MICROCHIP TC1413CPA

TC1413/TC1413N
3A High-Speed MOSFET Drivers
Features
General Description
• Latch-Up Protected: Will Withstand 500 mA
Reverse Current
• Input Will Withstand Negative Inputs Up to 5V
• ESD Protected: 4 kV
• High Peak Output Current: 3A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 16V
• High Capacitive Load Drive Capability:
- 1800 pF in 20 nsec
• Short Delay Time: 35 nsec Typ
• Matched Delay Times
• Low Supply Current
- With Logic ‘1’ Input: 500 µA
- With Logic ‘0’ Input: 100 µA
• Low Output Impedance: 2.7
• Available in Space-Saving 8-pin MSOP Package
• Pinout Same as TC1410/TC1411/TC1412
The TC1413/TC1413N are 3A CMOS buffers/drivers.
They will not latch-up under any conditions within their
power and voltage ratings. They are not subject to
damage when up to 5V of noise spiking of either
polarity occurs on the ground pin. They can accept,
without damage or logic upset, up to 500 mA of current
of either polarity being forced back into their output. All
terminals are fully protected against up to 4 kV of
electrostatic discharge.
As MOSFET drivers, the TC1413/TC1413N can easily
charge an 1800 pF gate capacitance in 20 nsec with
matched rise and fall times, and provide low enough
impedance in both the ON and the OFF states to
ensure the MOSFET’s intended state will not be
affected, even by large transients. The leading and
trailing edge propagation delay times are also matched
to allow driving short-duration inputs with greater
accuracy.
Applications
•
•
•
•
Switch Mode Power Supplies
Line Drivers
Pulse Transformer Drive
Relay Driver
Package Type
8-Pin MSOP/PDIP/SOIC
VDD 1
8 VDD
VDD 1
IN 2
OUT
TC1413 7
IN 2
NC 3
6 OUT
NC 3
GND 4
5 GND
GND 4
2
6,7
Inverting
8 VDD
TC1413N
7 OUT
6 OUT
5 GND
2
6,7
Non-Inverting
NC = No Internal Connection
NOTE: Duplicate pins must be connected together
for proper operation.
 2001-2012 Microchip Technology Inc.
DS21392D-page 1
TC1413/TC1413N
Functional Block Diagram
TC1413
VDD
Inverting
Outputs
300 mV
Output
Non-Inverting
Outputs
Input
Effective
Input C = 10 pF
4.7V
TC1413N
GND
DS21392D-page 2
 2001-2012 Microchip Technology Inc.
TC1413/TC1413N
1.0
ELECTRICAL
CHARACTERISTICS
PIN FUNCTION TABLE
Symbol
Absolute Maximum Ratings†
Description
VDD
Supply input, 4.5V to 16V
Control input
INPUT
Supply Voltage ..................................................... +20V
Input Voltage ...................... VDD + 0.3V to GND – 5.0V
Power Dissipation (TA 70°C)
MSOP .......................................................... 340 mW
PDIP ............................................................ 730 mW
SOIC............................................................ 470 mW
Storage Temperature Range.............. -65°C to +150°C
Maximum Junction Temperature ...................... +150ºC
NC
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
No connection
GND
Ground
GND
Ground
OUTPUT
CMOS push-pull output,
common to pin 7
OUTPUT
CMOS push-pull output,
common to pin 6
Supply input, 4.5V to 16V
VDD
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD16V.
Typical values are measured at TA = +25°C, VDD= 16V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Logic ‘1’, High Input Voltage
VIH
2.0
—
—
V
Logic ‘0’, Low Input Voltage
VIL
—
—
0.8
V
Input Current
IIN
-1.0
—
1.0
µA
-10
—
10
VOH
VDD – 0.025
—
—
V
DC Test
Low Output Voltage
VOL
—
—
0.025
V
DC Test
Output Resistance
RO
—
2.7
4.0

