STMICROELECTRONICS TS982IDWT

TS982
Wide bandwidth dual bipolar operational amplifier
Features
■
Operating from VCC = 2.5 V to 5.5 V
■
200 mA output current on each amplifier
■
High dissipation package
■
Rail-to-rail input and output
■
Unity-gain stable
DW
SO-8 exposed-pad
(Plastic micropackage)
Applications
■
Hall sensor compensation coil
■
Servo amplifier
■
Motor driver
■
Industrial
■
Automotive
Pin connections (top view)
Output1 1
8 VCC +
Inverting Input1 2
-
Non Inverting Input1 3
+
VCC - 4
7 Output2
-
6 Inverting Input2
+
5 Non Inverting Input2
Description
The TS982 is a dual operational amplifier able to
drive 200 mA down to voltages as low as 2.7 V.
Cross Section View Showing Exposed-Pad
This pad can be connected to a (-Vcc) copper area on the PCB
The SO-8 exposed-pad package allows high
current output at high ambient temperatures
making it a reliable solution for automotive and
industrial applications.
The TS982 is stable with a unity gain.
June 2008
Rev 6
1/20
www.st.com
20
Contents
TS982
Contents
1
Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1
Exposed-pad package description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.2
Exposed-pad electrical connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.3
Thermal management benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.4
Thermal management guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.5
Parallel operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2/20
TS982
1
Absolute maximum ratings and operating conditions
Absolute maximum ratings and operating conditions
Table 1.
Absolute maximum ratings (AMR)
Symbol
Parameter
VCC
Supply voltage(1)
Vin
Input voltage
Value
Unit
6
V
-0.3 V to VCC +0.3 V
V
Toper
Operating free-air temperature range
-40 to + 125
°C
Tstg
Storage temperature
-65 to +150
°C
150
°C
45
°C/W
Tj
Maximum junction temperature
ambient(2)
Rthja
Thermal resistance junction to
Rthjc
Thermal resistance junction to case
10
°C/W
Human body model (HBM)l(3)
2
kV
1.5
kV
200
V
Latch-up immunity (all pins)
200
mA
Lead temperature (soldering, 10sec)
250
ESD
(4)
Charged device model (CDM)
Machine model
Latch-up
(MM)(5)
Output short-circuit duration
see note
°C
(6)
1. All voltage values are measured with respect to the ground pin.
2. With two sides, two-plane PCB following the EIA/JEDEC JESD51-7 standard.
3. Human body model: A 100 pF capacitor is charged to the specified voltage, then discharged through a
1.5 kΩ resistor between two pins of the device. This is done for all couples of connected pin combinations
while the other pins are floating.
4. Charged device model: all pins and the package are charged together to the specified voltage and then
discharged directly to the ground through only one pin. This is done for all pins.
5. Machine model: A 200 pF capacitor is charged to the specified voltage, then discharged directly between
two pins of the device with no external series resistor (internal resistor < 5 Ω). This is done for all couples of
connected pin combinations while the other pins are floating.
6. Short-circuits can cause excessive heating. Destructive dissipation can result from a short-circuit on one or
two amplifiers simultaneously.
Table 2.
Operating conditions
Symbol
Parameter
VCC
Supply voltage
Vicm
Common mode input voltage range
CL
Load capacitor
RL < 100 Ω
RL > 100 Ω
Value
Unit
2.5 to 5.5
V
GND to VCC
V
400
100
pF
3/20
Electrical characteristics
2
TS982
Electrical characteristics
Table 3.
Electrical characteristics for VCC+ = +5 V, VCC- = 0 V, and Tamb = 25° C
(unless otherwise specified)
Symbol
Parameter
Min.
Typ.
Max.
