SMP50 / SMTPA / TPA Trisil™ for telecom equipment protection Features ■ Bidirectional crowbar protection ■ Voltage range from 62 V to 320 V ■ Low capacitance from 12 pF to 20 pF @ 50 V ■ Low leakage current : IR = 2 µA max ■ Holding current: IH = 150 mA min ■ Repetitive peak pulse current : IPP = 50 A (10/1000 µs) SMB SMA (JEDEC DO-214AC) (JEDEC DO-214AA) SMTPA SMP50 Main applications Telecommunication equipment such as: ■ Analog and digital line cards (xDSL, T1/E1, ISDN, ...) ■ Terminals (phone, fax, modem, ...) and central office equipment Description DO-15 TPA Order codes Part Number These Trisil series have been designed to protect telecommunication equipment against lightning and transient induced by AC power lines. SMP50-xxx TPAxxx They are available in SMA, SMB and DO-15 packages. Benefits Marking See Ordering Information on page 9 SMTPAxxx Schematic Diagram Trisils are not subject to ageing and provide a fail safe mode in short circuit for a better protection. They are used to help equipment to meet various standards such as UL1950, IEC950 / CSA C22.2, UL1459 and FCC part 68. Trisils have UL94 V0 approved resin. SMA and SMB packages are JEDEC registered (DO-214AC and DO-214AA). Trisils are UL497B approved (file: E136224). TM: TRISIL is a trademark of STMicroelectronics June 2007 Rev 3 1/11 www.st.com 11 Characteristics 1 SMP50 / SMTPA / TPA Characteristics Table 1. Compliant with the following standards Standard Peak Surge Voltage (V) Waveform Voltage Required peak current (A) Current waveform Minimum serial resistor to meet standard (Ω) GR-1089 Core First level 2500 1000 2/10 µs 10/1000 µs 500 100 2/10 µs 10/1000 µs 20 10 GR-1089 Core Second level 5000 2/10 µs 500 2/10 µs 40 GR-1089 Core Intra-building 1500 2/10 µs 100 2/10 µs 0 ITU-T-K20/K21 6000 1500 10/700 µs 150 37.5 5/310 µs 53 0 ITU-T-K20 (IEC61000-4-2) 8000 15000 1/60 ns VDE0433 4000 2000 10/700 µs 100 50 5/310 µs 21.5 0 VDE0878 4000 2000 1.2/50 µs 100 50 1/20 µs 0 0 IEC61000-4-5 4000 4000 10/700 µs 1.2/50 µs 100 100 5/310 µs 8/20 µs 21.5 0 FCC Part 68, lightning surge type A 1500 800 10/160 µs 10/560 µs 200 100 10/160 µs 10/560 µs 12.5 6.5 FCC Part 68, lightning surge type B 1000 9/720 µs 25 5/320 µs 0 Table 2. Parameter Value Unit 50 150 55 65 75 100 100 A IPP Repetitive peak pulse current (see Figure 1) 10/1000 µs 8/20 µs 10/560 µs 5/310 µs 10/160 µs 1/20 µs 2/10 µs IFS Fail-safe mode : maximum current(1) 8/20 µs 2.5 kA Non repetitive surge peak on-state current (sinusoidal) t = 0.2 s t=1s t=2s t = 15 mn 16 11.5 10 3.5 A I2t value for fusing t = 16.6 ms t = 20 ms 6.2 6.5 A2s -55 to 150 150 °C 260 °C ITSM I2t Tstg Tj TL 2/11 0 0 Absolute ratings (Tamb = 25° C) Symbol 1. ESD contact discharge ESD air discharge Storage temperature range Maximum junction temperature Maximum lead temperature for soldering during 10 s. in fail safe mode, the device acts as a short circuit SMP50 / SMTPA / TPA Table 3. Characteristics Thermal resistances Value Symbol Parameter Unit DO-15 SMA SMB Rth(j-a) Junction to ambient (with recommended footprint or with Llead = 10 mm for DO-15) 100 120 100 °C/W Rth(j-l) Junction to leads (Llead = 10 mm for DO-15) 60 30 20 °C/W Table 4. Symbol