TOSHIBA TPD4123AK

TPD4123AK
TOSHIBA Intelligent Power Device
High Voltage Monolithic Silicon Power IC
TPD4123AK
The TPD4123AK is a DC brush less motor driver using high
voltage PWM control. It is fabricated by high voltage SOI process.
It is three-shunt resistor circuit for current sensing. It contains
level shift high-side driver, low-side driver, IGBT outputs, FRDs
and protective functions for under voltage protection circuits and
thermal shutdown circuit. It is easy to control a DC brush less
motor by just putting logic inputs from a MPU or motor controller
to the TPD4123AK.
HDIP26-P-1332-2.00
Weight: 3.8 g (typ.)
Features
•
High voltage power side and low voltage signal side terminal are separated.
•
It is the best for current sensing in three shunt resistance.
•
Bootstrap circuit gives simple high-side supply.
•
Bootstrap diodes are built in.
•
A dead time can be set as a minimum of 1.4μs, and it is the best for a Sine-wave from drive.
•
3-phase bridge output using IGBTs.
•
FRDs are built in.
•
Included under voltage protection and thermal shutdown.
•
The regulator of 7V (typ.) is built in.
•
Package: 26-pin DIP.
This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product, ensure that
the environment is protected against electrostatic discharge.
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2008-05-14
2
GND 16
VCC 15
NC 14
VREG 13
NC 12
DIAG 11
SD 10
LW 9
LV 8
LU 7
HW 6
HV 5
HU 4
NC 3
NC 2
GND 1
17 U
18 BSU
19 IS1
20 IS2
21 BSV
22 V
23 VBB
24 BSW
25 W
26 IS3
TPD4123AK
Pin Assignment
Marking
Lot Code
(Weekly code)
TPD4123AK
TPD4125K
Part No. (or abbreviation code)
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TPD4123AK
Block Diagram
VCC 15
18 BSU
21 BSV
24 BSW
VREG 13
23 VBB
7V
Regulator
UnderUnderUndervoltage
voltage
voltage
Protection Protection Protection
Undervoltage
Protection
High-side Level
Shift Driver
HU
4
HV
5
HW
6
22 V
LU
7
25 W
LV
8
LW
9
Input Control
Thermal Shutdown
17 U
Low-side
Driver
SD 10
26 IS3
DIAG 11
20 IS2
19 IS1
1/16 GND
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TPD4123AK
Pin Description
Pin No.
Symbol
1
GND
2
NC
3
NC
Pin Description
Ground pin.
Unused pin, which is not connected to the chip internally.
Unused pin, which is not connected to the chip internally.
The control terminal of IGBT by the high side of U. It turns off less than 1.5V.
It turns on more than 2.5V.
The control terminal of IGBT by the high side of V. It turns off less than 1.5V.
It turns on more than 2.5V.
The control terminal of IGBT by the high side of W. It turns off less than 1.5V.
It turns on more than 2.5V.
The control terminal of IGBT by the low side of U. It turns off less than 1.5V.
It turns on more than 2.5V.
The control terminal of IGBT by the low side of V. It turns off less than 1.5V.
It turns on more than 2.5V.
The control terminal of IGBT by the low side of W. It turns off less than 1.5V.
It turns on more than 2.5V.
4
HU
5
HV
6
HW
7
LU
8
LV
9
LW
10
SD
11
DIAG
12
NC
13
VREG
14
NC
Unused pin, which is not connected to the chip internally.
15
VCC
Control power supply pin. (15V typ.)
16
GND
17
U
18
BSU
U-phase bootstrap capacitor connecting pin.
19
IS1
U-phase IGBT emitter and FRD anode pin.
20
IS2
V-phase IGBT emitter and FRD anode pin.
21
BSV
V-phase bootstrap capacitor connecting pin.
22
V
23
VBB
High-voltage power supply input pin.
24
BSW
W-phase bootstrap capacitor connecting pin.
