VISHAY BF966SA

BF966S
Vishay Semiconductors
N-Channel Dual Gate MOS-Fieldeffect Tetrode, Depletion Mode
3
Features
•
•
•
•
•
•
•
•
4
Integrated gate protection diodes
High cross modulation performance
e3
Low noise figure
High AGC-range
Low feedback capacitance
Low input capacitance
Lead (Pb)-free component
Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
2
1
G2
D
G1
S
Electrostatic sensitive device.
Observe precautions for handling.
Applications
Mechanical Data
Input- and mixer stages especially UHF-tuners.
Case: TO-50 Plastic case
Weight: approx. 124 mg
Marking: BF966S
Pinning:
1 = Drain, 2 = Source,
3 = Gate 1, 4 = Gate 2
13625
Parts Table
Part
Ordering Ccode
Marking
Package
BF966S
BF966SA or BF966SB
BF966S
TO50
BF966SA
BF966SA
BF966S
TO50
BF966SB
BF966SB
BF966S
TO50
Absolute Maximum Ratings
Tamb = 25 °C, unless otherwise specified
Parameter
Test condition
Drain - source voltage
Drain current
Gate 1/Gate 2 - source peak
current
Total power dissipation
Tamb ≤ 60 °C
Symbol
Value
Unit
VDS
20
V
ID
30
mA
± IG1/G2SM
10
mA
mW
Ptot
200
Channel temperature
TCh
150
°C
Storage temperature range
Tstg
- 55 to + 150
°C
Symbol
Value
Unit
RthChA
450
K/W
Maximum Thermal Resistance
Parameter
Channel ambient
1)
Test condition
1)
on glass fibre printed board (40 x 25 x 1.5) mm3 plated with 35 µm Cu
Document Number 85004
Rev. 1.5, 15-Apr-05
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1
BF966S
Vishay Semiconductors
Electrical DC Characteristics
Tamb = 25 °C, unless otherwise specified
Symbol
Min
Drain - source breakdown
voltage
Parameter
ID = 10 µA, - VG1S = - VG2S = 4 V
Test condition
Part
V(BR)DS
20
Typ.
Max
Unit
Gate 1 - source breakdown
voltage
± IG1S = 10 mA, VG2S = VDS = 0
± V(BR)G1SS
8
14
V
Gate 2 - source breakdown
voltage
± IG2S = 10 mA, VG1S = VDS = 0
± V(BR)G2SS
8
14
V
V
Gate 1 - source leakage current ± VG1S = 5 V, VG2S = VDS = 0
± IG1SS
50
nA
Gate 2 - source leakage current ± VG2S = 5 V, VG1S = VDS = 0
± IG2SS
50
nA
Drain current
VDS = 15 V, VG1S = 0, VG2S = 4 V BF966S
BF966SA
BF966SB
IDSS
4
18
mA
IDSS
4
10.5
mA
IDSS
9.5
18
mA
Gate 1 - source cut-off voltage
VDS = 15 V, VG2S = 4 V,
ID = 20 µA
-VG1S(OFF)
2.5
V
Gate 2 - source cut-off voltage
VDS = 15 V, VG1S = 0, ID = 20 µA
-VG2S(OFF)
2.0
V
Electrical AC Characteristics
Tamb = 25 °C, unless otherwise specified
VDS = 15 V, ID = 10 mA, VG2S = 4 V, f = 1 MHz
Parameter
Test condition
Forward transadmittance
Gate 1 input capacitance
Gate 2 input capacitance
VG1S = 0, VG2S = 4 V
Symbol
Min
Typ.
| y21s |
15
18.5
Cissg1
2.2
Cissg2
1.1
Max
Unit
mS
2.6
pF
pF
Feedback capacitance
Crss
25
35
fF
Output capacitance
Coss
0.8
1.2
pF
GS = 2 mS, GL = 0.5 mS,
f = 200 MHz
Gps
25
dB
GS = 3,3 mS, GL = 1 mS,
f = 800 MHz
Gps
18
dB
Power gain
∆Gps
AGC range
VG2S = 4 to -2 V, f = 800 MHz
Noise figure
GS = 2 mS, GL = 0.5 mS,
f = 200 MHz
F
1.0
dB
GS = 3,3 mS, GL = 1 mS,
f = 800 MHz
F
1.8
dB
40
dB
300
36
200
150
100
50
0
1.5 V
1V
28
V G2S = 4 V
24
0.5 V
20
16
0V
12
8
–0.5 V
4
–1 V
0
0
96 12159
20
40
60
80
100 120 140 160
Tamb - Ambient Temperature ( °C )
Figure 1. Total Power Dissipation vs. Ambient Temperature
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2
V G1S = 2 V
32
250
ID – Drain Current ( mA )
Ptot -Total Power Dissipation ( mW )
Typical Characteristics (Tamb = 25 °C unless otherwise specified)
0
12762
2
4
6
8 10 12 14 16
V DS – Drain Source Voltage ( V )
Figure 2. Drain Current vs. Drain Source Voltage
Document Number 85004
Rev. 1.5, 15-Apr-05
BF966S
Vishay Semiconductors
ID – Drain Current ( mA )
90
V DS = 15 V
80
V G2S = 6 V
5V
70
4V
60
50
3V
40
2V
30
1V
20
0V
–1 V
10
0
–1
0
1
2
3
4
5
V G1S – Gate 1 Source Voltage ( V )
12763
60
3V
50
2V
40
1V
30
20
0V
10
–1 V
0
–1
0
1
2
3
4
5
V G2S – Gate 2 Source Voltage ( V )
12764
1.00
0.75
0.50
0.25
0
2
12766
