MICROCHIP TC1411_13

TC1411/TC1411N
1A High-Speed MOSFET Drivers
Features
General Description
• Latch-Up Protected: Withstands 500 mA Reverse
Current
• Input Withstands Negative Inputs Up to 5V
• Electrostatic Discharge (ESD) Protected: 2.0 kV
(HBM) and 400V (MM)
• High Peak Output Current: 1A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 16V
• High Capacitive Load Drive Capability:
- 1000 pF in 25 ns
• Short Delay Time: 30 ns typical
• Matched Delay Times
• Low Supply Current
- With Logic ‘1’ Input: 500 µA
- With Logic ‘0’ Input: 100 µA
• Low Output Impedance: 8Ω
• Available in Space-Saving 8-pin MSOP Package
• Pinout – same as TC1410/TC1412/TC1413
The TC1411/TC1411N are 1A CMOS buffers/drivers.
They do not latch up under any conditions within their
power and voltage ratings. They are not subject to
damage when up to 5V of noise spiking of either
polarity occurs on the ground pin. They can accept,
without damage or logic upset, up to 500 mA of current
of either polarity being forced back into their output. All
terminals are fully protected against Electrostatic
Discharge (ESD) up to 2.0 kV (HBM) and 400V (MM).
As MOSFET drivers, the TC1411/TC1411N can easily
charge a 1000 pF gate capacitance in 25 ns with
matched rise and fall times. To ensure that the
MOSFET’s intended state is not affected even by large
transients, low enough impedance in both the ‘ON’ and
‘OFF’ states are provided. The leading and trailing
edge propagation delay times are also matched to
allow driving short-duration inputs with greater
accuracy.
Package Types
8-Pin MSOP/PDIP/SOIC
Applications
•
•
•
•
Switch Mode Power Supplies
Pulse Transformer Drive
Line Drivers
Relay Driver
VDD 1
8 VDD
VDD 1
IN 2
7 OUT
IN 2
6 OUT
NC 3
TC1411
NC 3
GND 4
TC1411N
5 GND GND 4
2
6,7
Inverting
8 VDD
7 OUT
6 OUT
5 GND
2
6,7
Non-Inverting
NC = No Internal Connection
Note:
 2001-2013 Microchip Technology Inc.
For proper operation, duplicate pins
must be connected together.
DS20001390E-page 1
TC1411/TC1411N
Functional Block Diagram
TC1411
VDD
Inverting
Outputs
300 mV
Output
Non-Inverting
Outputs
Input
Effective
Input C = 10 pF
4.7V
TC1411N
GND
DS20001390E-page 2
 2001-2013 Microchip Technology Inc.
TC1411/TC1411N
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.
Absolute Maximum Ratings †
Supply Voltage ..................................................... +20V
Input Voltage ...................... VDD + 0.3V to GND – 5.0V
Power Dissipation (TA ≤ 70°C)
MSOP .......................................................... 340 mW
PDIP ............................................................ 730 mW
SOIC............................................................ 470 mW
Storage Temperature Range .............. -65°C to +150°C
Maximum Junction Temperature ...................... +150°C
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over the operating temperature range with 4.5V ≤ VDD ≤ 16V.
Typical values are measured at TA = +25°C, VDD = 16V.
Parameters
Sym
Min
Typ
Max
Units
Logic ‘1’, High Input Voltage
VIH
2.0
—
—
V
Logic ‘0’, Low Input Voltage
VIL
—
—
0.8
V
Input Current
IIN
-1.0
—
1.0
µA
-10
—
10
Conditions
Input
0V ≤ VIN ≤ VDD, TA = +25°C
-40°C ≤ TA ≤ +85°C
Output
High Output Voltage
VOH
VDD – 0.025
—
—
V
DC Test
Low Output Voltage
VOL
—
—
0.025
V
DC Test
Output Resistance
RO
—
8
11
Ω
VDD = 16V, IO = 10 mA,
TA = +25°C
—
10
14
0°C ≤ TA ≤ +70°C
—
10
14
-40°C ≤ TA ≤ +85°C
Peak Output Current
IPK
—
1.0
—
A
VDD = 16V
Latch-Up Protection
Withstand Reverse Current
IREV
—
0.5
—
A
Duty cycle ≤ 2%, t ≤ 300 µs,
VDD = 16V
tR
—
25
35
ns
TA = +25°C
Switching Time (Note 1)
Rise Time
Fall Time
tF
Delay Time
Delay Time
Note 1:
tD1
tD2
—
27
40
0°C ≤ TA ≤ +70°C
—
29
40
-40°C ≤ TA ≤ +85°C, Figure 4-1
—
25
35
—
27
40
—
29
40
—
30
40
ns
TA = +25°C
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C, Figure 4-1
ns
TA = +25°C
—
33
45
0°C ≤ TA ≤ +70°C
—
35
45
-40°C ≤ TA ≤ +85°C, Figure 4-1
—
30
40
—
33
45
0°C ≤ TA ≤ +70°C
—
35
45
-40°C ≤ TA ≤ +85°C, Figure 4-1
ns
TA = +25°C
Switching times ensured by design.
