TPD4135K TOSHIBA Intelligent Power Device High Voltage Monolithic Silicon Power IC TPD4135K The TPD4135K is a DC brush less motor driver using high voltage PWM control. It is fabricated by high voltage SOI process. It is three-shunt resistor circuit for current sensing. It contains level shift high-side driver, low-side driver, IGBT outputs, FRDs and protective functions for over-current circuit and under voltage protection circuits and thermal shutdown circuit. It is easy to control a DC brush less motor by just putting logic inputs from a MPU or motor controller to the TPD4135K. HDIP26-P-1332-2.00 Weight : 3.8 g (typ.) Features • High voltage power side and low voltage signal side terminal are separated. • It is the best for current sensing in three shunt resistance. • Bootstrap circuit gives simple high-side supply. • Bootstrap diodes are built in. • A dead time can be set as a minimum of 1.4 μs, and it is the best for a Sine-wave from drive. • 3-phase bridge output using IGBTs. • FRDs are built in. • Included over-current and under-voltage protection, and thermal shutdown. • The regulator of 7V (typ.) is built in. • Package: 26-pin DIP. This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product, ensure that the environment is protected against electrostatic discharge. 1 2010-09-27 Part No. (or abbreviation code) 2 GND 16 VCC 15 NC 14 VREG 13 NC 12 DIAG 11 RS 10 LW 9 LV 8 LU 7 HW 6 HV 5 HU 4 NC 3 NC 2 GND 1 17 U 18 BSU 19 IS1 20 IS2 21 BSV 22 V 23 VBB 24 BSW 25 W 26 IS3 TPD4135K Pin Assignment Marking Lot Code. (Weekly code) TPD4123K TPD4135K Country of origin 2010-09-27 TPD4135K Block Diagram VCC 15 18 BSU 21 BSV 24 BSW VREG 13 23 VBB 7V Regulator UnderUnderUndervoltage voltage voltage Protection Protection Protection Undervoltage Protection HU 4 HV 5 HW 6 LU 7 LV 8 LW 9 High-side Level Shift Driver Thermal Shutdown 17 U 22 V Input Logic 25 W Low-side Driver 26 IS3 DIAG 11 20 IS2 19 IS1 Over-current protection 10 RS 1/16 GND 3 2010-09-27 TPD4135K Pin Description Pin No. Symbol 1 GND 2 NC 3 NC Pin Description Ground pin. Unused pin, which is not connected to the chip internally. Unused pin, which is not connected to the chip internally. The control terminal of IGBT by the high side of U. It turns off less than 1.5V. It turns on more than 2.5V. The control terminal of IGBT by the high side of V. It turns off less than 1.5V. It turns on more than 2.5V. The control terminal of IGBT by the high side of W. It turns off less than 1.5V. It turns on more than 2.5V. The control terminal of IGBT by the low side of U. It turns off less than 1.5V. It turns on more than 2.5V. The control terminal of IGBT by the low side of V. It turns off less than 1.5V. It turns on more than 2.5V. The control terminal of IGBT by the low side of W. It turns off less than 1.5V. It turns on more than 2.5V. 4 HU 5 HV 6 HW 7 LU 8 LV 9 LW 10 RS 11 DIAG 12 NC 13 VREG 14 NC Unused pin, which is not connected to the chip internally. 