25
W
W-phase output pin.
26
IS3
W-phase IGBT emitter and FRD anode pin.
Input pin of external protection. (“L” active, It doesn't have hysteresis)
With the diagnostic output terminal of open drain, a pull-up is carried out by resistance.
It turns on at the time of unusual.
Unused pin, which is not connected to the chip internally.
7V regulator output pin.
Ground pin.
U-phase output pin.
V-phase output pin.
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TPD4123AK
Equivalent Circuit of Input Pins
Internal circuit diagram of HU, HV, HW, LU, LV, LW input pins
2 kΩ
2 kΩ
200 kΩ
HU/HV/HW
LU/LV/LW
2 kΩ
To internal circuit
6.5 V
6.5 V
6.5 V
6.5 V
Internal circuit diagram of SD pin
SD
2 kΩ
200 kΩ
VREG
2 kΩ
2 kΩ
6.5 V
6.5 V
6.5 V
6.5 V
To internal circuit
Internal circuit diagram of DIAG pin
DIAG
To internal circuit
26 V
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TPD4123AK
Timing Chart
HU
HV
HW
Input Voltage
LU
LV
LW
VU
Output voltage VV
VW
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TPD4123AK
Truth Table
Input
High side
Mode
HU
HV
HW
LU
LV
Normal
H
L
L
L
H
L
L
L
L
H
L
L
H
Thermal shutdown
VCC Under-voltage
VBS Under-voltage
SD
Low side
U phase V phase W phase U phase V phase W phase
DIAG
LW
SD
H
L
H
ON
OFF
OFF
OFF
ON
OFF
OFF
L
H
H
ON
OFF
OFF
OFF
OFF
ON
OFF
L
L
H
H
OFF
ON
OFF
OFF
OFF
ON
OFF
L
H
L
L
H
OFF
ON
OFF
ON
OFF
OFF
OFF
L
L
H
H
L
L
H
OFF
OFF
ON
ON
OFF
OFF
OFF
L
L
H
L
H
L
H
OFF
OFF
ON
OFF
ON
OFF
OFF
H
L
L
L
H
L
H
OFF
OFF
OFF
OFF
OFF
OFF
ON
H
L
L
L
L
H
H
OFF
OFF
OFF
OFF
OFF
OFF
ON
L
H
L
L
L
H
H
OFF
OFF
OFF
OFF
OFF
OFF
ON
L
H
L
H
L
L
H
OFF
OFF
OFF
OFF
OFF
OFF
ON
L
L
H
H
L
L
H
OFF
OFF
OFF
OFF
OFF
OFF
ON
L
L
H
L
H
L
H
OFF
OFF
OFF
OFF
OFF
OFF
ON
H
L
L
L
H
L
H
OFF
OFF
OFF
OFF
OFF
OFF
ON
H
L
L
L
L
H
H
OFF
OFF
OFF
OFF
OFF
OFF
ON
L
H
L
L
L
H
H
OFF
OFF
OFF
OFF
OFF
OFF
ON
L
H
L
H
L
L
H
OFF
OFF
OFF
OFF
OFF
OFF
ON
L
L
H
H
L
L
H
OFF
OFF
OFF
OFF
OFF
OFF
ON
L
L
H
L
H
L
H
OFF
OFF
OFF
OFF
OFF
OFF
ON
H
L
L
L
H
L
H
OFF
OFF
OFF
OFF
ON
OFF
OFF
H
L
L
L
L
H
H
OFF
OFF
OFF
OFF
OFF
ON
OFF
L
H
L
L
L
H
H
OFF
OFF
OFF
OFF
OFF
ON
OFF
L
H
L
H
L
L
H
OFF
OFF
OFF
ON
OFF
OFF
OFF
L
L
H
H
L
L
H
OFF
OFF
OFF
ON
OFF
OFF
OFF
L
L
H
L
H
L
H
OFF
OFF
OFF
OFF
ON
OFF
OFF
*
*
*
*
*
*
L
OFF
OFF
OFF
OFF
OFF
OFF
ON
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TPD4123AK
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
VBB
500
V
VCC
18
V
Output current (DC)
IOUT
1
A
Output current (pulse)
Power supply voltage
IOUTp
2
A
Input voltage
VIN
-0.5 to 7
V
VREG current
IREG
50
mA
PC
23
W
Tjopr
-40 to 135
°C
Junction temperature
Tj
150
°C
Storage temperature
Tstg
-55 to 150
°C
Power dissipation (Tc = 25°C)
Operating temperature
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
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TPD4123AK
Electrical Characteristics (Ta = 25°C)
Characteristics
Operating power supply voltage
Current dissipation
Input voltage
SD input voltage
Input current
SD Input current
Output saturation voltage
FRD forward voltage
BSD forward voltage
Regulator voltage
Symbol
Test Condition
Min
Typ.
