TI GD75323DWR

GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
D
D
D
D
D
D
D
Single Chip With Easy Interface Between
UART and Serial-Port Connector of an
External Modem or Other Computer
Peripheral
Five Drivers and Three Receivers Meet or
Exceed the Requirements of ANSI Standard
TIA/EIA-232-F and ITU Recommendation
V.28 Standards
Supports Data Rates up to 120 kbit/s
Complement to the GD75232
Provides Pin-to-Pin Replacement for the
Goldstar GD75323
Pin-Out Compatible With SN75196
Functional Replacement for the MC145405
DW OR N PACKAGE
(TOP VIEW)
VCC
1DA
2DA
3DA
1RY
2RY
4DA
3RY
5DA
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VDD
1DY
2DY
3DY
1RA
2RA
4DY
3RA
5DY
VSS
description
The GD75323 combines five drivers and three receivers from the trade-standard SN75188 and SN75189
bipolar quadruple drivers and receivers, respectively. The flow-through design of the GD75323 decreases the
part count, reduces the board space required, and allows easy interconnection of the UART and serial-port
connector. The all-bipolar circuits and processing of the GD75323 provide a rugged, low-cost solution for this
function.
The GD75323 complies with the requirements of the ANSI TIA/EIA-232-F and ITU (formerly CCITT) V.28
standards. These standards are for data interchange between a host computer and a peripheral at signal rates
up to 20 kbit/s. The switching speeds of the GD75323 are fast enough to support rates up to 120 kbit/s with lower
capacitive loads (shorter cables). Interoperability at the higher signaling rates cannot be assured unless the
designer has design control of the cable and the interface circuits at both ends. For interoperability at signaling
rates up to 120 kbit/s, use of ANSI Standard TIA/EIA-423-B and TIA/EIA-422-B and ITU Recommendations V.10
and V.11 are recommended.
The GD75323 is characterized for operation over a temperature range of 0°C to 70°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
logic symbol†
1DA
2DA
3DA
1RY
2RY
4DA
3RY
5DA
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
1DY
2DY
3DY
1RA
2RA
4DY
3RA
5DY
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
1DA
2DA
3DA
1RY
2RY
4DA
3RY
5DA
2
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
POST OFFICE BOX 655303
1DY
2DY
3DY
1RA
2RA
4DY
3RA
5DY
• DALLAS, TEXAS 75265
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
schematic (each driver)
To Other Drivers
VDD
11.6 kΩ
9.4 kΩ
Input DAx
75.8 Ω
320 Ω
DYx Output
4.2 kΩ
GND
To Other
Drivers
10.4 kΩ
3.3 kΩ
68.5 Ω
VSS
To Other Drivers
Resistor values shown are nominal.
schematic (each receiver)
To Other Receivers
VCC
9 kΩ
5 kΩ
1.66 kΩ
RYx Output
2 kΩ
3.8 kΩ
Input RAx
10 kΩ
GND
To Other Receivers
Resistor values shown are nominal.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 V
Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Supply voltage, VSS (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 15 V
Input voltage range, VI: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –15 V to 7 V
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30 V to 30 V
Output voltage range, VO (Driver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 15 V to 15 V
Low-level output current, IOL (Receiver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to the network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
recommended operating conditions
Supply voltage
VDD
VSS
High-level input voltage, VIH
VCC
Driver
Low-level input voltage, VIL
Driver
MIN
NOM
MAX
7.5
9
13.5
– 7.5
–9
– 13.5
4.5
5
5.5
1.9
–6
Receiver
– 0.5
Driver
High level output current,
High-level
current IOL
6
Receiver
Operating free-air temperature,TA
V
V
0.8
Driver
High level output current,
High-level
current IOH
UNIT
16
0