Electrical characteristics - definitions (Tamb = 25°C) Parameter VRM Stand-off voltage VBR Breakdown voltage VBO Breakover voltage IRM Leakage current IPP Peak pulse current IBO Breakover current IH Holding current VR Continuous reverse voltage IR Leakage current at VR C Capacitance 3/11 Characteristics Table 5. SMP50 / SMTPA / TPA Electrical characteristics - values (Tamb = 25°C) Types IRM @ VRM max. µA Dynamic VBO(2) Static VBO @ IBO(3) IH(4) C(5) C(6) max. max. max. min. typ. typ. V V V mA mA pF pF IR @ VR(1) max. V µA SMP50-62 / TPA62 SMTPA62 56 62 85 82 20 40 SMP50-68 / TPA68 SMTPA68 61 68 93 90 20 40 SMP50-100 / TPA100 SMTPA100 90 100 135 133 16 35 SMP50-120 / TPA120 SMTPA120 108 120 160 160 16 30 SMP50-130 / TPA130 SMTPA130 117 130 173 173 14 30 180 235 240 14 25 2 SMP50-180 / TPA180 SMTPA180 162 5 800 150 SMP50-200 / TPA200 SMTPA200 180 200 262 267 12 25 SMP50-220 / TPA220 SMTPA220 198 220 285 293 12 25 SMP50-240 / TPA240 SMTPA240 216 240 300 320 12 25 SMP50-270 / TPA270 SMTPA270 243 270 350 360 12 25 SMP50-320 / SMTPA320 290 320 400 400 12 25 1. IR measured at VR guarantee VBR min ≥ VR 2. See functional test circuit 1(Figure 9.) 3. See test circuit 2(Figure 10.) 4. See functional holding current test circuit 3(Figure 11.) 5. VR = 50 V bias, VRMS = 1 V, F = 1 MHz 6. VR = 2 V bias, VRMS = 1 V, F = 1 MHz Figure 1. Pulse waveform (10/1000 µs) % I PP Figure 2. Non repetitive surge peak on-state current versus overload duration ITSM(A) Repetitive peak pulse current 30 tr = rise time (µs) tp = pulse duration time (µs) 100 F=50Hz 25 20 15 50 10 5 0 tr 4/11 tp t t(s) 0 1E-2 1E-1 1E+0 1E+1 1E+2 1E+3 SMP50 / SMTPA / TPA Figure 3. Characteristics On-state voltage versus on-state current (typical values) Figure 4. IT(A) Relative variation of holding current versus junction temperature IH[Tj] / IH[Tj=25°C] 2.0 50 1.8 1.6 Tj=25°C 20 1.4 1.2 10 1.0 5 0.8 0.6 0.4 2 0.2 VT(V) Tj(°C) 0.0 1 0 1 2 Figure 5. 3 4 5 6 7 8 9 10 Relative variation of breakover voltage versus junction temperature -40 -20 Figure 6. VBO[Tj] / VBO[Tj=25°C] 0 20 40 60 80 100 120 Relative variation of leakage current versus reverse voltage applied (typical values) IRM[Tj] / IRM[Tj=25°C] 1.10 2000 VR=VRM 1000 1.05 100 1.00 270 V 10 0.95 62 V Tj(°C) Tj(°C) 1 0.90 -40 -20 Figure 7. 0 20 40 60 80 25 100 50 Figure 8. Variation of thermal impedance junction to ambient versus pulse duration (Printed circuit board FR4, SCu = 35 µm, recommended pad layout) 75 100 125 Relative variation of junction capacitance versus reverse voltage applied (typical values) C[VR] / C[VR=50V] Zth(j-a)(°C/W) 2.5 1E+2 Tj=25°C F=1MHz VRMS=1V 2.0 SMTPA / TPA 1E+1 1.5 SMP50 1.0 1E+0 0.5 VR(V) tp(s) 1E-1 0.0 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 1 2 5 10 20 50 100 300 5/11 Characteristics Figure 9. SMP50 / SMTPA / TPA Test circuit 1 for Dynamic IBO and VBO parameters 100 V / µs, di /dt < 10 A / µs, Ipp = 50 A 2Ω 83 Ω 45 Ω 10 µF U 66 Ω 46 µH 0.36 nF 470 Ω KeyTek 'System 2' generator with PN246I module 1 kV / µs, di /dt < 10 A / µs, Ipp = 10 A 250 Ω 26 µH 60 µF U 46 µH 47 Ω 12 Ω KeyTek 'System 2' generator with PN246I module Figure 10. Test circuit 2 for IBO and VBO parameters K