 25 V/2.2 μF Bootstrap capacitor (Note 1) C4 25 V/10 μF VCC power supply stability (Note 2) C5 25 V/0.1 μF VCC for surge absorber (Note 2) C6 25 V/1 μF VREG power supply stability (Note 2) C7 25 V/1000 pF VREG for surge absorber (Note 2) R1 5.1 kΩ DIAG pin pull-up resistor (Note 3) R2 10 kΩ SD pin pull-up resistor Note 1: The required bootstrap capacitance value varies according to the motor drive conditions. The capacitor is biased by VCC and must be sufficiently derated for it. Note 2: When using this product, adjustment is required in accordance with the use environment. When mounting, place as close to the base of this product leads as possible to improve the ripple and noise elimination. Note 3: The DIAG pin is open drain. If not using the DIAG pin, connect to the GND. Handling precautions （１） Please control the input signal in the state to which the VCC voltage is steady. Both of the order of the VBB power supply and the VCC power supply are not cared about either. Note that if the power supply is switched off as described above, this product may be destroyed if the current regeneration route to the VBB power supply is blocked when the VBB line is disconnected by a relay or similar while the motor is still running. （２） The excess voltage such as the voltage surge which exceed the maximum rating is added, for example, may destroy the circuit. Accordingly, be careful of handling this product or of surge voltage in its application environment. 11 2008-05-16 TPD4125AK Description of Protection Function (1) Under voltage protection This product incorporates under voltage protection circuits to prevent the IGBT from operating in unsaturated mode when the VCC voltage or the VBS voltage drops. When the VCC power supply falls to this product internal setting VCCUVD (=11 V typ.), all IGBT outputs shut down regardless of the input. This protection function has hysteresis. When the VCC power supply reaches 0.5 V higher than the shutdown voltage (VCCUVR (=11.5 V typ.)), this product is automatically restored and the IGBT is turned on again by the input. DIAG output is reversed at the time of VCC under-voltage protection. When the VCC power supply is less than 7 V, DIAG output isn't sometimes reversed. When the VBS supply voltage drops VBSUVD (=9 V typ.), the high-side IGBT output shuts down. When the VBS supply voltage reaches 0.5 V higher than the shutdown voltage (VBSUVR (=9.5 V typ.)), the IGBT is turned on again by the input signal. (2) Thermal shutdown This product incorporates a thermal shutdown circuit to protect itself against the abnormal state when its temperature rises excessively. When the temperature of this chip rises to the internal setting TSD due to external causes or internal heat generation , all IGBT outputs shut down regardless of the input. This protection function has hysteresis ΔTSD (=50 °C typ.). When the chip temperature falls to TSD − ΔTSD, the chip is automatically restored and the IGBT is turned on again by the input. Because the chip contains just one temperature detection location, when the chip heats up due to the IGBT, for example, the differences in distance from the detection location in the IGBT (the source of the heat) cause differences in the time taken for shutdown to occur. Therefore, the temperature of the chip may rise higher than the thermal shutdown temperature when the circuit started to operate. (3) SD pin SD pin is the input signal pin to shut down the internal output IGBT. Output of all IGBT is shut down after delay times (2 μs typ.)) when "L" signal is inputted to