70
V
mA
mA
°C
supply currents over operating free-air temperature range
PARAMETER
IDD
ISS
ICC
4
TEST CONDITIONS
MAX
All inputs at 1.9
1 9 V,
V
No load
VDD = 9 V,
VDD = 12 V,
VSS = – 9 V
VSS = – 12 V
25
All inputs at 0.8
0 8 V,
V
No load
VDD = 9 V,
VDD = 12 V,
VSS = – 9 V
VSS = – 12 V
7.5
1 9 V,
V
All inputs at 1.9
No load
VDD = 9 V,
VDD = 12 V,
VSS = – 9 V
VSS = – 12 V
– 25
All inputs at 0.8
0 8 V,
V
No load
VDD = 9 V,
VDD = 12 V,
VSS = – 9 V
VSS = – 12 V
– 5.3
VCC= 5 V,
All inputs at 5 V,
No load
Supply current from VDD
Supply current from VSS
Supply current from VCC
MIN
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
32
9.5
– 32
– 5.3
20
UNIT
mA
mA
mA
mA
mA
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
DRIVER SECTION
electrical characteristics over operating free-air temperature range, VDD = 9 V, VSS = –9 V,
VCC = 5 V (unless otherwise noted)
PARAMETER
VOH
VOL
High-level output voltage
IIH
IIL
High-level input current
IOS(H)
IOS(L)
ro
TEST CONDITIONS
MIN
TYP
6
7.5
MAX
UNIT
VIL = 0.8 V,
VIH = 1.9 V,
RL = 3 kΩ,
See Figure 1
RL = 3 kΩ,
See Figure 1
–6
V
See Figure 2
10
µA
Low-level input current
VI = 5 V,
VI = 0,
See Figure 2
– 1.6
mA
High-level short-circuit output current
(see Note 4)
VIL = 0.8 V,
VO = 0,
See Figure 1
– 4.5
–9
– 19.5
mA
VIH = 2 V,
VO = 0,
VCC = VDD = VSS = 0,
See Figure 1
4.5
9
19
mA
Low-level output voltage (see Note 3)
Low-level short-circuit output current
– 7.5
V
VO = – 2 V to 2 V
300
Ω
NOTES: 3. The algebraic convention, where the more positive (less negative) limit is designated as maximum, is used in this data sheet for logic
levels only, e.g., if – 10 V is maximum, the typical value is a more negative voltage.
4. Output short-circuit conditions must maintain the total power dissipation below absolute maximum ratings.
5. Test conditions are those specified by TIA/EIA-232-F and as listed above.
Output resistance (see Note 5)
switching characteristics, VDD = 12 V, VSS = –12 V, VCC = 5 V ± 10%, TA = 25°C
PARAMETER
tPLH
tPHL
tTLH
tTHL
TEST CONDITIONS
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
time lowlow to high-level
high level output
Transition time,
Transition time, highg to low-level output (see
(
Note 5)
TYP
MAX
UNIT
315
500
ns
75
175
ns
CL = 15 pF,
60
100
ns
RL = 3 kΩ to 7 kΩ,
See Figure 3 and Note 6
CL = 2500 pF,
1.7
2.5
µs
RL = 3 kΩ to 7 kΩ,
See Figure 3
CL = 15 pF,
40
75
ns
RL = 3 kΩ to 7 kΩ,
See Figure 3 and Note 7
CL = 2500 pF,
1.5
2.5
µs
RL = 3 kΩ to 7 kΩ,,
See Figure 3
CL = 15 pF,,
RL = 3 kΩ to 7 kΩ,
See Figure 3
MIN
NOTES: 6. Measured between – 3-V and 3-V points of the output waveform (TIA/EIA-232-F conditions), all unused inputs are tied either high
or low.
7. Measured between 3-V and – 3-V points of the output waveform (TIA/EIA-232-F conditions), all unused inputs are tied either high
or low.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
RECEIVER SECTION
electrical characteristics over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA = 25°C
TA = 0°C to 70 °C
TYPĔ
MAX
1.75
1.9
2.3
VIT
IT+
Positive going input threshold voltage
Positive-going
VIT–
Vhys
Negative-going input threshold voltage
VOH
High level output voltage
High-level
IOH = – 0.5
0 5 mA
VIH = 0.75 V
Inputs open
VOL
Low-level output voltage
IIH
High level input current
High-level
IOL = 10 mA,
VI = 25 V,
VI = 3 V
See Figure 5
3.6
See Figure 5
0.43
IIL
Low level input current
Low-level
VI = 3 V,
VI = – 25 V,
See Figure 5
– 3.6
VI = – 3 V,
See Figure 5
– 0.43
Input hysteresis voltage (VIT+ – VIT–)
See Figure 5
MIN
1.55
0.75
See Figure 5
2.3
0.97
1.25
4
5
0.2
0.45
UNIT
V
0.5
2.6
2.6
IOS
Short-circuit output current
See Figure 4
† All typical values are at TA = 25°C, VCC = 5 V, VDD = 9 V, and VSS = – 9 V.