ton = 20ms R1 = 140Ω R2 = 240Ω 220V 50Hz DUT Vout VBO measurement 1/4 IBO measurement TEST PROCEDURE Pulse test duration (tp = 20ms): ● for Bidirectional devices = Switch K is closed ● for Unidirectional devices = Switch K is open VOUT selection: ● Device with VBO > 200V ➔ VOUT = 250 VRMS, R1 = 140Ω ● Device with VBO ≥ 200V ➔ VOUT = 480 VRMS, R2 = 240Ω Figure 11. Test circuit 3 for dynamic IH parameters R VBAT = - 48 V Surge generator D.U.T This is a GO-NOGO test which allows to confirm the holding current (IH) level in a functional test circuit. TEST PROCEDURE 1/ Adjust the current level at the IH value by short circuiting the AK of the D.U.T. 2/ Fire the D.U.T. with a surge current ➔ IPP = 10A, 10/1000µs. 3/ The D.U.T. will come back off-state within 50ms maximum. 6/11 SMP50 / SMTPA / TPA 2 Ordering information scheme Ordering information scheme SMP 50 - xxx Series SMP = Trisil surface mount in SMA SMTP = Trisil surface mount in SMB TP = Trisil in DO-15 Repetitive Peak Pulse Current A or 50 = 50 A Voltage 62 = 62 V 3 Package information ● Epoxy meets UL94, V0 Table 6. SMA dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 b Figure 12. Footprint, dimensions in mm (inches) 1.4 2.63 1.4 (0.055) (0.103) (0.055) 1.64 (0.064) 5.43 (0.214) 7/11 Package information Table 7. SMP50 / SMTPA / TPA SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 Figure 13. Footprint, dimensions in mm (inches) 1.62 2.60 (0.064) (0.102) 1.62 (0.064) 2.18 (0.086) 5.84 (0.300) Table 8. DO-15 dimensions Dimensions C C A D B Ref. Millimeters Inches Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/11 SMP50 / SMTPA / TPA 4 Ordering Information Ordering Information Part Number Marking SMP50-62 V06 SMP50-68 V07 SMP50-100 V10 SMP50-120 V12 SMP50-130 V13 SMP50-180 V18 SMP50-200 V20 SMP50-220 V22 SMP50-240 V24 SMP50-270 V27 SMP50-320 V32 SMTPA62 U01 SMTPA68 U05 SMTPA100 U13 SMTPA120 U17 SMTPA130 U19 SMTPA180 U25 SMTPA200 U27 SMTPA220 U31 SMTPA240 U35 SMTPA270 U39 SMTPA320 U47 TPA62 TPA62RL TPA68 TPA68RL TPA100 TPA100RL TPA120 TPA130 TPA130RL TPA180 TPA180RL TPA200 TPA200RL TPA220 TPA220RL TPA240 TPA240RL TPA270 TPA270RL Package Weight Base qty Delivery mode SMA 0.068 g 5000 Tape & reel SMB 0.11 g 2500 Tape & reel 1000 Ammopack 6000 Tape & reel 1000 Ammopack 6000 Tape & reel 1000 Ammopack 6000 Tape & reel 1000 Ammopack TPA62 TPA68 TPA100 TPA120 TPA130 TPA180 TPA200 TPA220 TPA240 TPA270 DO-15 0.40 g 1000 Ammopack 6000 Tape & reel 1000 Ammopack 6000 Tape & reel 1000 Ammopack 6000 Tape & reel 1000 Ammopack 6000 Tape & reel 1000 Ammopack 6000 Tape & reel 1000 Ammopack 6000 Tape & reel 9/11 Revision History 5 10/11 SMP50 / SMTPA / TPA Revision History Date Revision Description of Changes 16-Nov-2004 1 SMP50, SMTPA and TPA datasheets merge. 30-Mar-2007 2 Reformatted to current standards. Updated IPP value in Table 2 . Added part numbers SMP50-320 and SMTPA320. Updated dimensions and footprint for SMA and footprint for SMB. 12-Jun-2007 3 Corrected typographical error in part number. Added dimensions in inches to footprint illustrations. SMP50 / SMTPA / TPA Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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