NTMFS4845N Power MOSFET 30 V, 115 A, Single N−Channel, SO−8FL Features • • • • • Low RDS(on) to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses Thermally Enhanced SO−8 Package These are Pb−Free Devices* http://onsemi.com V(BR)DSS Applications • • • • Refer to Application Note AND8195/D CPU Power Delivery DC−DC Converters Low Side Switching RDS(ON) MAX 2.9 mW @ 10 V 30 V Symbol D (5,6) Value Unit Drain−to−Source Voltage VDSS 30 V Gate−to−Source Voltage VGS ±16 V ID 22 A Continuous Drain Current RqJA (Note 1) TA = 25°C Power Dissipation RqJA (Note 1) TA = 25°C PD 2.27 W Continuous Drain Current RqJA v 10 sec TA = 25°C ID 35.5 A Power Dissipation RqJA, t v 10 sec TA = 25°C PD 5.95 W TA = 25°C ID 13.7 A Continuous Drain Current RqJA (Note 2) TA = 85°C Steady State S (1,2,3) TA = 85°C 9.9 TA = 25°C PD 0.89 W Continuous Drain Current RqJC (Note 1) TC = 25°C ID 115 A Power Dissipation RqJC (Note 1) TC = 25°C PD 62.5 W TA = 25°C IDM 230 A TA = 25°C IDmaxpkg 100 A TJ, TSTG −55 to +150 °C IS 62 A TC = 85°C tp=10ms Current limited by package Operating Junction and Storage Temperature Source Current (Body Diode) 83 Drain to Source dV/dt dV/dt 6 V/ns Single Pulse Drain−to−Source Avalanche Energy (VDD = 50 V, VGS = 10 V, IL = 39 Apk, L = 0.3 mH, RG = 25 W) EAS 228 mJ Lead Temperature for Soldering Purposes (1/8” from case for 10 s) TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2010 May, 2010 − Rev. 2 N−CHANNEL MOSFET MARKING DIAGRAM 25.6 Power Dissipation RqJA (Note 2) Pulsed Drain Current G (4) 15.8 TA = 85°C 115 A 4.4 mW @ 4.5 V MAXIMUM RATINGS (TJ = 25°C unless otherwise stated) Parameter ID MAX 1 D 1 SO−8 FLAT LEAD CASE 488AA STYLE 1 S S S G 4845N AYWWG G D D D A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping† NTMFS4845NT1G SO−8FL (Pb−Free) 1500 / Tape & Reel NTMFS4845NT3G SO−8FL (Pb−Free) 5000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Publication Order Number: NTMFS4845N/D NTMFS4845N THERMAL RESISTANCE MAXIMUM RATINGS Symbol Value Junction−to−Case (Drain) Parameter RqJC 2.0 Junction−to−Ambient – Steady State (Note 1) RqJA 55.1 Junction−to−Ambient – Steady State (Note 2) RqJA 140.1 Junction−to−Ambient − t v 10 sec RqJA 21 Unit °C/W 1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu. 2. Surface−mounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter Symbol Test Condition Min Drain−to−Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 250 mA 30 Drain−to−Source Breakdown Voltage Temperature Coefficient V(BR)DSS/ TJ Typ Max Unit OFF CHARACTERISTICS Zero Gate Voltage Drain Current Gate−to−Source Leakage Current IDSS V 25 VGS = 0 V, VDS = 24 V mV/°C TJ = 25 °C 1 TJ = 125°C 10 IGSS VDS = 0 V, VGS = ±16 V VGS(TH) VGS = VDS, ID = 250 mA mA ±100 nA 2.5 V ON CHARACTERISTICS (Note 3) Gate Threshold Voltage Negative Threshold Temperature Coefficient