Unit
5.5
7.2
7.2
mA
5
7
mV
ICC
Supply current - No input signal, no load
Tmin < Top < Tmax
VIO
Input offset voltage (Vicm = VCC/2)
Tmin < Top < Tmax
1
ΔVIO
Input offset voltage drift
2
IIB
Input bias current - Vicm = VCC/2
Tmin < Top < Tmax
IIO
Input offset current
Vicm = VCC/2
VOH
VOL
200
4.2
4
VCC= 4.75V, T = 125° C, Iout = 25mA
4.3
Gain bandwidth product
RL = 32Ω
CMR
V
V
0.55
0.65
0.95
V
0.45
V
1
95
dB
2.2
MHz
Common mode rejection ratio
80
dB
SVR
Supply voltage rejection ratio
95
dB
SR
Slew rate, unity gain inverting
RL = 16Ω
0.7
V/µs
Φm
Phase margin at unit gain
RL = 16Ω, CL = 400pF
56
degrees
Gm
Gain margin
RL = 16Ω, CL = 400pF
18
dB
en
Equivalent input noise voltage
F = 1kHz
17
nV
-----------Hz
Channel separation
RL = 16Ω, F = 1kHz
100
dB
Crosstalk
4/20
nA
4.4
VCC = 4.75V, T = 125°C, Iout = 25mA
GBP
nA
4
Low level output voltage
RL = 16Ω
RL = 16Ω, Tmin < Top < Tmax
Iout = 200mA
Large signal voltage gain
RL = 16Ω
500
500
10
High level output voltage
RL = 16Ω
RL = 16Ω, Tmin < Top < Tmax
Iout = 200mA
AVD
µV/°C
1.35
0.45
TS982
Electrical characteristics
Table 4.
Symbol
Electrical characteristics for VCC+ = +3.3 V, VCC- = 0 V, and Tamb = 25° C
(unless otherwise specified)(1)
Table 5.
Parameter
Min.
Typ.
Max.
Unit
5.3
7.2
7.2
mA
5
7
mV
ICC
Supply current - No input signal, no load
Tmin < Top < Tmax
VIO
Input offset voltage (Vicm = VCC/2)
Tmin < Top < Tmax
1
ΔVIO
Input offset voltage drift
2
IIB
Input bias current - Vicm = VCC/2
Tmin < Top < Tmax
IIO
Input offset current
Vicm = VCC/2
VOH
VOL
High level output voltage
RL = 16Ω
RL = 16Ω, Tmin < Top < Tmax
Iout = 200 mA
200
Large signal voltage gain
RL = 16Ω
GBP
Gain bandwidth product
RL = 32Ω
CMR
500
500
10
2.68
2.64
nA
nA
2.85
V
2.3
Low level output voltage
RL = 16Ω
RL = 16Ω, Tmin < Top < Tmax
Iout = 200mA
AVD
µV/°C
0.45
0.52
0.65
V
1
92
dB
2
MHz
Common mode rejection ratio
75
dB
SVR
Supply voltage rejection ratio
95
dB
SR
Slew rate, unity gain inverting
RL = 16Ω
0.7
V/µs
Φm
Phase margin at unit gain
RL = 16Ω, CL = 400pF
57
degrees
Gm
Gain margin
RL = 16Ω, CL = 400pF
16
dB
en
Equivalent input noise voltage
F = 1kHz
17
nV
-----------Hz
Channel separation
RL = 16Ω, F = 1kHz
100
dB
Crosstalk
1.2
0.45
1. All electrical values are guaranteed by correlation with measurements at 2.7 V and 5 V.
5/20
Electrical characteristics
Table 6.
Electrical characteristics for VCC = +2.7 V, VCC- = 0 V, and Tamb = 25° C
(unless otherwise specified)
Symbol
Parameter
Min.
Typ.
Max.
Unit
5.3
6.4
6.4
mA
5
7
mV
ICC
Supply current - No input signal, no load
Tmin < Top < Tma
VIO
Input offset voltage (Vicm = VCC/2)
Tmin < Top < Tmax
1
ΔVIO
Input offset voltage drift
2
IIB
Input bias current - Vicm = VCC/2
Tmin < Top < Tmax
IIO
Input offset current
Vicm = VCC/2
VOH
VOL
High level output voltage
RL = 16Ω
RL = 16Ω, Tmin < Top < Tmax
Iout = 20 mA
200
Large signal voltage gain
RL = 16Ω
GBP
Gain bandwidth product
RL = 32Ω
CMR
µV/°C
500
500
10
2.3
2.25
nA
nA
2.85
V
2.3
Low level output voltage
RL = 16Ω
RL = 16Ω, Tmin < Top < Tmax
Iout = 200mA
AVD
0.45
0.37
0.42
V
1
92
dB
2
MHz
Common mode rejection ratio
75
dB
SVR
Supply voltage rejection ratio
95
dB
SR
Slew rate, unity gain inverting
RL = 16Ω
0.7
V/µs
Φm
Phase margin at unit gain
RL = 16Ω, CL = 400pF
57
degrees
Gm
Gain margin
RL = 16 Ω, CL = 400pF
16
dB
en
Equivalent input noise voltage
F = 1kHz
17
nV
-----------Hz
Channel separation
RL = 16Ω, F = 1kHz
100
dB
Crosstalk
6/20
TS982
1.2
0.45
TS982
Figure 1.
