STMICROELECTRONICS STSJ80N4LLF3

STSJ80N4LLF3
N-channel 40V - 0.0042Ω - 18A - PowerSO-8™
STripFET™III Power MOSFET for DC-DC conversion
General features
Type
VDSS
RDS(on)
ID
STSJ80N4LLF3
40V
0.005Ω
18A(1)
1. This value is rated according to Rthj-pcb
■
Optimal RDS(on) x Qg trade-off @ 4.5V
■
Switching losses reduced
■
Low threshold device
■
Improved junction-case thermal resistance
PowerSO-8
Description
This series of product utilizes the latest advanced
design rules of ST’s proprietary STripFET™
technology. This process coupled to unique
metallization techniques realizes the most
advanced low voltage Power MOSFET in SO-8
ever produced. The exposed slug reduces the
Rthj-c improving the current capability.
Internal schematic diagram
Applications
■
Switching application
DRAIN CONTACT ALSO ON THE BACKSIDE
Order codes
Part number
Marking
Package
Packaging
STSJ80N4LLF3
80N4LL-
PowerSO-8
Tape & reel
November 2006
Rev 3
1/12
www.st.com
12
Contents
STSJ80N4LLF3
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................. 6
3
Test circuit
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2/12
................................................ 8
STSJ80N4LLF3
1
Electrical ratings
Electrical ratings
Table 1.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
40
V
VDS
Drain-source voltage (VGS = 0)
VGS
Gate- source voltage
± 16
V
Gate- source voltage
±18
V
ID (2)
Drain current (continuous) at TC = 25°C
80
A
ID
(3)
Drain current (continuous) at TC = 25°C
18
A
ID
(2)
Drain current (continuous) at TC = 100°C
50
A
Drain current (pulsed)
72
A
Ptot(2)
Total dissipation at TC = 25°C
70
W
Ptot(3)
Total dissipation at TC = 25°C
3
W
Tj
Tstg
Maximum operating junction temperature
Storage temperature
-55 to 150
°C
VGS
IDM
(1)
(4)
1. Guaranteed for test time < 15ms
2. This value is rated according to Rthj-c
3. This value is rated according to Rthj-pcb
4. Pulse with limited by safe operating area
Table 2.
Thermal data
Symbol
Rthj-c
Rthj-pcb
(1)
Parameter
Value
Unit
Thermal resistance junction-case max
1.8
°C/W
Thermal resistance junction-pcb max
42
°C/W
1. When mounted on 1 inch² FR-4 board, 2oz Cu (t<10sec.)
3/12
Electrical characteristics
2
STSJ80N4LLF3
Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 3.
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Drain-source
breakdown voltage
ID = 250µA, VGS = 0
IDSS
Zero gate voltage
drain current (VGS = 0)
VDS = 40V, TC = 25°C
VDS = 40V, TC = 125°C
10
100
µA
µA
IGSS
Gate-body leakage
current (VDS = 0)
VGS = ± 16V
±200
nA
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250µA
RDS(on)
Static drain-source on
resistance
VGS = 10V, ID = 9A
VGS = 4.5V, ID = 9A
V(BR)DSS
Table 4.
Symbol
40
V
1
V
0.0042
0.005
0.005
0.007
Ω
Ω
Typ.
Max.
Unit
Dynamic
Parameter
Test conditions
Min.
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS = 25V, f = 1MHz,
VGS = 0
2530
574
29
Qg
Qgs
Qgd
Total gate charge
Gate-source charge
Gate-drain charge
VDD = 20V, ID = 18A
VGS = 4.5V
(see Figure 13)
21.5
6.9
8.2
28
nC
nC
nC
Gate input resistance
f=1 MHz Gate DC Bias = 0
Test signal level = 20mV
open drain
3
5
Ω
RG
4/12
On/off states
1
pF
pF
pF
STSJ80N4LLF3
Electrical characteristics
Table 5.
Switching times
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
td(on)
tr
Turn-on delay time
Rise time
VDD = 20V, ID = 9A
RG = 4.7Ω , VGS = 10V
(see Figure 15)
17
25
ns
ns
td(off)
tf
Turn-off delay time
Fall time
VDD = 20V, ID = 9A
RG = 4.7Ω , VGS = 10V
(see Figure 15)
62
9
ns
ns
Table 6.
Source drain diode
Symbol
Parameter
ISD
ISDM
Source-drain current
Source-drain current (pulsed)
VSD(1)
trr
Qrr
IRRM
Test conditions
Forward on voltage
ISD = 18A , VGS = 0
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 18A, di/dt = 100A/µs
VDD = 30V, Tj = 150°C
(see Figure 14)
Min.
Typ.
43
64
3
Max.
Unit
18
72
A
A
1.2
V
ns
nC
A
1. Pulsed: pulse duration = 300µs, duty cycle 1.5%
5/12
Electrical characteristics
STSJ80N4LLF3
2.1
Electrical characteristics (curves)
Figure 1.
Safe operating area
Figure 2.
Thermal impedance
Figure 3.
Output characterisics
Figure 4.
Transfer characteristics
Figure 5.
Normalized BVDSS vs temperature
Figure 6.
Static drain-source on resistance
6/12
STSJ80N4LLF3
Electrical characteristics
Figure 7.
Gate charge vs gate-source voltage Figure 8.
Figure 9.
Normalized gate threshold voltage
vs temperature
Capacitance variations
Figure 10. Normalized on resistance vs
temperature
Figure 11. Source-drain diode forward
characteristics
7/12
Test circuit
3
STSJ80N4LLF3
Test circuit
Figure 12. Switching times test circuit for
resistive load
Figure 13. Gate charge test circuit
Figure 14. Test circuit for inductive load
Figure 15. Unclamped inductive load test
switching and diode recovery times
circuit
Figure 16. Unclamped inductive waveform
8/12
Figure 17. Switching time waveform
STSJ80N4LLF3
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
9/12
Package mechanical data
STSJ80N4LLF3
PowerSO-8™ MECHANICAL DATA
DIM.
mm.
MIN.
TYP
A
a1
inch
MAX.
TYP.
1.75
0.1
MAX.
0.068
0.25
a2
0.003
0.009
1.65
0.064
a3
0.65
0.85
0.025
0.033
b
0.35
0.48
0.013
0.018
b1
0.19
0.25
0.007
0.010
C
0.25
0.5
0.010
0.019
0.196
c1
45° (typ.)
D
4.8
5.0
0.188
E
5.8
6.2
0.228
0.244
e
1.27
0.050
e3
3.81
0.150
e4
2.79
0.110
F
3.8
4.0
0.14
0.157
L
0.4
1.27
0.015
0.050
M
S
10/12
MIN.
0.6
0.023
8° (max.)
STSJ80N4LLF3
5
Revision history
Revision history
Table 7.
Revision history
Date
Revision
Changes
13-May-2005
1
Initial release.
23-Jun-2006
2
New template, complete version
22-Nov-2006
3
Corrected part number
11/12
STSJ80N4LLF3
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
12/12