15 VCC Control power supply pin.(15V typ.) 16 GND 17 U 18 BSU U-phase bootstrap capacitor connecting pin. 19 IS1 U-phase IGBT emitter and FRD anode pin. 20 IS2 V-phase IGBT emitter and FRD anode pin. 21 BSV V-phase bootstrap capacitor connecting pin. 22 V 23 VBB High-voltage power supply input pin. 24 BSW W-phase bootstrap capacitor connecting pin. 25 W W-phase output pin. 26 IS3 W-phase IGBT emitter and FRD anode pin. Over current detection pin. With the diagnostic output terminal of open drain , a pull-up is carried out by resistance. It turns on at the time of unusual. Unused pin, which is not connected to the chip internally. 7V regulator output pin. Ground pin. U-phase output pin. V-phase output pin. 4 2010-09-27 TPD4135K Equivalent Circuit of Input Pins Internal circuit diagram of HU, HV, HW, LU, LV, LW input pins 2 kΩ 2 kΩ 2 kΩ 200 kΩ HU/HV/HW LU/LV/LW 6.5 V 6.5 V 6.5 V 6.5 V To internal circuit Internal circuit diagram of RS pin VCC RS 4 kΩ 442 kΩ 19.5 V To internal circuit 5 pF Internal circuit diagram of DIAG pin DIAG To internal circuit 26 V 250kΩ 5 2010-09-27 TPD4135K Timing Chart HU HV HW Input Voltage LU LV LW VU Output voltage VV VW 6 2010-09-27 TPD4135K Truth Table Input Mode HU Normal H L H L L H L H L Over-current Thermal shutdown VCC Under-voltage VBS Under-voltage HV HW High side LW Low side U phase V phase W phase U phase V phase W phase DIAG LU LV L L H L ON OFF OFF OFF ON OFF OFF L L L H ON OFF OFF OFF OFF ON OFF L L L H OFF ON OFF OFF OFF ON OFF L H L L OFF ON OFF ON OFF OFF OFF L H H L L OFF OFF ON ON OFF OFF OFF L L H L H L OFF OFF ON OFF ON OFF OFF H L L L H L OFF OFF OFF OFF OFF OFF ON H L L L L H OFF OFF OFF OFF OFF OFF ON L H L L L H OFF OFF OFF OFF OFF OFF ON L H L H L L OFF OFF OFF OFF OFF OFF ON L L H H L L OFF OFF OFF OFF OFF OFF ON L L H L H L OFF OFF OFF OFF OFF OFF ON H L L L H L OFF OFF OFF OFF OFF OFF ON H L L L L H OFF OFF OFF OFF OFF OFF ON L H L L L H OFF OFF OFF OFF OFF OFF ON L H L H L L OFF OFF OFF OFF OFF OFF ON L L H H L L OFF OFF OFF OFF OFF OFF ON L L H L H L OFF OFF OFF OFF OFF OFF ON H L L L H L OFF OFF OFF OFF OFF OFF ON H L L L L H OFF OFF OFF OFF OFF OFF ON L H L L L H OFF OFF OFF OFF OFF OFF ON L H L H L L OFF OFF OFF OFF OFF OFF ON L L H H L L OFF OFF OFF OFF OFF OFF ON L L H L H L OFF OFF OFF OFF OFF OFF ON H L L L H L OFF OFF OFF OFF ON OFF OFF H L L L L H OFF OFF OFF OFF OFF ON OFF L H L L L H OFF OFF OFF OFF OFF ON OFF L H L H L L OFF OFF OFF ON OFF OFF OFF L L H H L L OFF OFF OFF ON OFF OFF OFF L L H L H L OFF OFF OFF OFF ON OFF OFF 7 2010-09-27 TPD4135K Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit VBB 500 V VCC 18 V Output current (DC) Iout 3 A Output current (pulse 1ms) Ioutp 6 A Input voltage VIN -0.5 to 7 V VREG current IREG 50 mA DIAG voltage VDIAG 20 V DIAG current IDIAG 20 mA PC(IGBT) 40 