Max
VBB
⎯
50
280
450
VCC
⎯
13.5
15
16.5
Unit
V
IBB
VBB = 450 V
⎯
⎯
0.5
ICC
VCC = 15 V
⎯
0.9
5
IBS (ON)
VBS = 15 V, high side ON
⎯
230
410
IBS (OFF)
VBS = 15 V, high side OFF
⎯
200
370
VIH
VIN = “H”, VCC = 15 V
2.5
⎯
⎯
VIL
VIN = “L” , VCC = 15 V
⎯
⎯
1.5
VSD
VCC = 15 V
⎯
2.5
⎯
IIH
VIN = 5 V
⎯
⎯
150
IIL
VIN = 0 V
⎯
⎯
100
ISDH
VIN = 5 V
⎯
⎯
100
ISDL
VIN = 0 V
⎯
⎯
150
VCEsatH
VCC = 15 V, IC = 0.5 A, high side
⎯
2.4
3
VCEsatL
VCC = 15 V, IC = 0.5 A, low side
⎯
2.4
3
VFH
IF = 0.5 A, high side
⎯
1.5
2.0
VFL
IF = 0.5 A, low side
⎯
1.5
2.0
IF = 500 μA
⎯
0.9
1.2
V
VCC = 15 V, IO = 30 mA
6.5
7
7.5
V
VF (BSD)
VREG
mA
μA
V
V
μA
μA
V
V
TSD
VCC = 15 V
135
⎯
185
°C
Thermal shutdown hysteresis
ΔTSD
VCC = 15 V
⎯
50
⎯
°C
VCC under voltage protection
VCCUVD
⎯
10
11
12
V
VCC under voltage protection recovery
VCCUVR
⎯
10.5
11.5
12.5
V
VBS under voltage protection
VBSUVD
⎯
8
9
9.5
V
VBS under voltage protection recovery
VBSUVR
⎯
8.5
9.5
10.5
V
DIAG saturation voltage
VDIAGsat
IDIAG = 5 mA
⎯
⎯
0.5
V
Thermal shutdown temperature
Output on delay time
ton
VBB = 280 V, VCC = 15 V, IC = 0.5 A
⎯
1.4
3
μs
Output off delay time
toff
VBB = 280 V, VCC = 15 V, IC = 0.5 A
⎯
1.0
3
μs
tdead
VBB = 280 V, VCC = 15 V, IC = 0.5 A
1.4
⎯
⎯
μs
trr
VBB = 280 V, VCC = 15 V, IC = 0.5 A
⎯
200
⎯
ns
Dead time
FRD reverse recovery time
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TPD4123AK
Application Circuit Example
15V
VCC
15
+
C4
18
21
C5
24
+
C6
C7
VREG
13
7V
Regulator
UnderUnderUndervoltage
voltage
voltage
Protection Protection Protection
Undervoltage
Protection
HU
Control IC
HV
or
HW
Microcomputer
LU
LV
LW
4
5
6
Input Control
9
Thermal
Shutdown
BSW
VBB
C1 C2 C3
C
17
22
25
U
M
V
W
Low-side
Driver
26 IS3
DIAG 11
R1
BSV
High-side
Level Shift
Driver
7
8
23
BSU
20 IS2
10
SD
19
R2
IS1
R
R
R
1/16
GND
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TPD4123AK
External Parts
Typical external parts are shown in the following table.