VDD = 16V, IO = 10 mA, TA = +25°C
—
3.3
5.0
0°CTA+70°C
—
3.3
5.0
-40°CTA+85°C
Input
0VVINVDD, TA = +25°C
-40°CTA+85°C
Output
High Output Voltage
Peak Output Current
IPK
—
3.0
—
A
VDD = 16V
Latch-Up Protection
Withstand Reverse Current
IREV
—
0.5
—
A
Duty cycle2%, t 300 µsec,
VDD = 16V
tR
—
20
28
—
22
33
—
24
33
—
20
28
Switching Time (Note 1)
Rise Time
Fall Time
Note 1:
tF
nsec TA = +25°C
0°CTA+70°C
-40°CTA+85°C, Figure 4-1
nsec TA = +25°C
—
22
33
0°CTA+70°C
—
24
33
-40°CTA+85°C, Figure 4-1
Switching times ensured by design.
 2001-2012 Microchip Technology Inc.
DS21392D-page 3
TC1413/TC1413N
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD16V.
Typical values are measured at TA = +25°C, VDD= 16V.
Parameters
Delay Time
Delay Time
Sym
Min
Typ
Max
tD1
—
35
45
tD2
Units
Conditions
nsec TA = +25°C,
—
40
50
0°CTA+70°C
—
40
50
-40°CTA+85°C, Figure 4-1
—
35
45
—
40
50
0°CTA+70°C
—
40
50
-40°CTA+85°C, Figure 4-1
nsec TA = +25°C
Power Supply
Power Supply Current
Note 1:
IS
—
0.5
1.0
—
0.1
0.15
mA
VIN = 3V, VDD = 16V
VIN = 0V
Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V  VDD  18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range (C)
TA
0
—
+70
ºC
Specified Temperature Range (E)
TA
-40
—
+85
ºC
Maximum Junction Temperature
TJ
—
—
+150
ºC
Storage Temperature Range
TA
-65
—
+150
ºC
Thermal Resistance, 8L-MSOP
JA
—
206
—
ºC/W
Thermal Resistance, 8L-PDIP
JA
—
125
—
ºC/W
Thermal Resistance, 8L-SOIC
JA
—
155
—
ºC/W
Package Thermal Resistances
DS21392D-page 4
 2001-2012 Microchip Technology Inc.
TC1413/TC1413N
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD16V.
500
500
TA = +25°C
VSUPPLY = 16V
VIN = 3V
400
VIN = 3V
ISUPPLY (µA)
ISUPPLY (µA)
400
300
200
100
0
300
200
100
VIN = 0V
0
4
6
8
10
12
14
16
VIN = 0V
-40
-20
0
VDD (V)
FIGURE 2-1:
Quiescent Supply Current
vs. Supply Voltage.
FIGURE 2-4:
vs. Temperature.
1.6
1.6
TA = +25°C
40
60
80
Quiescent Supply Current
VSUPPLY = 16V
1.5
VIH
VTHRESHOLD (V)
VTHRESHOLD (V)
1.5
1.4
1.3
1.2
4
6
VIH
1.4
1.3
VIL
1.2
VIL
1.1
8
10
12
14
16
1.1
-40
-20
0
FIGURE 2-2:
Voltage.
Input Threshold vs. Supply
FIGURE 2-5:
Temperature.
9
9
8
8
7
7
RDS-ON (Ohms)
TA = +85°C
6
TA = +25°C
5
20
40
60
80
TEMPERATURE (°C)
VDD (V)
RDS-ON (Ohms)
20
TEMPERATURE (°C)
4
3
Input Threshold vs.
TA = +85°C
6
5
TA = +25°C
4
3
TA = -40°C
2
2
TA = -40°C
1
1
4
6
8
10
VDD (V)
12
14
FIGURE 2-3:
High-State Output
Resistance vs. Supply Voltage
 2001-2012 Microchip Technology Inc.
16
4
6
8
10
VDD (V)
12
14
16
FIGURE 2-6:
Low-State Output
Resistance vs. Supply Voltage.
DS21392D-page 5
TC1413/TC1413N
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD16V.
70
70
CLOAD = 1800 pF
CLOAD = 1800 pF
60
50
TA = +85°C
40
TA = +25°C
30
20
10
tFALL (nsec)
tRISE (nsec)
60
6
40
TA = +85°C
TA = +25°C
30
20
TA = -40°C
4
50
TA = -40°C
8
10
12
14
10
16
4
6
8
10
VDD (V)
FIGURE 2-7:
Voltage.
Rise Time vs. Supply
FIGURE 2-10:
Voltage.
16
Fall Time vs. Supply
CLOAD = 1800 pF
CLOAD = 1800 pF
100
90
90
80
tD2 (nsec)