W PC(FRD) 26 W Tjopr -40 to 135 °C Power supply voltage Power dissipation (IGBT 1 phase (Tc = 25°C) ) Power dissipation (FRD1 phase (Tc = 25°C) ) Operating junction temperature Junction temperature Tj 150 °C Storage temperature Tstg -55 to 150 °C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 8 2010-09-27 TPD4135K Electrical Characteristics (Ta = 25°C) Characteristics Operating power supply voltage Current dissipation Bootstrap Current dissipation Input voltage Input current Output saturation voltage FRD forward voltage BSD forward voltage Regulator voltage Symbol Test Condition Min Typ. Max VBB ⎯ 50 280 450 VCC ⎯ 13.5 15 16.5 Unit V IBB VBB = 450 V ⎯ ⎯ 0.5 ICC VCC = 15 V ⎯ 0.8 5 IBS (ON) VBS = 15 V, high side ON ⎯ 200 410 IBS (OFF) VBS = 15 V, high side OFF ⎯ 170 370 VIH VIN = “H”, VCC = 15 V 2.5 ⎯ ⎯ VIL VIN = “L” , VCC = 15 V ⎯ ⎯ 1.5 IIH VIN = 5 V ⎯ ⎯ 150 IIL VIN = 0 V ⎯ ⎯ 100 VCEsatH VCC = 15 V, IC = 1.5 A, high side ⎯ 2.1 2.8 VCEsatL VCC = 15 V, IC = 1.5 A, low side ⎯ 2.1 2.8 VFH IF = 1.5 A, high side ⎯ 1.9 2.8 VFL IF = 1.5 A, low side ⎯ 1.9 2.8 IF = 500 μA ⎯ 0.8 1.2 V VCC = 15 V, IREG = 30 mA 6.5 7 7.5 V VF (BSD) VREG mA μA V μA V V Current limiting voltage VR ⎯ 0.46 0.5 0.54 V Current limiting dead time Dt ⎯ 2.3 3.2 4.4 μs 135 ⎯ 185 °C TSD VCC = 15 V Thermal shutdown hysteresis ΔTSD VCC = 15 V ⎯ 50 ⎯ °C VCC under voltage protection VCCUVD ⎯ 10 11 12 V VCC under voltage protection recovery VCCUVR ⎯ 10.5 11.5 12.5 V VBS under voltage protection VBSUVD ⎯ 8 9 9.5 V VBS under voltage protection recovery VBSUVR ⎯ 8.5 9.5 10.5 V DIAG saturation voltage VDIAGsat IDIAG = 5 mA ⎯ ⎯ 0.5 V Thermal shutdown temperature Output on delay time ton VBB = 280 V, VCC = 15 V, IC = 1.5 A ⎯ 1.8 3 μs Output off delay time toff VBB = 280 V, VCC = 15 V, IC = 1.5 A ⎯ 1.3 3 μs tdead VBB = 280 V, VCC = 15 V, IC = 1.5 A 1.4 ⎯ ⎯ μs trr VBB = 280 V, VCC = 15 V, IC = 1.5 A ⎯ 200 ⎯ ns Dead time FRD reverse recovery time 9 2010-09-27 TPD4135K Application Circuit Example 15V VCC 15 + C4 18 21 C5 24 + C6 C7 VREG 13 7V Regulator UnderUnderUndervoltage voltage voltage Protection Protection Protection Undervoltage Protection HU Control IC HV or HW Microcomputer LU LV LW 5 9 BSW VBB High-side C1 C2 C3 Level Shift Thermal 6 8 BSV Driver 4 7 23 BSU Input Logic Shutdown C 17 22 25 U V M W Low-side Driver 26 IS3 DIAG 11 20 IS2 R2 Over-current protection 10 19 10 IS1 RS 1/16 GND R1 2010-09-27 TPD4135K External Parts Typical external parts are shown in the following table. Part Typical Purpose Remarks C1, C2, C3 25 V/2.2 μF Bootstrap capacitor (Note 1) R1 0.2 Ω ± 1 % (1.5 W) Current detection (Note 2) C4 25 V/10 μF VCC power supply stability (Note 3) C5 25 V /0.1 μF VCC for surge absorber (Note 3) C6 25 V/1 μF VREG power supply stability (Note 3) C7 25 V/1000 pF VREG for surge absorber (Note 3) R2 5.1 kΩ DIAG pull-up resistor (Note 4) Note 1: The required bootstrap