8.3
– 8.3
V
V
mA
mA
– 3.4
–12
mA
TYP
MAX
UNIT
107
500
ns
switching characteristics, VCC = 5 V, VDD = 12 V, VSS = –12 V, TA = 25°C
PARAMETER
TEST CONDITIONS
tPLH
tPHL
Propagation delay time, low- to high-level output
tTLH
tTHL
Transition time, low- to high-level output
Propagation delay time, high- to low-level output
CL = 50 pF,
See Figure 6
MIN
RL = 5 kΩ,
Transition time, high- to low-level output
42
150
ns
175
525
ns
16
60
ns
PARAMETER MEASUREMENT INFORMATION
IOS(L)
VDD
VCC
VDD
VDD or GND
– IOS(H)
IIH
VSS or GND
VI
VCC
VI
– IIL
VO
RL = 3 kΩ
VI
VSS
VSS
Figure 1. Driver Test Circuit
for VOH, VOL, IOS(H), and IOS(L
6
POST OFFICE BOX 655303
Figure 2. Driver Test Circuit for IIH and IIL
• DALLAS, TEXAS 75265
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
PARAMETER MEASUREMENT INFORMATION
3V
1.5 V
Input
VDD
Input V
CC
1.5 V
0V
t PHL
Pulse
Generator
VO
CL
(see Note A)
RL
See Note B
90%
Output
VSS
t PLH
50%
10%
50%
10%
90%
VOL
t THL
TEST CIRCUIT
VOH
t TLH
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns.
Figure 3. Driver Test Circuit and Voltage Waveforms
VDD
VCC
VDD
VCC
– IOS
– IOH
VIT, VI
VOH
VI
VOL
IOL
VSS
VSS
Figure 4. Receiver Test Circuit for IOS
Figure 5. Receiver Test Circuit
for VIT, VOH, and VOL
5V
VDD
Input
50%
Input
50%
–5 V
VCC
t PHL
Pulse
Generator
VO
CL
(see Note A)
RL
See Note B
90%
Output
50%
10%
t PLH
50%
10%
90%
VOL
VSS
t THL
TEST CIRCUIT
VOH
t TLH
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns.
Figure 6. Receiver Propagation and Transition Times
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
TYPICAL CHARACTERISTICS
DRIVER SECTION
OUTPUT CURRENT
vs
OUTPUT VOLTAGE
VOLTAGE-TRANSFER CHARACTERISTICS
VO
VO – Output Voltage – V
9
6
3
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
20
VDD = 12 V, VSS = – 12 V
16
VDD = 9 V, VSS = – 9 V
12
IO
I O – Output Current – mA
12
VDD = 6 V, VSS = – 6 V
0
–3
–6
–9
– 12
ÎÎÎÎ
ÎÎÎÎ
VDD = 9 V
VSS = – 9 V
TA = 25°C
4
0
–4
ÎÎÎ
3-kΩ
Load Line
–8
VOH(VI = 0.8 V)
– 16
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
VI – Input Voltage – V
– 20
– 16
2
– 12
SHORT-CIRCUIT OUTPUT CURRENT
vs
FREE-AIR TEMPERATURE
VDD = 9 V
VSS = – 9 V
RL = 3 kΩ
TA = 25°C
IOS(L) (VI = 1.9 V)
SR – Slew Rate – V/ µs
6
3
ÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎ
ÁÁ
ÎÎÎÎÎÎ
ÁÁ
0
VDD = 9 V
VSS = – 9 V
VO = 0
–3
16
ÁÁÁÁÁ
ÁÁÁÁÁ
ÎÎÎÎÎ
ÁÁÁÁÁ
1000
9
12
SLEW RATE
vs
LOAD CAPACITANCE
12
IIOS
OS – Short-Circuit Output Current – mA
–8
–4
0
4
8
VO – Output Voltage – V
Figure 8
Figure 7
100
10
–6
IOS(H) (VI = 0.8 V)
–9
1
– 12
0
10
20
30
40
50
60
70
10
TA – Free-Air Temperature – °C
100
Figure 10
POST OFFICE BOX 655303
1000
CL – Load Capacitance – pF