Part
Typical
Purpose
Remarks
C1, C2, C3
25 V/2.2 μF
Bootstrap capacitor
(Note 1)
C4
25 V/10 μF
VCC power supply stability
(Note 2)
C5
25 V/0.1 μF
VCC for surge absorber
(Note 2)
C6
25 V/1 μF
VREG power supply stability
(Note 2)
C7
25 V/1000 pF
VREG for surge absorber
(Note 2)
R1
5.1 kΩ
DIAG pin pull-up resistor
(Note 3)
R2
10 kΩ
SD pin pull-up resistor
⎯
Note 1: The required bootstrap capacitance value varies according to the motor drive conditions. The capacitor is
biased by VCC and must be sufficiently derated for it.
Note 2: When using this product, adjustment is required in accordance with the use environment. When mounting,
place as close to the base of this product leads as possible to improve the ripple and noise elimination.
Note 3: The DIAG pin is open drain. If not using the DIAG pin, connect to the GND.
Handling precautions
(1)
Please control the input signal in the state to which the VCC voltage is steady. Both of the order of the
VBB power supply and the VCC power supply are not cared about either.
Note that if the power supply is switched off as described above, this product may be destroyed if the
current regeneration route to the VBB power supply is blocked when the VBB line is disconnected by a
relay or similar while the motor is still running.
(2)
The excess voltage such as the voltage surge which exceed the maximum rating is added, for example,
may destroy the circuit. Accordingly, be careful of handling this product or of surge voltage in its
application environment.
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TPD4123AK
Description of Protection Function
(1) Under voltage protection
This product incorporates under voltage protection circuits to prevent the IGBT from operating in
unsaturated mode when the VCC voltage or the VBS voltage drops.
When the VCC power supply falls to this product internal setting VCCUVD (=11 V typ.), all IGBT outputs
shut down regardless of the input. This protection function has hysteresis. When the VCC power supply
reaches 0.5 V higher than the shutdown voltage (VCCUVR (=11.5 V typ.)), this product is automatically
restored and the IGBT is turned on again by the input. DIAG output is reversed at the time of VCC
under-voltage protection. When the VCC power supply is less than 7 V, DIAG output isn't sometimes
reversed.
When the VBS supply voltage drops VBSUVD (=9 V typ.), the high-side IGBT output shuts down.
When the VBS supply voltage reaches 0.5 V higher than the shutdown voltage (VBSUVR (=9.5 V typ.)), the
IGBT is turned on again by the input signal.
(2) Thermal shutdown
This product incorporates a thermal shutdown circuit to protect itself against the abnormal state when its
temperature rises excessively.
When the temperature of this chip rises to the internal setting TSD due to external causes or internal heat
generation, all IGBT outputs shut down regardless of the input. This protection function has hysteresis
ΔTSD (=50°C typ.). When the chip temperature falls to TSD − ΔTSD, the chip is automatically restored and
the IGBT is turned on again by the input.
Because the chip contains just one temperature detection location, when the chip heats up due to the IGBT,
for example, the differences in distance from the detection location in the IGBT (the source of the heat)
cause differences in the time taken for shutdown to occur. Therefore, the temperature of the chip may rise
higher than the thermal shutdown temperature when the circuit started to operate.
(3) SD pin
SD pin is the input signal pin to shut down the internal output IGBT. Output of all IGBT is shuted down after
delay times (2 μs typ.) when "L" signal is inputed to the SD pin from external circuit (MCU etc.). It is
possible to shut down IC when overcurrent and others is detected by external circuit. Shut down state is
released by all of IC input signal "L". At open state of SD pin, shut down function can not operate.