TA = +85°C
80
tD1 (nsec)
14
100
110
70
TA = +25°C
60
50
TA = +85°C
70
60
TA = +25°C
50
40
40
TA = -40°C
30
30
TA = -40°C
20
20
4
6
FIGURE 2-8:
Supply Voltage.
8
10
VDD (V)
12
14
16
4
6
8
10
12
14
16
VDD (V)
Propagation Delay vs.
FIGURE 2-11:
Supply Voltage.
40
Propagation Delay vs.
35
TA = +25°C
VDD = 16V
tFALL
20
10
0
Propagation Delays (nsec)
tRISE
30
tRISE, tFALL (nsec)
12
VDD (V)
TA = +25°C
VDD = 16V
34
tD2
33
tD1
32
31
30
29
28
0
1000
2000
3000
4000
5000
0
1000
FIGURE 2-9:
Capacitive Load.
DS21392D-page 6
Rise and Fall Times vs.
2000
3000
4000
5000
CLOAD (pF)
CLOAD (pF)
FIGURE 2-12:
Capacitive Load.
Propagation Delays vs.
 2001-2012 Microchip Technology Inc.
TC1413/TC1413N
3.0
PIN DESCRIPTIONS
3.3
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin
No.
Symbol
1
VDD
2
INPUT
3
NC
4
GND
Ground
5
GND
Ground
Description
Supply input, 4.5V to 16V
Control input
No connection
6
OUTPUT CMOS push-pull output,
common to pin 7
7
OUTPUT CMOS push-pull output,
common to pin 6
8
3.1
VDD
CMOS Push-Pull Output
(OUTPUT)
The MOSFET driver output is a low-impedance, CMOS
push-pull style output, capable of driving a capacitive
load with 3A peak currents.
3.4
Ground (GND)
The ground pins are the return path for the bias current
and for the high peak currents that discharge the load
capacitor. The ground pins should be tied into a ground
plane or have very short traces to the bias supply
source return.
3.5
No Connect (NC)
No internal connection.
Supply input, 4.5V to 16V
Supply Input (VDD)
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 16V with respect to the ground
pin. The VDD input should be bypassed to ground with
a local ceramic capacitor. The value of the capacitor
should be chosen based on the capacitive load that is
being driven. A value of 1.0 µF is suggested.
3.2
Control Input (INPUT)
The MOSFET driver input is a high-impedance,
TTL/CMOS-compatible input. The input has 300 mV of
hysteresis between the high and low thresholds which
prevents output glitching even when the rise and fall
time of the input signal is very slow.
 2001-2012 Microchip Technology Inc.
DS21392D-page 7
TC1413/TC1413N
4.0
APPLICATION INFORMATION
+5V
90%
Input
VDD = 16V
0V
1.0 µF
0.1 µF
1, 8
Input
10%
tD1
tD2
tF
VDD
tR
90%
90%
Output
2
6, 7
Output
10%
10%
0V
CL = 1800 pF
Inverting Driver
TC1413
TC1413N
TC1413
+5V
90%
Input
4, 5
Input: 100 kHz,
square wave,
tRISE = tFALL  10 nsec
0V
VDD
10%
tD1 90%
tR
Output
0V
10%
90%
tD2
tF
10%
Non-Inverting Driver
TC1413N
FIGURE 4-1:
DS21392D-page 8
Switching Time Test Circuit.
 2001-2012 Microchip Technology Inc.
TC1413/TC1413N
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
NNN
e3
Note:
Example:
Example:
1413NE
347057
XXXXXXX
YWWNNN
*
TC1413
CPA057
0347
TC1413
COA0347
057
8-Lead MSOP
Legend: XX...X
Y
YY
WW
NNN
Example:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2001-2012 Microchip Technology Inc.
DS21392D-page 9
TC1413/TC1413N
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
n
1