Figure 9
8
VOL(VI = 1.9 V)
– 12
RL = 3 kΩ
TA = 25°C
0
8
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎ ÎÎÎÎÎ
ÎÎÎÎ ÎÎÎÎÎ
• DALLAS, TEXAS 75265
10000
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
TYPICAL CHARACTERISTICS
RECEIVER SECTION
INPUT THRESHOLD VOLTAGE
vs
SUPPLY VOLTAGE
2.4
2
2.2
1.8
V – Input Threshold Voltage – V
IT
V – Input Threshold Voltage – V
IT
INPUT THRESHOLD VOLTAGE
vs
FREE-AIR TEMPERATURE
VIT +
2
1.8
1.6
1.4
1.2
VIT–
0.8
0.6
0.4
VIT+
1.6
1.4
1.2
1
VIT–
0.8
0.6
0.4
0.2
0
10
20
30
40
50
60
0
2
70
TA – Free-Air Temperature – °C
3
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÁÁÁÁ
ÎÎÎÎÎ
ÁÁÁÁ
ÎÎÎÎÎ
NOISE REJECTION
ÁÁÁÁ
ÁÁÁÁ
ÎÎÎÎ
ÁÁÁ
ÎÎÎÎ
ÁÁÁ
CC = 500 pF
CC = 12 pF
2
CC = 100 pF
1
0
10
40
100
400 1000
4000
tw – Pulse Duration – ns
10000
NOTE A: This figure shows the maximum amplitude of a
positive-going pulse that, starting from 0 V, does not
cause a change of the output level.
20
30
40
50
60
TA – Free-Air Temperature – °C
70
14
VDD – Maximum Supply Voltage – V
Amplitude – V
3
10
16
CC = 300 pF
4
9
MAXIMUM SUPPLY VOLTAGE
vs
FREE-AIR TEMPERATURE
VCC = 5 V
TA = 25°C
See Note A
5
5
6
7
8
VCC – Supply Voltage – V
Figure 12
Figure 11
6
4
12
10
8
6
4
2
RL ≥ 3 kΩ (from each output to GND)
0
0
10
Figure 13
Figure 14
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
GD75323
MULTIPLE RS-232 DRIVERS AND RECEIVERS
SLLS213A – JANUARY 1996 – REVISED JUNE 1999
APPLICATION INFORMATION
Diodes placed in series with the VDD and VSS leads protect the GD75323 in the fault condition in which the device
outputs are shorted to VDD or VSS, and the power supplies are at low and provide low-impedance paths to
ground (see Figure 15).
VDD
± 15 V
VDD
Output
GD75323
GD75323
VSS
VSS
Figure 15. Power-Supply Protection to Meet Power-Off Fault Conditions of TIA / EIA-232-F
TIA/EIA-232-F
DB9S
Connector
– 12 V
TL16C450
ACE
10
RI 43
9
DTR 37
8
CTS 40
7
SO 13
6
RTS 36
5
SI 11
4
DSR 41
3
DCD 42
2
1
GND
VSS
5DA
5DY
3RY
3RA
4DA
4DY
2RY
2RA
GD75323
1RY
1RA
3DA
3DY
2DA
2DY
1DA
1DY
VCC
VDD
11
12
5
9
RI
13
DTR
14
CTS
15
TX
16
RTS
17
RX
18
DSR
19
20
C5†
C4†
DCD
C3†
6
C2†
C1†
1
12 V
5V
† See Figure 10 to select the correct values for the loading capacitors (C1, C2, C3, C4, and C5), which may be required to meet the RS-232
maximum slew-rate requirement of 30 V/µs. The value of the loading capacitors required depends upon the line length and desired slew rate,
but is typically 330 pF.
NOTE C: To use the receivers only, VDD and VSS both must be powered or tied to ground.
Figure 16. Typical Connection
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright  1999, Texas Instruments Incorporated