the SD pin from external circuit (MCU etc.). It is possible to shut down IC when overcurrent and others is detected by external circuit. Shut down state is released by all of IC input signal "L". At open state of SD pin, shut down function can not operate. Timing Chart of Under voltage protection and SD Function SD LIN HIN VBS VCC LO ton HO toff ton toff DIAG Note: The above timing chart is considering the delay time. Safe Operating Area Peak winding current (A) 3 2.7 0 0 400 450 Power supply voltage VBB (V) Figure 1 SOA at Tj = 135 °C Note 1: The above safe operating areas are Tj = 135 °C (Figure 1). 12 2008-05-16 TPD4125AK VCEsatH – Tj VCEsatL – Tj 4.25 VCC = 15 V IGBT saturation voltage VCEsatL (V) IGBT saturation voltage VCEsatH (V) 4.25 IC = 2.7A 3.75 IC = 2.1A 3.25 2.75 IC = 1.5A IC = 0.9A 2.25 1.75 −20 20 60 Junction temperature 100 Tj VCC = 15 V 3.25 IC = 2.1A 2.75 IC = 1.5A 2.25 1.75 −20 140 IC = 2.7A 3.75 (°C) IC = 0.9A 20 60 Junction temperature 2.4 IF = 2.7A 2.0 IF = 2.1A 1.6 IF = 1.5A IF = 0.9A 1.2 0.8 −20 20 60 Junction temperature 100 Tj IF = 2.7A 2.0 IF = 2.1A 1.6 IF = 1.5 A 1.2 (°C) IF = 0.9A 20 60 Junction temperature ICC – VCC Tj=25°C Regulator voltage VREG (V) (mA) Tj 140 (°C) Tj=−20°C Tj=25°C Tj=135°C Tj=−20°C Current dissipation ICC 100 VREG – VCC 7.4 Tj=135°C 1.5 1.0 0.5 14 (°C) 2.4 0.8 −20 140 2.0 0 12 Tj 140 VFL – Tj FRD forward voltage VFL (V) FRD forward voltage VFH (V) VFH – Tj 100 16 Control power supply voltage (V) IREG = 30 mA 7.0 6.8 6.6 12 18 VCC 7.2 14 16 Control power supply voltage 13 18 VCC (V) 2008-05-16 TPD4125AK ton – Tj toff – Tj toff (μs) 2.0 1.5 1.0 Output-off delay time Output-on delay time ton (μs) 2.0 VBB = 280 V VCC = 15 V IC = 1.5 A High-side Low-side 0.5 −20 20 60 Junction temperature 100 Tj VBB = 280 V VCC = 15 V IC = 1.5 A 1.5 1.0 0.5 −20 140 High-side Low-side (°C) 20 Junction temperature VCCUV– Tj Tj 140 (°C) 10.5 VCCUVD Under-voltage protection operating voltage VBSUV (V) Under-voltage protection operating voltage VCCUV (V) 100 VBSUV – Tj 12.5 VCCUVR 12.0 11.5 11.0 10.5 10.0 −20 60 20 100 60 Junction temperature Tj VBSUVD VBSUVR 10.0 9.5 9.0 8.5 8.0 −20 140 (°C) 20 60 Junction temperature 14 100 Tj 140 (°C) 2008-05-16 TPD4125AK IBS (ON) – VBS IBS (OFF) – VBS 500 IBS (OFF) (μA) Tj =−20°C Tj =25°C Tj =135°C 400 300 Current dissipation Current dissipation IBS(ON) (μA) 500 200 100 12 14 16 VBS Tj =25°C Tj =135°C 400 300 200 100 12 18 Control power supply Voltage Tj =−20°C (V) 14 16 Control power supply Voltage Wton – Tj 600 18 VBS (V) Wtoff – Tj 120 Wtoff (μJ) IC = 2.7A 500 400 IC = 2.1A 300 Turn-off loss Turn-on loss Wton (μJ) IC = 2.7A IC = 1.5A 200 100 IC = 2.1A 80 60 IC = 1.5A 40 IC = 0.9A IC = 0.9A 100 −20 20 60 Junction temperature 100 Tj 20 −20 140 20 60 Junction temperature (°C) 15 100 Tj 140 (°C) 2008-05-16 16 16 GND ○ 15 VCC ○ 14 NC ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 10 SD ○ 9 LW ○ 8 LV ○ 7 LU ○ 6 HW ○ 5 HV ○ 4 HU ○ 3 NC ○ 2 NC ○ 1 GND ○ 17 U ○ 18 BSU ○ 19 IS1 ○ 20 IS2 ○ 21 BSV ○ 22 V ○ 23 VBB ○ 24 BSW ○ 25 W ○ 26 IS3 ○ 16 GND ○ 15 VCC ○ 14 NC ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 10 SD ○ 9 LW ○ 8 LV ○ 7 LU ○ 6 HW ○ 5 HV ○ 4 HU ○ 3 NC ○ 2 NC ○ 1 GND ○ 17 U ○ 18 BSU ○ 19 IS1 ○ 20 IS2 ○ 21 BSV ○ 22 V ○ 23 VBB ○ 24 BSW ○ 25 W ○ 26 IS3 ○ TPD4125AK Test Circuits IGBT Saturation Voltage (U-phase low side) 1.5A VM HU = 0V HV = 0V HW = 0V LU = 5V LV = 0V LW = 0V VCC = 15V FRD Forward Voltage (U-phase low side) 1.5A VM 2008-05-16 17 16 GND ○ 15 VCC ○ 14 NC ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 10 SD ○ 9 