Timing Chart of Under voltage protection and SD Function
SD
LIN
HIN
VBS
VCC
LO
ton
HO
toff
ton
toff
DIAG
Note: The above timing chart is considering the delay time
Peak winding
current (A)
Safe Operating Area
1.0
0
0
450
Power supply voltage VBB (V)
Figure 1
SOA at Tj = 135 °C
Note 1: The above safe operating areas are Tj = 135 °C (Figure 1).
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2008-05-14
TPD4123AK
VCEsatL – Tj
VCEsatL (V)
VCC = 15 V
IC = 700 mA
3.0
IC = 500 mA
2.6
IGBT saturation voltage
IGBT saturation voltage
VCEsatH
(V)
VCEsatH – Tj
3.4
2.2
IC = 300 mA
1.8
1.4
−50
0
50
Junction temperature
100
Tj
3.4
VCC = 15 V
3.0
IC = 500 mA
2.6
2.2
IC = 300 mA
1.8
1.4
−50
150
IC = 700 mA
(°C)
0
50
Junction temperature
VFL (V)
1.8
IF = 700 mA
1.6
IF = 500 mA
1.4
IF = 300 mA
1.2
1.0
−50
0
50
Junction temperature
100
Tj
IF = 700 mA
1.6
IF = 500 mA
1.4
IF = 300 mA
1.2
(°C)
0
50
Junction temperature
ICC – VCC
(mA)
(V)
Tj =25°C
Tj =135°C
VREG
1.5
Regulator voltage
ICC
Tj
150
(°C)
Tj =−40°C
Tj =25°C
Tj =135°C
Tj =−40°C
Current dissipation
100
VREG – VCC
8.0
1.0
0.5
14
(°C)
1.8
1.0
−50
150
2.0
0
12
Tj
150
VFL – Tj
FRD forward voltage
FRD forward voltage
VFH
(V)
VFH – Tj
100
16
Control power supply voltage
(V)
IREG = 30 mA
7.0
6.5
6.0
12
18
VCC
7.5
14
16
Control power supply voltage
13
18
VCC
(V)
2008-05-14
TPD4123AK
ton – Tj
toff – Tj
3.0
(μs)
VBB = 280 V
VCC = 15 V
IC = 0.5 A
2.0
toff
High-side
Low-side
Output-off delay time
Output-on delay time
ton
(μs)
3.0
1.0
0
−50
0
50
Junction temperature
100
Tj
VBB = 280 V
VCC = 15 V
IC = 0.5 A
2.0
1.0
0
−50
150
High-side
Low-side
(°C)
0
Junction temperature
VCCUV – Tj
Tj
150
(°C)
10.5
VCCUVD
Under-voltage protection operating
voltage VBSUV (V)
Under-voltage protection operating
voltage VCCUV (V)
100
VBSUV – Tj
12.5
VCCUVR
12.0
11.5
11.0
10.5
10.0
−50
50
0
50
Junction temperature
100
Tj
VBSUVD
VBSUVR
10.0
9.5
9.0
8.5
8.0
−50
150
(°C)
0
50
Junction temperature
14
100
Tj
150
(°C)
2008-05-14
TPD4123AK
IBS (ON) – VBS
IBS (OFF) – VBS
500
(μA)
Tj =−40°C
Tj =25°C
IBS (OFF)
Tj =135°C
400
300
Current dissipation
Current dissipation
IBS (ON) (μA)
500
200
100
12
14
16
VBS
Tj =25°C
Tj =135°C
400
300
200
100
12
18
Control power supply voltage
Tj =−40°C
(V)
14
VBS
(V)
Wtoff – Tj
Wton – Tj
50
100
IC = 500 mA
IC = 300 mA
50
0
50