Electrical characteristics
Current consumption vs. supply
voltage
No load
Figure 2.
Ta=125 C
Vcc = 2.7V to 5V
Vicm = Vcc/2
Vid = 100mV
Output Sourcing
Testboard PCB
Ta=25 C
Ta=-40 C
Figure 3.
Voltage drop vs. output sinking
current
Figure 4.
Vcc = 2.7V to 5V
Vicm = Vcc/2
Vid = 100mV
Output Sinking
Testboard PCB
Figure 5.
Voltage drop vs. output sourcing
current
Voltage drop vs. supply voltage
(sourcing)
Vicm = Vcc/2
Vid = 100mV
Isource = 200mA
Testboard
Voltage drop vs. supply voltage
(sinking)
Figure 6.
Voltage drop vs. temperature
(Iout = 50 mA)
Vicm = Vcc/2
Vid = 100mV
Isink = 200mA
Testboard
Vcc = 5V
Vicm = Vcc/2
Vid = 100mV
Iout= 50mA
7/20
Electrical characteristics
Vcc = 5V
Vicm = Vcc/2
Vid = 100mV
Iout= 200mA
Open loop gain and phase vs.
frequency
Figure 10. Open loop gain and phase vs.
frequency
80
60
140
100
Phase
80
60
0
Phase
80
60
40
20
-20
0
-40
0.1
1
10
100
Frequency (kHz)
1000
10000
0
-20
-40
0.1
Figure 11. Open loop gain and phase vs.
frequency
1
10
100
Frequency (kHz)
1000
10000
Gain
60
Vcc = 2.7V
RL = 16Ω
Tamb = 25°C
180
80
160
140
Vcc = 5V
RL = 16Ω
Tamb = 25°C
Gain
60
Phase
80
60
0
40
20
-20
40
8/20
1
10
100
Frequency (kHz)
1000
10000
-20
140
20
100
Phase
80
60
0
40
20
-20
0
-40
0.1
160
120
Gain (dB)
20
100
Phase (Deg)
Gain (dB)
120
40
-20
Figure 12. Open loop gain and phase vs.
frequency
180
80
140
100
20
0
20
160
120
40
40
-20
Vcc = 5V
RL = 8Ω
Tamb = 25°C
Gain
120
40
180
160
0
-40
0.1
1
10
100
Frequency (kHz)
1000
10000
-20
Phase (Deg)
60
Vcc = 2.7V
RL = 8Ω
Tamb = 25°C
Phase (Deg)
180
Gain
Gain (dB)
Voltage drop vs. temperature
(Iout = 200 mA)
Vcc = 5V
Vicm = Vcc/2
Vid = 100mV
Iout= 100mA
80
20
Figure 8.
Gain (dB)
Figure 9.
Voltage drop vs. temperature
(Iout = 100 mA)
Phase (Deg)
Figure 7.
TS982
TS982
Electrical characteristics
Figure 13. Open loop gain and phase vs.
frequency
Figure 14. Open loop gain and phase vs.
frequency
180
140
Vcc = 5V
RL = 32Ω
Tamb = 25°C
Gain
60
20
100
Phase
80
60
0
40
20
100
Phase
80
60
0
40
20
-20
40
20
-20
0
-40
0.1
1
10
100
Frequency (kHz)
1000
10000
0
-20
-40
0.1
Figure 15. Open loop gain and phase vs.
frequency
1
10
100
Frequency (kHz)
1000
10000
Vcc = 2.7V
RL = 600Ω
Tamb = 25°C
Gain
60
180
80
160
140
Gain
60
Vcc = 5V
RL = 600Ω
Tamb = 25°C
Phase
60
0
Gain (dB)
80
Phase (Deg)
Gain (dB)
20
100
40
20
80
Phase
60
40
20
20
-20
0
-40
0.1
1
10
100
Frequency (kHz)
1000
10000
0
-20
-40
0.1
Figure 17. Open loop gain and phase vs.