E
A2
A
L
c
A1

B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
c
§
B1
B
eB


MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21392D-page 10
 2001-2012 Microchip Technology Inc.
TC1413/TC1413N
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1

h
45
c
A2
A


L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L

c
B


MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
 2001-2012 Microchip Technology Inc.
DS21392D-page 11
TC1413/TC1413N
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1
A2
A
c
A1
(F )
L
Units
Dimens ion Limits
n
p
MIN
INC HE S
NOM
MAX
MILLIME T E R S *
NOM
8
0.65 B S C
0.85
0.75
0.00
4.90 B S C
3.00 B S C
3.00 B S C
0.60
0.40
0.95 R E F
0˚
0.08
0.22
5˚
5˚
-
MIN
Number of P ins
8
P itch
.026 B S C
Overall Height
A
.043
.030
.033
.037
Molded P ackage T hicknes s
A2
.000
.006
S tandoff
A1
Overall Width
.193 B S C
E
Molded P ackage Width
E1
.118 B S C
Overall Length
.118 B S C
D
.016
.024
.031
F oot Length
L
F ootprint (R eference)
F
.037 R E F
F oot Angle
0˚
8˚
c
Lead T hicknes s
.003
.006
.009
B
Lead Width
.009
.012
.016
Mold Draft Angle T op
5˚
15˚
Mold Draft Angle B ottom
5˚
15˚
*C ontrolling P arameter
Notes :
Dimens ions D and E 1 do not include mold flas h or protrus ions . Mold flas h or protrus ions s hall not
exceed .010" (0.254mm) per s ide.
MAX
1.10
0.95
0.15
0.80
8˚
0.23
0.40
15˚
15˚
J E DE C E quivalent: MO-187
Drawing No. C 04-111
DS21392D-page 12
 2001-2012 Microchip Technology Inc.
TC1413/TC1413N
6.0
REVISION HISTORY
Revision D (December 2012)
Added a note to each package outline drawing.
 2001-2012 Microchip Technology Inc.
DS21392D-page 13
TC1413/TC1413N
NOTES:
DS21392D-page 14
 2001-2012 Microchip Technology Inc.
TC1413/TC1413N
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Temperature
Range
Package
Device:
TC1413: 3 A Single MOSFET Driver, Inverting
TC1413N: 3 A Single MOSFET Driver, Non-Inverting
Temperature Range:
C
E
Package:
OA
= Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
UA
= Plastic Micro Small Outline (MSOP), 8-lead *
UA713 = Plastic Micro Small Outline (MSOP), 8-lead *
(Tape and Reel)
PA
= Plastic DIP (300 mil Body), 8-lead
=
=
Examples:
a)
b)
c)
TC1413COA: 3A Single MOSFET driver,
SOIC package, 0°C to +70°C.
TC1413CPA: 3A Single MOSFET driver,
PDIP package, 0°C to +70°C.
TC1413EUA713: Tape and Reel, 3A
Single MOSFET driver, MSOP package,
-40°C to +85°C.
0°C to +70°C
-40°C to +85°C
a)
b)
c)
TC1413NCPA: 3A Single MOSFET driver,
PDIP package, 0°C to +70°C.
TC1413NEPA: 3A Single MOSFET driver,
PDIP package, -40°C to +85°C.
TC1413NEUA: 3A Single MOSFET driver,
MSOP package, -40°C to +85°C.
* MSOP package is only available in E-Temp.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
Your local Microchip sales office
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2001-2012 Microchip Technology Inc.
DS21392D-page 15
TC1413/TC1413N
NOTES:
DS21392D-page 16
 2001-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767870
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2001-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21392D-page 17
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
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Technical Support:
http://www.microchip.com/
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Web Address:
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Tel: 91-11-4160-8631
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Tel: 43-7242-2244-39
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Tel: 61-2-9868-6733
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Tel: 86-10-8569-7000
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Tel: 86-28-8665-5511
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Tel: 63-2-634-9065
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Tel: 86-21-5407-5533
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Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
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Tel: 886-3-5778-366
Fax: 886-3-5770-955
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Tel: 86-755-8864-2200
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Taiwan - Kaohsiung
Tel: 886-7-213-7828
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China - Wuhan
Tel: 86-27-5980-5300
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Taiwan - Taipei
Tel: 886-2-2508-8600
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China - Xian
Tel: 86-29-8833-7252
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Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
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China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21392D-page 18
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
11/27/12
 2001-2012 Microchip Technology Inc.