Drain−to−Source On Resistance Forward Transconductance VGS(TH)/TJ RDS(on) 1.45 1.8 5.2 VGS = 10 V to 11.5 V ID = 30 A 2.2 ID = 15 A 2.2 VGS = 4.5 V ID = 30 A 3.4 ID = 15 A 3.4 gFS VDS = 1.5 V, ID = 30 A mV/°C 2.9 4.4 87 mW S CHARGES AND CAPACITANCES Input Capacitance CISS Output Capacitance COSS Reverse Transfer Capacitance CRSS 335 Total Gate Charge QG(TOT) 25.6 Threshold Gate Charge QG(TH) Gate−to−Source Charge QGS Gate−to−Drain Charge QGD Total Gate Charge 3720 VGS = 0 V, f = 1 MHz, VDS = 12 V VGS = 4.5 V, VDS = 15 V; ID = 30 A 650 3.2 9.4 pF 39 nC 8.6 QG(TOT) VGS = 11.5 V, VDS = 15 V, ID = 30 A 62 nC SWITCHING CHARACTERISTICS (Note 4) Turn−On Delay Time Rise Time Turn−Off Delay Time Fall Time td(ON) 20.5 tr td(OFF) VGS = 4.5 V, VDS = 15 V, ID = 15 A, RG = 3.0 W tf 48.4 28.9 12.2 3. Pulse Test: pulse width v 300 ms, duty cycle v 2%. 4. Switching characteristics are independent of operating junction temperatures. http://onsemi.com 2 ns NTMFS4845N ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter Symbol Test Condition Min Typ Max Unit SWITCHING CHARACTERISTICS (Note 4) Turn−On Delay Time td(ON) Rise Time 12.5 tr Turn−Off Delay Time td(OFF) Fall Time 27.1 VGS = 11.5 V, VDS = 15 V, ID = 15 A, RG = 3.0 W ns 37.7 tf 9.7 DRAIN−SOURCE DIODE CHARACTERISTICS Forward Diode Voltage VSD Reverse Recovery Time VGS = 0 V, IS = 30 A TJ = 25°C 0.8 TJ = 125°C 0.7 tRR Charge Time ta Discharge Time tb Reverse Recovery Charge 1.0 V 20.8 VGS = 0 V, dIS/dt = 100 A/ms, IS = 30 A 12.6 ns 8.2 QRR 9.0 nC Source Inductance LS 0.65 nH Drain Inductance LD Gate Inductance LG Gate Resistance RG PACKAGE PARASITIC VALUES 0.005 TA = 25°C 1.84 1.3 2.5 W 3. Pulse Test: pulse width v 300 ms, duty cycle v 2%. 4. Switching characteristics are independent of operating junction temperatures. TYPICAL CHARACTERISTICS ID, DRAIN CURRENT (A) 180 10 V VGS = 4.2 V 160 TJ = 25°C 4.0 V 5.0 V 140 3.8 V 3.6 V 4.5 V 120 3.4 V 100 80 3.2 V 60 3.0 V 40 20 0 ID, DRAIN CURRENT (A) 200 2.8 V 2.6 V 0 1 2 3 4 5 6 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 VDS ≥ 10 V TJ = 125°C TJ = 25°C TJ = −55°C 1 2 3 4 VDS, DRAIN−TO−SOURCE VOLTAGE (V) VGS, GATE−TO−SOURCE VOLTAGE (V) Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics http://onsemi.com 3 NTMFS4845N RDS(on), DRAIN−TO−SOURCE RESISTANCE (W) RDS(on), DRAIN−TO−SOURCE RESISTANCE (W) TYPICAL CHARACTERISTICS 0.016 ID = 30 A TJ = 25°C 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0 2 3 4 5 6 7 8 9 10 11 VGS, GATE−TO−SOURCE VOLTAGE (V) 0.006 TJ = 25°C 0.005 0.003 0.001 10 25 1.4 1.3 1.2 1.0 0.9 −25 0 25 50 75 100 125 100 150 2 TJ, JUNCTION TEMPERATURE (°C) VGS, GATE−TO−SOURCE VOLTAGE (V) 3000 2500 2000 Coss Crss 4 8 12 16 20 24 4 6 12 TJ = 25°C 8 10 12 14 16 18 20 28 32 16 QT 14 10 0 60 Figure 6. Drain−to−Source Leakage Current vs. Voltage 3500 0 55 VDS VGS 12 8 10 6 8 Qgs 4 