frequency
1
10
100
1000
Frequency (kHz)
10000
Vcc = 2.7V
RL = 5kΩ
Tamb = 25°C
Gain
60
180
80
160
140
Gain
60
Vcc = 5V
RL = 5kΩ
Tamb = 25°C
60
0
40
20
-20
Gain (dB)
80
Phase
Phase (Deg)
Gain (dB)
20
100
40
1
10
100
Frequency (kHz)
1000
10000
-20
140
20
100
80
Phase
60
0
40
20
-20
0
0
-40
0.1
160
120
120
40
-20
Figure 18. Open loop gain and phase vs.
frequency
180
80
140
100
0
40
-20
160
120
120
40
-20
Figure 16. Open loop gain and phase vs.
frequency
180
80
140
120
Gain (dB)
40
Phase (Deg)
Gain (dB)
120
160
Phase (Deg)
60
180
80
160
Phase (Deg)
Vcc = 2.7V
RL = 32Ω
Tamb = 25°C
Gain
Phase (Deg)
80
-40
0.1
1
10
100
1000
Frequency (kHz)
10000
-20
9/20
Electrical characteristics
TS982
Figure 19. Phase margin vs. supply voltage
Figure 20. Gain margin vs. supply voltage
50
50
RL=8Ω
Tamb=25°C
RL=8Ω
Tamb=25°C
40
Gain Margin (dB)
Phase Margin (Deg)
40
30
CL= 0 to 500pF
20
10
30
CL=0 to 500pF
20
10
0
2.0
2.5
3.0
3.5
4.0
Power Supply Voltage (V)
4.5
0
2.0
5.0
Figure 21. Phase margin vs. supply voltage
2.5
3.0
3.5
4.0
Power Supply Voltage (V)
4.5
5.0
Figure 22. Gain margin vs. supply voltage
50
50
RL=16Ω
Tamb=25°C
40
30
Gain Margin (dB)
Phase Margin (Deg)
40
CL= 0 to 500pF
20
10
30
20
CL=0 to 500pF
10
RL=16Ω
Tamb=25°C
0
2.0
2.5
3.0
3.5
4.0
Power Supply Voltage (V)
4.5
0
2.0
5.0
Figure 23. Phase margin vs. supply voltage
2.5
3.0
3.5
4.0
Power Supply Voltage (V)
4.5
5.0
Figure 24. Gain margin vs. supply voltage
50
50
RL=32Ω
Tamb=25°C
40
CL= 0 to 500pF
Gain Margin (dB)
Phase Margin (Deg)
40
30
20
10
30
20
CL=0 to 500pF
10
RL=32Ω
Tamb=25°C
0
2.0
10/20
2.5
3.0
3.5
4.0
Power Supply Voltage (V)
4.5
5.0
0
2.0
2.5
3.0
3.5
4.0
Power Supply Voltage (V)
4.5
5.0
TS982
Electrical characteristics
Figure 25. Phase margin vs. supply voltage
Figure 26. Gain margin vs. supply voltage
70
20
CL=0pF
50
CL=0pF
Gain Margin (dB)
Phase Margin (Deg)
60
CL=500pF
40
30
20
10
CL=100pF
CL=200pF
10
CL=500pF
RL=600Ω
Tamb=25°C
0
2.0
2.5
RL=600Ω
Tamb=25°C
3.0
3.5
4.0
Power Supply Voltage (V)
4.5
0
2.0
5.0
Figure 27. Phase margin vs. supply voltage
2.5
3.0
3.5
4.0
Power Supply Voltage (V)
5.0
Figure 28. Gain margin vs. supply voltage
70
20
60
CL=0pF
50
CL=0pF
40
CL=300pF
Gain Margin (dB)
Phase Margin (Deg)
4.5
CL=500pF
30
20
10
CL=100pF
CL=500pF
RL=5kΩ
Tamb=25°C
RL=5kΩ
Tamb=25°C
0
2.0
2.5
3.0
3.5
4.0
Power Supply Voltage (V)
4.5
Figure 29. Distortion vs. output voltage
RL = 2Ω
F = 1kHz
Av = +1
BW < 80kHz
Tamb = 25°C
CL=200pF
10
Vcc=2.7V
Vcc=3.3V
Vcc=5V
5.0
0
2.0
2.5
3.0
3.5
4.0
Power Supply Voltage (V)
4.5
5.0
Figure 30. Distortion vs. output voltage
RL = 4Ω
F = 1kHz
Av = +1
BW < 80kHz
Tamb = 25°C
Vcc=2.7V
Vcc=5V
Vcc=3.3V
11/20
Electrical characteristics
TS982
Figure 31. Distortion vs. output voltage
RL = 8Ω
F = 1kHz
Av = +1
BW < 80kHz
Tamb = 25°C
Vcc=2.7V
Figure 32. Distortion vs. output voltage
RL = 16Ω
F = 1kHz
Av = +1
BW < 80kHz
Tamb = 25°C