LW ○ 8 LV ○ 7 LU ○ 6 HW ○ 5 HV ○ 4 HU ○ 3 NC ○ 2 NC ○ 1 GND ○ 17 U ○ 18 BSU ○ 19 IS1 ○ 20 IS2 ○ 21 BSV ○ 22 V ○ 23 VBB ○ 24 BSW ○ 25 W ○ 26 IS3 ○ 16 GND ○ 15 VCC ○ 14 NC ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 10 SD ○ 9 LW ○ 8 LV ○ 7 LU ○ 6 HW ○ 5 HV ○ 4 HU ○ 3 NC ○ 2 NC ○ 1 GND ○ 17 U ○ 18 BSU ○ 19 IS1 ○ 20 IS2 ○ 21 BSV ○ 22 V ○ 23 VBB ○ 24 BSW ○ 25 W ○ 26 IS3 ○ TPD4125AK VCC Current Dissipation IM VCC = 15V Regulator Voltage VM 30mA VCC = 15V 2008-05-16 TPD4125AK Output ON/OFF Delay Time (U-phase low side) IM 17 U ○ 16 GND ○ 18 BSU ○ 15 VCC ○ 14 NC ○ 19 IS1 ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 20 IS2 ○ 21 BSV ○ 10 SD ○ 22 V ○ 9 LW ○ 8 LV ○ 7 LU ○ 23 VBB ○ 6 HW ○ 5 HV ○ 24 BSW ○ 4 HU ○ 3 NC ○ 2 NC ○ 25 W ○ 26 IS3 ○ 2.2μF 1 GND ○ U = 280V 187Ω HU = 0V HV = 0V HW = 0V LU = PG LV = 0V LW = 0V VCC = 15V 90% LU = PG 10% 90% 10% IM toff ton 18 2008-05-16 TPD4125AK VCC Under-voltage Protection Operating/Recovery Voltage (U-phase low side) U = 18V 17 U ○ 16 GND ○ 18 BSU ○ 15 VCC ○ 14 NC ○ 19 IS1 ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 20 IS2 ○ 21 BSV ○ 10 SD ○ 22 V ○ 9 LW ○ 7 LU ○ 8 LV ○ 23 VBB ○ 6 HW ○ 5 HV ○ 24 BSW ○ 4 HU ○ 25 W ○ 3 NC ○ 2 NC ○ 1 GND ○ 26 IS3 ○ 2kΩ HU = 0V HV = 0V HW = 0V LU = 5V LV = 0V LW = 0V VCC = 15V → 6V 6V → 15V VM *Note: Sweeps the VCC pin voltage from 15 V and monitors the U pin voltage. The VCC pin voltage when output is off defines the under voltage protection operating voltage. Also sweeps from 6 V to increase. The VCC pin voltage when output is on defines the under voltage protection recovery voltage. VBS Under voltage Protection Operating/Recovery Voltage (U-phase high side) VBB = 18V VM 16 GND ○ 15 VCC ○ 17 U ○ BSU = 15V → 6V 6V → 15V 18 BSU ○ 14 NC ○ 19 IS1 ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 20 IS2 ○ 21 BSV ○ 10 SD ○ 9 LW ○ 22 V ○ 8 LV ○ 7 LU ○ 23 VBB ○ 6 HW ○ 5 HV ○ 24 BSW ○ 4 HU ○ 25 W ○ 3 NC ○ 2 NC ○ 1 GND ○ 26 IS3 ○ 2kΩ HU = 5V HV = 0V HW = 0V LU = 0V LV = 0V LW = 0V VCC = 15V *Note: Sweeps the BSU pin voltage from 15 V to decrease and monitors the VBB pin voltage.The BSU pin voltage when output is off defines the under voltage protection operating voltage.Also sweeps the BSU pin voltage from 6 V to increase and change the HU pin voltage at 5 V→0 V→5 V each time. It repeats similarly output is on. When the BSU pin voltage when output is on defines the under voltage protection recovery voltage. 19 2008-05-16 20 16 GND ○ 15 VCC ○ 14 NC ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 10 SD ○ 9 LW ○ 8 LV ○ 7 LU ○ 6 HW ○ 5 HV ○ 4 HU ○ 3 NC ○ 2 NC ○ 1 GND ○ 17 U ○ 18 BSU ○ 19 IS1 ○ 20 IS2 ○ 21 BSV ○ 22 V ○ 23 VBB ○ 24 BSW ○ 25 W ○ 26 IS3 ○ TPD4125AK VBS Current Dissipation (U-phase high side) IM BSU = 15V HU = 0V/5V HV = 0V HW = 0V LU = 0V LV = 0V LW = 0V VCC = 15V 2008-05-16 TPD4125AK Turn-On/Off Loss (low side IGBT + high side FRD) IM VBB/U = 280V 17 U ○ VM 16 GND ○ 18 BSU ○ 15 VCC ○ 14 NC ○ 19 IS1 ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 20 IS2 ○ 21 BSV ○ 10 SD ○ 22 V ○ 9 LW ○ 8 LV ○ 7 LU ○ 23 VBB ○ 6 HW ○ 5 HV ○ 24 BSW ○ 4 HU ○ 25 W ○ 3 NC ○ 2 NC ○ 1 GND ○ 26 IS3 ○ 5mH L 2.2μF HU = 0V HV = 0V HW = 0V LU = PG LV = 0V LW = 0V VCC = 15V Input (LU = PG) IGBT (C-E Voltage) (U-GND) Power Supply Current Wton Wtoff 21 2008-05-16 TPD4125AK Package Dimensions Unit: mm HDIP26-P-1332-2.00 Weight: 3.8 g (typ.) 22 2008-05-16 TPD4125AK RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. 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Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 23 2008-05-16