Junction temperature
100
Tj
(μJ)
IC = 700 mA
Wtoff
Wton
150
40
30
Turn-off loss
(μJ)
200
Turn-on loss
18
Control power supply voltage
250
0
−50
16
IC = 500 mA
20
IC = 300 mA
10
0
−50
150
IC = 700 mA
0
50
Junction temperature
(°C)
15
100
Tj
150
(°C)
2008-05-14
16
16 GND
○
15 VCC
○
14 NC
○
13 VREG
○
12 NC
○
11 DIAG
○
10 SD
○
9 LW
○
8 LV
○
7 LU
○
6 HW
○
5 HV
○
4 HU
○
3 NC
○
2 NC
○
1 GND
○
17 U
○
18 BSU
○
19 IS1
○
20 IS2
○
21 BSV
○
22 V
○
23 VBB
○
24 BSW
○
25 W
○
26 IS3
○
16 GND
○
15 VCC
○
14 NC
○
13 VREG
○
12 NC
○
11 DIAG
○
10 SD
○
9 LW
○
8 LV
○
7 LU
○
6 HW
○
5 HV
○
4 HU
○
3 NC
○
2 NC
○
1 GND
○
17 U
○
18 BSU
○
19 IS1
○
20 IS2
○
21 BSV
○
22 V
○
23 VBB
○
24 BSW
○
25 W
○
26 IS3
○
TPD4123AK
Test Circuits
IGBT Saturation Voltage (U-phase low side)
0.5A
VM
HU = 0V
HV = 0V
HW = 0V
LU = 5V
LV = 0V
LW = 0V
VCC = 15V
FRD Forward Voltage (U-phase low side)
0.5A
VM
2008-05-14
17
16 GND
○
15 VCC
○
14 NC
○
13 VREG
○
12 NC
○
11 DIAG
○
10 SD
○
9 LW
○
8 LV
○
7 LU
○
6 HW
○
5 HV
○
4 HU
○
3 NC
○
2 NC
○
1 GND
○
17 U
○
18 BSU
○
19 IS1
○
20 IS2
○
21 BSV
○
22 V
○
23 VBB
○
24 BSW
○
25 W
○
26 IS3
○
16 GND
○
15 VCC
○
14 NC
○
13 VREG
○
12 NC
○
11 DIAG
○
10 SD
○
9 LW
○
8 LV
○
7 LU
○
6 HW
○
5 HV
○
4 HU
○
3 NC
○
2 NC
○
1 GND
○
17 U
○
18 BSU
○
19 IS1
○
20 IS2
○
21 BSV
○
22 V
○
23 VBB
○
24 BSW
○
25 W
○
26 IS3
○
TPD4123AK
VCC Current Dissipation
IM
VCC = 15V
Regulator Voltage
VM
30mA
VCC = 15V
2008-05-14
TPD4123AK
Output ON/OFF Delay Time (U-phase low side)
IM
17 U
○
16 GND
○
18 BSU
○
15 VCC
○
14 NC
○
19 IS1
○
13 VREG
○
12 NC
○
11 DIAG
○
20 IS2
○
21 BSV
○
10 SD
○
22 V
○
9 LW
○
8 LV
○
7 LU
○
23 VBB
○
6 HW
○
5 HV
○
24 BSW
○
4 HU
○
3 NC
○
2 NC
○
25 W
○
26 IS3
○
2.2μF
1 GND
○
U = 280V
560Ω
HU = 0V
HV = 0V
HW = 0V
LU = PG
LV = 0V
LW = 0V
VCC = 15V
90%
LU = PG
10%
90%
10%
IM
toff
ton
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2008-05-14
TPD4123AK
VCC Under-voltage Protection Operating/Recovery Voltage (U-phase low side)
U = 18V
17 U
○
16 GND
○
18 BSU
○
15 VCC
○
14 NC
○
19 IS1
○
13 VREG
○
12 NC
○
11 DIAG
○
20 IS2
○
21 BSV
○
10 SD
○
22 V
○
9 LW
○
7 LU
○
8 LV
○
23 VBB
○
6 HW
○
5 HV
○
24 BSW
○
4 HU
○
25 W
○
3 NC
○
2 NC
○
1 GND
○
26 IS3
○
2kΩ
HU = 0V
HV = 0V
HW = 0V
LU = 5V
LV = 0V
LW = 0V
VCC = 15V → 6V
6V → 15V
VM
*Note: Sweeps the VCC pin voltage from 15 V and monitors the U pin voltage.