Vcc=5V
Vcc=5V
Vcc=3.3V
Vcc=3.3V
Figure 33. Crosstalk vs. frequency
Figure 34. Crosstalk vs. frequency
100
100
80
80
ChB to ChA
ChA to ChB
60
RL=8Ω
Vcc=5V
Pout=100mW
Av=-1
Bw < 125kHz
Tamb=25°C
40
20
20
100
1000
Frequency (Hz)
Crosstalk (dB)
Crosstalk (dB)
Vcc=2.7V
ChA to ChB
60
RL=16Ω
Vcc=5V
Pout=90mW
Av=-1
Bw < 125kHz
Tamb=25°C
40
20
20
10000 20k
Figure 35. Crosstalk vs. frequency
ChB to ChA
100
1000
Frequency (Hz)
10000 20k
Figure 36. Crosstalk vs. frequency
120
100
100
ChB to ChA & ChA to Chb
60
RL=32Ω
Vcc=5V
Pout=60mW
Av=-1
Bw < 125kHz
Tamb=25°C
40
20
20
12/20
100
1000
Frequency (Hz)
10000 20k
Crosstalk (dB)
Crosstalk (dB)
80
80
ChB to ChA & ChA to Chb
60
RL=600Ω
Vcc=5V
Vout=1.4Vrms
Av=-1
Bw < 125kHz
Tamb=25°C
40
20
0
20
100
1000
Frequency (Hz)
10000 20k
TS982
Electrical characteristics
Figure 38. Equivalent input noise voltage vs.
frequency
120
Crosstalk (dB)
100
80
ChB to ChA & ChA to Chb
60
RL=5kΩ
Vcc=5V
Vout=1.5Vrms
Av=-1
Bw < 125kHz
Tamb=25°C
40
20
0
100
20
1000
Frequency (Hz)
10000 20k
Equivalent Input Noise Voltage (nv/ Hz)
Figure 37. Crosstalk vs. frequency
25
Vcc=5V
Rs=100Ω
Tamb=25°C
20
15
10
5
0.02
0.1
1
Frequency (kHz)
10
Figure 39. Power supply rejection ratio vs.
frequency
Vcc=5V
Vcc=3.3V
Vcc=2.7V
Gain = +1
pins 3 & 5 tied to Vcc/2
RL >= 8Ω
Vin=70mVrms
Vripple on pin8=100mVpp
Tamb=25°C
20
13/20
Application information
3
Application information
3.1
Exposed-pad package description
TS982
The dual operational amplifier TS982 is housed in an SO-8 exposed-pad plastic package.
As shown in Figure 40, the die is mounted and glued on a lead frame. This lead frame is
exposed as a thermal pad on the underside of the package. The thermal contact is direct
with the die and therefore, offers an excellent thermal performance in comparison with the
common SO packages. The thermal contact between the die and the exposed-pad is
characterized using the parameter Rthjc.
Figure 40. Exposed-pad plastic package
As 90% of the heat is removed through the pad, the thermal dissipation of the circuit is
directly linked to the copper area soldered to the pad. In other words, the Rthja depends on
the copper area and the number of layers of the printed circuit board under the pad.
Figure 41. TS982 test board layout: 6 cm2 of copper topside
3.2
Exposed-pad electrical connection
In the SO-8 exposed-pad package, the silicon die is mounted on the thermal pad (see
Figure 40). The silicon substrate is not directly connected to the pad because of the glue.
Therefore, the copper area of the exposed-pad must be connected to the substrate voltage
(VCC-) pin 4.
14/20
TS982
3.3
Application information
Thermal management benefits
A good thermal design is important to maintain the temperature of the silicon junction below
Tj = 150° C as given in the absolute maximum ratings and also to maintain the operating
power level.