Qgd 6 ID = 30 A TJ = 25°C 2 0 0 5 Qg, TOTAL GATE CHARGE (nC) Figure 7. Capacitance Variation Figure 8. Gate−to−Source and Drain−to−Source Voltage vs. Total Charge http://onsemi.com 4 2 0 10 15 20 25 30 35 40 45 50 55 60 65 VDS, DRAIN−TO−SOURCE VOLTAGE (V) 4 VDS, DRAIN−TO−SOURCE VOLTAGE (V) Ciss 500 50 VDS, DRAIN−TO−SOURCE VOLTAGE (V) Figure 5. On−Resistance Variation with Temperature 1000 45 TJ = 125°C 0.7 1500 40 TJ = 150°C 0.8 4000 35 1000 1.1 4500 30 VGS = 0 V IDSS, LEAKAGE (nA) RDS(on), DRAIN−TO−SOURCE RESISTANCE (NORMALIZED) 20 ID, DRAIN CURRENT (A) 10,000 ID = 30 A VGS = 10 V 0.6 −50 C, CAPACITANCE (pF) 15 Figure 4. On−Resistance vs. Drain Current and Gate Voltage 1.7 1.5 VGS = 11.5 V 0.002 Figure 3. On−Resistance vs. Gate−to−Source Voltage 1.6 VGS = 4.5 V 0.004 NTMFS4845N TYPICAL CHARACTERISTICS 30 VDS = 15 V ID = 15 A VGS = 11.5 V IS, SOURCE CURRENT (A) 1000 tf t, TIME (ns) 100 td(off) tr td(on) 10 1 1 10 5 0.4 0.5 0.6 0.7 0.8 0.9 Figure 9. Resistive Switching Time Variation vs. Gate Resistance Figure 10. Diode Forward Voltage vs. Current EAS, SINGLE PULSE DRAIN−TO− SOURCE AVALANCHE ENERGY (mJ) ID, DRAIN CURRENT (A) 10 VSD, SOURCE−TO−DRAIN VOLTAGE (V) 10 ms 100 100 ms 10 0.1 15 RG, GATE RESISTANCE (W) 1000 1 ms VGS = 20 V Single Pulse TC = 25°C RDS(on) Limit Thermal Limit Package Limit 1 20 0 100 VGS = 0 V TJ = 25°C 25 0.1 10 ms dc 1 10 100 240 220 200 180 ID = 39 A 160 140 120 100 80 60 40 20 0 25 50 75 100 125 150 VDS, DRAIN−TO−SOURCE VOLTAGE (V) TJ, STARTING JUNCTION TEMPERATURE(°C) Figure 11. Maximum Rated Forward Biased Safe Operating Area Figure 12. Maximum Avalanche Energy vs. Starting Junction Temperature 160 1000 140 120 100 Id (A) gFS (S) 100 80 60 100°C 125°C 10 25°C 40 20 0 VDS = 1.5 V 0 15 30 45 60 75 90 105 1 120 1 10 100 1000 DRAIN CURRENT (A) PULSE WIDTH (ms) Figure 13. gFS vs. Drain Current Figure 14. Id vs. Pulse Width http://onsemi.com 5 10,000 NTMFS4845N PACKAGE DIMENSIONS DFN5 5x6, 1.27P (SO−8FL) CASE 488AA−01 ISSUE D 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS. 0.20 C D 2 A B D1 6 2X 0.20 C 5 4X E1 1 2 3 q E 2 c A1 4 TOP VIEW C 3X e 0.10 C SEATING PLANE DETAIL A A 0.10 C SIDE VIEW 8X C A B 0.05 c 3X 4X 1.270 STYLE 1: PIN 1. SOURCE 2. SOURCE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN e/2 L 1 4 K 0.750 4X 1.000 0.965 1.330 2X 0.905 2X E2 L1 6 G MILLIMETERS MIN NOM MAX 0.90 1.00 1.10 0.00 −−− 0.05 0.33 0.41 0.51 0.23 0.28 0.33 5.15 BSC 4.50 4.90 5.10 3.50 −−− 4.22 6.15 BSC 5.50 5.80 6.10 3.45 −−− 4.30 1.27 BSC 0.51 0.61 0.71 0.51 −−− −−− 0.51 0.61 0.71 0.05 0.17 0.20 3.00 3.40 3.80 0_ −−− 12 _ SOLDERING FOOTPRINT* DETAIL A b 0.10 DIM A A1 b c D D1 D2 E E1 E2 e G K L L1 M q 0.495 M 4.530 3.200 0.475 5 D2 2X 1.530 BOTTOM VIEW 4.560 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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