capacitance value varies according to the motor drive conditions. The capacitor is biased by VCC and must be sufficiently derated for it. Note 2: The following formula shows the detection current: IO = VR ÷ R1 (For VR = 0.5 V typ.) Do not exceed a detection current of 3 A when using this product. (Please go from the outside in the over current protection.) Note 3: When using this product, adjustment is required in accordance with the use environment. When mounting, place as close to the base of this product leads as possible to improve the ripple and noise elimination. Note 4: The DIAG pin is open drain. If not using the DIAG pin, connect to the GND. Handling precautions （１） Please control the input signal in the state to which the VCC voltage is steady. Both of the order of the VBB power supply and the VCC power supply are not cared about either. Note that if the power supply is switched off as described above, this product may be destroyed if the current regeneration route to the VBB power supply is blocked when the VBB line is disconnected by a relay or similar while the motor is still running. （２） The RS pin connecting the current detection resistor is connected to a comparator in the IC and also functions as a sensor pin for detecting over current. As a result, over voltage caused by a surge voltage, for example, may destroy the circuit. Accordingly, be careful of handling the IC or of surge voltage in its application environment. 11 2010-09-27 TPD4135K Description of Protection Function (1) Over-current protection This product incorporates a over-current protection circuit to protect itself against over-current at startup or when a motor is locked. This protection function detects voltage generated in the current detection resistor connected to the RS pin. When this voltage exceeds VR (=0.5 V typ.), the IGBT output, which is on, temporarily shuts down after a dead time , preventing any additional current from flowing to this product. The next all “L” signal releases the shutdown state. (2) Under voltage protection This product incorporates under voltage protection circuits to prevent the IGBT from operating in unsaturated mode when the VCC voltage or the VBS voltage drops. When the VCC power supply falls to this product internal setting VCCUVD (=11 V typ.), all IGBT outputs shut down regardless of the input. This protection function has hysteresis. When the VCC power supply reaches 0.5 V higher than the shutdown voltage (VCCUVR (=11.5 V typ.)), this product is automatically restored and the IGBT is turned on again by the input. DIAG output is reversed at the time of VCC under-voltage protection. When the VCC power supply is less than 7 V, DIAG output isn't sometimes reversed. When the VBS supply voltage drops VBSUVD (=9 V typ.), the high-side IGBT output shuts down. When the VBS supply voltage reaches 0.5 V higher than the shutdown