4 6 8 10 12 14 16 18 20
V DS – Drain Source Voltage ( V )
Figure 6. Output Capacitance vs. Drain Source Voltage
4.0
3.6 V DS = 15 V
V G1S = 0
3.2
f = 1 MHz
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
–3
12767
–2
–1 0
1 2
3 4
5
6
V G2S – Gate 2 Source Voltage ( V )
Figure 7. Gate 2 Input Capacitance vs. Gate 2 Source Voltage
10
4.0
V DS = 15 V
VG2S = 4 V
f = 1 MHz
3.5
3.0
2.5
2.0
–10
1.0
0.5
–20
0V
–30
–0.5 V
–40
–1 V
–60
V G2S = –2...–3 V
–70
0.0
0
3
6
12765
9 12 15 18 21 24 27 30
I D – Drain Current ( mA )
Figure 5. Gate 1 Input Capacitance vs. Drain Current
Document Number 85004
Rev. 1.5, 15-Apr-05
4V
3V
2V
1V
–50
2
1.5
f = 200 MHz
0
S 21
Cissg1 – Gate 1 Input Capacitance ( pF )
Figure 4. Drain Current vs. Gate 2 Source Voltage
1.25
Cissg2 – Gate 2 Input Capacitance ( pF )
V DS = 15 V
V G1S = 4 V
VG2S = 4 V
I D = 10 mA
f = 1 MHz
1.50
–Transducer Gain( dB )
ID – Drain Current ( mA )
70
1.75
0.00
Figure 3. Drain Current vs. Gate 1 Source Voltage
80
2.00
Coss – Output Capacitance ( pF )
100
–5
12768
–4 –3 –2 –1
0
1
2
3
V G1S – Gate 1 Source Voltage ( V )
Figure 8. Transducer Gain vs. Gate 1 Source Voltage
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3
BF966S
24
22
20
18
16
14
12
10
8
6
4
2
0
5
V G2S = 4 V
V DS = 15 V
f = 1 MHz
–5
3V
2V
–10
–15
400 MHz
–20
700 MHz
–25
1V
0V
f = 100 MHz
I D = 5 mA
10 mA
20 mA
1000 MHz
–30
1300 MHz
–35
0.5 V
–40
0
5
10
15
20
25
I D – Drain Current ( mA )
12769
–8
30
20
1000 MHz
I D = 20 mA
12
700 MHz
8
400 MHz
6
4
2
V DS = 15 V
V G2S = 4 V
f = 100...1300 MHz
2
4
6
8 10 12 14 16 18 20
Re (y11) ( mS )
Figure 10. Short Circuit Input Admittance
1000 MHz
5
700 MHz
4
3
400 MHz
1
100 MHz
0
20 mA
I D= 5 mA
2
0
12770
24
I D = 10 mA
6
Im ( y22) ( mS )
14
20
f = 1300 MHz
7
I D = 10 mA
10
4
8
12 16
Re (y21 ) ( mS )
8
I D = 5 mA
16
0
Figure 12. Short Circuit Forward Transfer Admittance
f = 1300 MHz
18
–4
12771
Figure 9. Forward Transadmittance vs. Drain Current
Im ( y11 ) ( mS )
V DS = 15 V
V G2S = 4 V
f = 100...1300 MHz
0
Im ( y21) ( mS )
Y21S – ForwardTransadmittance ( mS )
Vishay Semiconductors
100 MHz
0
0.0
12773
0.5
V DS = 15 V
V G2S = 4 V
f =1 00...1300 MHz
1.0
1.5
2.0
Re (y22) ( mS )
2.5
Figure 13. Short Circuit Output Admittance
0.3
f = 1300 MHz
Im ( y12 ) ( mS )
0.2
0.1
I D = 5 mA
10 mA
20 mA
1000 MHz
0.0
700 MHz
–0.1
0.0
12772
0.1
V DS = 15 V
V G2S = 4 V
f = 100...1300 MHz
0.2
0.3
0.4
Re (y12) ( mS )
0.5
Figure 11. Short Circuit Reverse Transfer Admittance
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Document Number 85004
Rev. 1.5, 15-Apr-05
BF966S
Vishay Semiconductors
VDS = 15 V, ID = 5 to 20 mA, VG2S = 4 V, Z0 = 50 Ω
S11
S12
90 °
j
120 °
j0.5
j0.2
150 °
ID= 20 mA 1300 MHz
ID= 10 mA
1000
ID= 5 mA
j5
0
0.2
0.5
1
2
5
100
1300 MHz
–j0.2
60 °
j2
∞
ı
400
100
180 °
0.008 0.016 0 °
–j5
400
–150 °
1000 700
–j0.5
30 °
–30 °
–j2
–120 °
12924
–j
–60 °
–90 °
12925
Figure 16. Reverse Transmission Coefficient
Figure 14. Input Reflection Coefficient
S21
S22
ID= 20 mA
ID= 10 mA
ID= 5 mA
90°
120 °
400
j
60 °
700
j0.5
1000
150 °
j2
30 °
j0.2
j5
1300 MHz
100
180°
0.8
1.6
0°
0
0.5
1
Figure 15. Forward Transmission Coefficient
Rev. 1.5, 15-Apr-05
–j5
1300 MHz
–j2
–60°
–90 °
Document Number 85004
ı
5 100 ∞
700
–j0.5
–120°
12926
2
–j0.2
–30°
–150 °
0.2
12927
–j
Figure 17. Output Reflection Coefficient
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5
BF966S
Vishay Semiconductors
Package Dimensions in mm
96 12242
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6
Document Number 85004
Rev. 1.5, 15-Apr-05
BF966S
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 85004
Rev. 1.5, 15-Apr-05
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7
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000
Revision: 08-Apr-05
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1