The VCC pin voltage when output is off defines the under-voltage protection operating voltage.
Also sweeps from 6 V to increase. The VCC pin voltage when output is on defines the under voltage
protection recovery voltage.
VBS Under-voltage Protection Operating/Recovery Voltage (U-phase high side)
VBB = 18V
VM
16 GND
○
15 VCC
○
17 U
○
BSU = 15V → 6V
6V → 15V
18 BSU
○
14 NC
○
19 IS1
○
13 VREG
○
12 NC
○
11 DIAG
○
20 IS2
○
21 BSV
○
10 SD
○
9 LW
○
22 V
○
8 LV
○
7 LU
○
23 VBB
○
6 HW
○
5 HV
○
24 BSW
○
4 HU
○
25 W
○
3 NC
○
2 NC
○
1 GND
○
26 IS3
○
2kΩ
HU = 5V
HV = 0V
HW = 0V
LU = 0V
LV = 0V
LW = 0V
VCC = 15V
*Note: Sweeps the BSU pin voltage from 15 V to decrease and monitors the VBB pin voltage. The BSU pin
voltage when output is off defines the under voltage protection operating voltage. Also sweeps the
BSU pin voltage from 6V to increase and change the HU pin voltage at 5 V→0 V→5 V each time. It
repeats similarly output is on. When the BSU pin voltage when output is on defines the under
voltage protection recovery voltage.
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2008-05-14
20
16 GND
○
15 VCC
○
14 NC
○
13 VREG
○
12 NC
○
11 DIAG
○
10 SD
○
9 LW
○
8 LV
○
7 LU
○
6 HW
○
5 HV
○
4 HU
○
3 NC
○
2 NC
○
1 GND
○
17 U
○
18 BSU
○
19 IS1
○
20 IS2
○
21 BSV
○
22 V
○
23 VBB
○
24 BSW
○
25 W
○
26 IS3
○
TPD4123AK
VBS Current Dissipation (U-phase high side)
IM
BSU = 15V
HU = 0V/5V
HV = 0V
HW = 0V
LU = 0V
LV = 0V
LW = 0V
VCC = 15V
2008-05-14
TPD4123AK
Turn-On/Off Loss (low side IGBT + high side FRD)
IM
VBB/U = 280V
17 U
○
VM
16 GND
○
18 BSU
○
15 VCC
○
14 NC
○
19 IS1
○
13 VREG
○
12 NC
○
11 DIAG
○
20 IS2
○
21 BSV
○
10 SD
○
22 V
○
9 LW
○
8 LV
○
7 LU
○
23 VBB
○
6 HW
○
5 HV
○
24 BSW
○
4 HU
○
25 W
○
3 NC
○
2 NC
○
1 GND
○
26 IS3
○
5mH
L
2.2μF
HU = 0V
HV = 0V
HW = 0V
LU = PG
LV = 0V
LW = 0V
VCC = 15V
Input (LU = PG)
IGBT (C-E Voltage)
(U-GND)
Power Supply Current
Wton
Wtoff
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TPD4123AK
Package Dimensions
HDIP26-P-1332-2.00
Unit : mm
Weight: 3.8 g (typ.)
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2008-05-14
TPD4123AK
RESTRICTIONS ON PRODUCT USE
20070701-EN GENERAL
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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