voltage (VBSUVR (=9.5 V typ.)), the IGBT is turned on again by the input signal. (3) Thermal shutdown This product incorporates a thermal shutdown circuit to protect itself against the abnormal state when its temperature rises excessively. When the temperature of this chip rises to the internal setting TSD due to external causes or internal heat generation , all IGBT outputs shut down regardless of the input. This protection function has hysteresis ΔTSD (=50 °C typ.). When the chip temperature falls to TSD − ΔTSD, the chip is automatically restored and the IGBT is turned on again by the input. Because the chip contains just one temperature detection location, when the chip heats up due to the IGBT, for example, the differences in distance from the detection location in the IGBT (the source of the heat) cause differences in the time taken for shutdown to occur. Therefore, the temperature of the chip may rise higher than the thermal shutdown temperature when the circuit started to operate. Timing Chart of Under voltage protection LIN HIN VBS VCC LO ton HO toff ton toff DIAG Note: The above timing chart is considering the delay time Peak winding current (A) Safe Operating Area 3 2.7 0 400 450 0 Power supply voltage VBB (V) Figure 1 SOA at Tj = 135 °C Note 1: The above safe operating areas are Tj = 135 °C (Figure 1). 12 2010-09-27 TPD4135K VCEsatL – Tj VCEsatL (V) VCC = 15 V IC = 2.7A 3.0 IC = 2.1A 2.6 IGBT saturation voltage IGBT saturation voltage VCEsatH (V) VCEsatH – Tj 3.4 2.2 IC = 1.5A 1.8 1.4 −50 IC = 0.9A 0 50 Junction temperature 100 Tj 150 3.4 VCC = 15 V IC = 2.7A 3.0 IC = 2.1A 2.6 2.2 IC = 1.5A 1.8 1.4 −50 (°C) IC = 0.9A 0 50 Junction temperature VFL (V) 2.8 2.4 IF = 2.7A IF = 2.1A 2.0 IF = 1.5A 1.6 1.2 −50 IF = 0.9A 0 50 Junction temperature 100 Tj 2.4 IF = 2.7A IF = 2.1A 2.0 IF = 1.5 A 1.6 (°C) IF = 0.9A 0 50 Junction temperature ICC – VCC (V) Tj =25°C Tj =135°C VREG 1.5 Regulator voltage ICC (mA) Tj =−40°C Current dissipation 100 Tj 150 (°C) VREG – VCC 8.0 1.0 0.5 14 (°C) 2.8 1.2 −50 150 2.0 0 12 Tj 150 VFL – Tj FRD forward voltage FRD forward voltage VFH (V) VFH – Tj 100 16 Control power supply voltage (V) IREG = 30 mA 7.0 6.5 6.0 12 18 VCC 7.5 Tj =−40°C Tj =25°C Tj =135°C 14 16 Control power supply voltage 13 18 VCC (V) 2010-09-27 TPD4135K ton – Tj 3.0 Output-off delay time toff (μs) VBB = 280 V VCC = 15 V IC = 1.5 A (μs) ton Output-on delay time toff – Tj 3.0 High-side Low-side 2.0 1.0 0 −50 0 50 Junction temperature 100 Tj VBB = 280 V VCC = 15 V IC = 1.5 A High-side Low-side 2.0 1.0 0 −50 150 (°C) 0 Junction temperature VCCUV – Tj Tj 150 (°C) VBSUV – Tj VCCUVD Under-voltage protection operating voltage VBSUV (V) Under-voltage protection operating voltage VCCUV (V) 100 10.5 12.5 VCCUVR 12.0 VBSUVD VBSUVR 10.0 11.5 11.0 10.5 10.0 −50 0 50 Junction temperature 100 Tj 9.5 9.0 8.5 8.0 −50 150 (°C) 0 50 Junction temperature VR – Tj 100 Tj 150 (°C) Dt– Tj 6.0 (μs) 1.0 0.8 0.6 0.4 0.2 0 −50 VCC = 15 V Dt VCC = 15 V Current limiting dead time Current control operating voltage VR (V) 50 0 50 Junction temperature 100 Tj 4.0 2.0 0 −50 150 (°C) 0 50 Junction temperature 14 100 Tj 150 (°C) 2010-09-27 TPD4135K IBS (ON) – VBS IBS (OFF) – VBS 500 500 400 300 200 100 12 14 16 Bootstrap Voltage Tj =−40°C (μA) Tj =135°C Bootstrap Current dissipation IBS (OFF) Bootstrap Current dissipation IBS (ON) (μA) Tj =−40°C Tj =25°C Tj =25°C Tj =135°C 400 300 200 100 12 18 VBS (V) 14 Bootstrap Voltage VBS (V) 200 (μJ) 500 Wtoff IC = 2.7A 400 Turn-off loss (μJ) Wton Turn-on loss 18 Wtoff – Tj Wton – Tj 600 IC = 2.1A 300 200 100 −50 16 IC = 1.5A IC = 0.9A 0 50 Junction temperature 100 Tj 160 IC = 2.7A 120 IC = 2.1A 80 IC = 1.5A 40 0 −50 150 IC = 0.9A 0 50 Junction temperature (°C) 15 100 Tj 150 (°C) 2010-09-27 16 16 GND ○ 15 VCC ○ 14 NC ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 10 RS ○ 9 LW ○ 8 LV ○ 7 LU ○ 6 HW ○ 5 HV ○ 4 HU ○ 3 NC ○ 2 NC ○ 1 GND ○ 17 U ○ 18 BSU ○ 19 IS1 ○ 20 IS2 ○ 21 BSV ○ 22 V ○ 23 VBB ○ 24 BSW ○ 25 W ○ 26 IS3 ○ 16 GND ○ 15 VCC ○ 14 NC ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 10 RS ○ 9 LW ○ 8 LV ○ 7 LU ○ 6 HW ○ 5 HV ○ 4 HU ○ 3 NC ○ 2 NC ○ 1 GND ○ 17 U ○ 18 BSU ○ 19 IS1 ○ 20 IS2 ○ 21 BSV ○ 22 V ○ 23 VBB ○ 24 BSW ○ 25 W ○ 26 IS3 ○ TPD4135K Test Circuits IGBT Saturation Voltage (U-phase low side) 1.5A VM HU = 0V HV = 0V HW = 0V LU = 5V LV = 0V LW = 0V VCC = 15V FRD Forward Voltage (U-phase low side) 1.5A VM 2010-09-27 17 16 GND ○ 15 VCC ○ 14 NC ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 10 RS ○ 9 LW ○ 8 LV ○ 7 LU ○ 6 HW ○ 5 HV ○ 4 HU ○ 3 NC ○ 2 NC ○ 1 GND ○ 17 U ○ 18 BSU ○ 19 IS1 ○ 20 IS2 ○ 21 BSV ○ 22 V ○ 23 VBB ○ 24 BSW ○ 25 W ○ 26 IS3 ○ 16 GND ○ 15 VCC ○ 14 NC ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 10 RS ○ 9 LW ○ 8 LV ○ 7 LU ○ 6 HW ○ 5 HV ○ 4 HU ○ 3 NC ○ 2 NC ○ 1 GND ○ 17 U ○ 18 BSU ○ 19 IS1 ○ 20 IS2 ○ 21 BSV ○ 22 V ○ 23 VBB ○ 24 BSW ○ 25 W ○ 26 IS3 ○ TPD4135K VCC Current Dissipation IM VCC = 15V Regulator Voltage VM 30mA VCC = 15V 2010-09-27 TPD4135K Output ON/OFF Delay Time (U-phase low side) IM 17 U ○ 16 GND ○ 18 BSU ○ 15 VCC ○ 14 NC ○ 19 IS1 ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 20 IS2 ○ 21 BSV ○ 10 RS ○ 22 V ○ 9 LW ○ 8 LV ○ 7 LU ○ 23 VBB ○ 6 HW ○ 5 HV ○ 24 BSW ○ 4 HU ○ 3 NC ○ 2 NC ○ 25 W ○ 26 IS3 ○ 2.2μF 1 GND ○ U = 280V 187Ω HU = 0V HV = 0V HW = 0V LU = PG LV = 0V LW = 0V VCC = 15V 90% 5V LU = PG 10% 90% 10% IM toff ton 18 2010-09-27 TPD4135K VCC Under-voltage Protection Operating/Recovery Voltage (U-phase low side) U = 18V 17 U ○ 16 GND ○ 18 BSU ○ 15 VCC ○ 14 NC ○ 19 IS1 ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 20 IS2 ○ 21 BSV ○ 10 RS ○ 22 V ○ 9 LW ○ 8 LV ○ 23 VBB ○ 7 LU ○ 6 HW ○ 5 HV ○ 24 BSW ○ 4 HU ○ 25 W ○ 3 NC ○ 2 NC ○ 1 GND ○ 26 IS3 ○ 2kΩ HU = 0V HV = 0V HW = 0V LU = 5V LV = 0V