Another effect of temperature is that the life expectancy of an integrated circuit decreases
exponentially when operating at high temperature over an extended period of time. It is
estimated that, the chip failure rate doubles for every 10° to 20° C. This demonstrates that
reducing the junction temperature is also important to improve the reliability of the amplifier.
Because of the high dissipation capability of the SO-8 exposed-pad package, the dual opamp TS982 has a lower junction temperature for high current applications in high ambient
temperatures.
3.4
Thermal management guidelines
The following guidelines are a simple procedure to determine the PCB you should use in
order to get the best from the SO-8 exposed-pad package:
1.
Determine the total power Ptotal to be dissipated by the IC.
Ptotal = ICC x VCC + Vdrop1 x Iout1+ Vdrop2 x Iout2
ICC x VCC is the DC power needed by the TS982 to operate with no load. Refer to
Figure 1: Current consumption vs. supply voltage on page 7 to determine ICC versus
VCC and versus temperature.
The other terms are the power dissipated by the two operators to source the load. If the
output signal can be assimilated to a DC signal, you can calculate the dissipated power
using the voltage drop curves versus output current, supply voltage, and temperature
(Figure 2 on page 7 to Figure 8 on page 8).
2.
Specify the maximum operating temperature, (Ta) of the TS982.
3.
Specify the maximum junction temperature (Tj) at the maximum output power. As
discussed above, Tj must be below 150°C and as low as possible for reliability
considerations.
Therefore, the maximum thermal resistance between junction and ambient Rthja is:
Rthja = (Tj - Ta)/Ptotal
Different PCBs can give the right Rthja for a given application. Figure 42 gives the Rthja of the
SO-8 exposed pad versus the copper area of a top side PCB.
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Application information
TS982
Figure 42. Rthja of the TS982 vs. top side copper area
The ultimate Rthja of the package on a 4-layer PCB under natural convection conditions, is
45° C/W by using two power planes and metallized holes.
3.5
Parallel operation
Using the two amplifiers of the TS982 in parallel mode provides a higher output current:
400 mA.
Figure 43. Parallel operation: 400 mA output current
10K
10K
Input
-
400 mA Output Current
TS981-1
+
Load
TS981-2
+
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TS982
4
Package information
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a Lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
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Package information
TS982
Figure 44. SO-8 exposed pad package mechanical drawing
Table 7.
SO-8 exposed pad package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
Inches
Max.
Min.
Max.
A
1.35
1.75
0.053
0.069
A1
0.10
0.15
0.04
0.059
A2
1.10
1.65
0.043
0.065
B
0.33
0.51
0.013
0.020
C
0.19
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
D1
E
3.1
3.80
0.122
4.00
0.150
0.157
E1
2.41
0.095
e
1.27
0.050
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
k
ddd
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Typ.
8° (max.)
0.1
0.04
TS982
5
Ordering information
Ordering information
Table 8.
Order codes
Order code
Temperature range
Package
Packing
Marking
Tube
TS982IDW
SO-8 exposed-pad
TS982IDWT
TS982I
Tape & reel
TS982IYDW(1)
-40° C to +125° C
SO-8 exposed-pad
(Automotive grade)
TS982IYDWT(1)
Tube
TS982IY
Tape & reel
1. Qualified and characterized according to AEC Q100 and Q003 or equivalent, advanced screening
according to AEC Q001 & Q 002 or equivalent.
6
Revision history
Table 9.
Document revision history
Date
Revision
02-Jan-2004
1
First release.
01-Feb- 2004
2
Order codes modified on cover page.
01-Dec-2005
3
PPAP references inserted in the datasheet see Table 5: Ordering
information on page 19.
02-Apr-2006
4
VOH and VOL limits (at VCC = 4.75 V, Tamb = 125° C) added in
Table 3. on page 4.
5
Corrections to Section 3.3: Thermal management benefits and
Section 3.4: Thermal management guidelines on page 15.
Pad size added to package mechanical data table under SO-8
exposed pad package mechanical drawing on page 18, and
stand-off value corrected.
Corrected value of VOH for VCC = 2.7 V.
6
Moved ordering information from cover page to end of document.
Added footnotes for ESD parameters in Table 1: Absolute
maximum ratings (AMR).
Added footnote for automotive grade parts in Table 8: Order
codes.
24-Oct-2006
5-Jun-2008
Changes
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TS982
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