LW = 0V VCC = 15V → 6V 6V → 15V VM *Note: Sweeps the VCC pin voltage from 15 V and monitors the U pin voltage. The VCC pin voltage when output is off defines the under-voltage protection operating voltage. Also sweeps from 6 V to increase. The VCC pin voltage when output is on defines the under voltage protection recovery voltage. VBS Under-voltage Protection Operating/Recovery Voltage (U-phase high side) VBB = 18V VM 16 GND ○ 15 VCC ○ 17 U ○ BSU = 15V → 6V 6V → 15V 18 BSU ○ 14 NC ○ 19 IS1 ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 20 IS2 ○ 21 BSV ○ 10 RS ○ 9 LW ○ 22 V ○ 8 LV ○ 7 LU ○ 23 VBB ○ 6 HW ○ 5 HV ○ 24 BSW ○ 4 HU ○ 25 W ○ 3 NC ○ 2 NC ○ 1 GND ○ 26 IS3 ○ 2kΩ HU = 5V HV = 0V HW = 0V LU = 0V LV = 0V LW = 0V VCC = 15V *Note: Sweeps the BSU pin voltage from 15 V to decrease and monitors the VBB pin voltage. The BSU pin voltage when output is off defines the under voltage protection operating voltage. Also sweeps the BSU pin voltage from 6V to increase and change the HU pin voltage at 5 V→0 V→5 V each time. It repeats similarly output is on. When the BSU pin voltage when output is on defines the under voltage protection recovery voltage. 19 2010-09-27 TPD4135K Current Control Operating Voltage (U-phase high side) VBB = 18V 17 U ○ 2kΩ 16 GND ○ 18 BSU ○ 15 VCC ○ 14 NC ○ 19 IS1 ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 20 IS2 ○ 21 BSV ○ 10 RS ○ 22 V ○ 9 LW ○ 8 LV ○ 7 LU ○ 23 VBB ○ 6 HW ○ 5 HV ○ 24 BSW ○ 4 HU ○ 25 W ○ 3 NC ○ 2 NC ○ 1 GND ○ 26 IS3 ○ 15V HU = 5V HV = 0V HW = 0V LU = 0V LV = 0V LW = 0V VCC = 15V IS/RS = 0V → 0.6V VM * Note: Sweeps the IS/RS pin voltage and monitors the U pin voltage. The IS/RS pin voltage when output is off defines the current control operating voltage. Bootstrap Current Dissipation (U-phase high side) 17 U ○ BSU = 15V 16 GND ○ 15 VCC ○ 18 BSU ○ 14 NC ○ 19 IS1 ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 20 IS2 ○ 21 BSV ○ 10 RS ○ 9 LW ○ 22 V ○ 8 LV ○ 7 LU ○ 23 VBB ○ 6 HW ○ 5 HV ○ 24 BSW ○ 4 HU ○ 25 W ○ 3 NC ○ 2 NC ○ 1 GND ○ 26 IS3 ○ IM HU = 0V/5V HV = 0V HW = 0V LU = 0V LV = 0V LW = 0V VCC = 15V 20 2010-09-27 TPD4135K Turn-On/Off Loss (low side IGBT + high side FRD) IM VBB/U = 280V 17 U ○ VM 16 GND ○ 18 BSU ○ 15 VCC ○ 14 NC ○ 19 IS1 ○ 13 VREG ○ 12 NC ○ 11 DIAG ○ 20 IS2 ○ 21 BSV ○ 10 RS ○ 22 V ○ 9 LW ○ 8 LV ○ 7 LU ○ 23 VBB ○ 6 HW ○ 5 HV ○ 24 BSW ○ 4 HU ○ 25 W ○ 3 NC ○ 2 NC ○ 1 GND ○ 26 IS3 ○ 5mH L 2.2μF HU = 0V HV = 0V HW = 0V LU = PG LV = 0V LW = 0V VCC = 15V Input (LU = PG) IGBT (C-E Voltage) (U-GND) Power Supply Current Wtoff Wton 21 2010-09-27 TPD4135K Package Dimensions HDIP26-P-1332-2.00 Unit : mm Weight: 3.8 g (typ.) 22 2010-09-27 TPD4135K RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application with which the Product will be used with or for. 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Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 23 2010-09-27