 2001-2013 Microchip Technology Inc.
DS20001390E-page 3
TC1411/TC1411N
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, over the operating temperature range with 4.5V ≤ VDD ≤ 16V.
Typical values are measured at TA = +25°C, VDD = 16V.
Parameters
Sym
Min
Typ
Max
Units
IS
—
0.5
1.0
mA
—
0.1
0.15
Conditions
Power Supply
Power Supply Current
Note 1:
VIN = 3V, VDD = 16V
VIN = 0V
Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 16V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range (C)
TA
0
—
+70
ºC
Specified Temperature Range (E)
TA
-40
—
+85
ºC
Specified Temperature Range (V)
TA
-40
—
+125
ºC
Maximum Junction Temperature
TJ
—
—
+150
ºC
Storage Temperature Range
TA
-65
—
+150
ºC
Thermal Resistance, 8L-MSOP
θJA
—
211
—
ºC/W
Thermal Resistance, 8L-PDIP
θJA
—
89.3
—
ºC/W
Thermal Resistance, 8L-SOIC
θJA
—
149.5
—
ºC/W
Package Thermal Resistances
DS20001390E-page 4
 2001-2013 Microchip Technology Inc.
TC1411/TC1411N
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
500
500
TA = +25°C
400
VIN = 3V
ISUPPLY (μA)
ISUPPLY (μA)
400
300
200
100
0
VSUPPLY = 16V
VIN = 3V
6
8
10
12
14
200
100
VIN = 0V
4
300
VIN = 0V
0
16
-40
-20
VDD (V)
FIGURE 2-1:
Quiescent Supply Current
vs. Supply Voltage.
1.6
FIGURE 2-4:
vs. Temperature.
1.6
TA = +25°C
1.4
1.3
VIL
1.2
40
60
80
Quiescent Supply Current
VSUPPLY = 16V
4
VIH
1.4
1.3
VIL
1.2
6
8
10
12
14
16
1.1
-40
-20
VDD (V)
FIGURE 2-2:
Voltage.
Input Threshold vs. Supply
FIGURE 2-5:
Temperature.
TA = +85°C
40
60
80
Input Threshold vs.
20
TA = +25°C
15
10
TA = -40°C
TA = +85°C
15
TA = +25°C
10
5
5
0 4
20
25
RDS-ON (Ohms)
20
0
TEMPERATURE (°C)
25
RDS-ON (Ohms)
20
1.5
VIH
VTHRESHOLD (V)
VTHRESHOLD (V)
1.5
1.1
0
TEMPERATURE (°C)
6
8
10
VDD (V)
12
14
FIGURE 2-3:
High-State Output
Resistance vs. Supply Voltage.
 2001-2013 Microchip Technology Inc.
16
0
TA = -40°C
4
6
8
10
VDD (V)
12
14
16
FIGURE 2-6:
Low-State Output
Resistance vs. Supply Voltage.
DS20001390E-page 5
TC1411/TC1411N
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
100
100
CLOAD = 1000 pF
80
TA = +85°C
tFALL (nsec)
tRISE (nsec)
80
60
TA = +25°C
40
20
0
4
6
8
100
10
VDD (V)
60
TA = +85°C
TA = +25°C
40
20
TA = -40°C
FIGURE 2-7:
Voltage.
TA = -40°C
12
14
0
16
4
6
8
10
FIGURE 2-10:
Voltage.
Rise Time vs. Supply
100
CLOAD = 1000 pF
tD2 (nsec)
TA = +85°C
TA = +25°C
40
20
CLOAD = 1000 pF
TA = +85°C
60
TA = +25°C
40
TA = -40°C
20
4
6
8
FIGURE 2-8:
Supply Voltage.
100
10
VDD (V)
12
14
0
16
4
6
8
FIGURE 2-11:
Supply Voltage.
Propagation Delay vs.
10
VDD (V)
12
14
16
Propagation Delay vs.
36
TA = +25°C
VDD = 16V
Propagation Delays (nsec)
TA = +25°C
VDD = 16V
80
tRISE, tFALL (nsec)
16
Fall Time vs. Supply
TA = -40°C
tRISE
60
tFALL
40
20
0
14
80
60
0
12
VDD (V)
80
tD1 (nsec)
CLOAD = 1000 pF
tD2
34
32
tD1
30
28
26
0
500
1000
1500
2000
2500
3000
3500
0
500
1000
FIGURE 2-9:
Capacitive Load.
DS20001390E-page 6
Rise and Fall Times vs.
1500
2000
2500
3000
3500
CLOAD (pF)
CLOAD (pF)
FIGURE 2-12:
Capacitive Load.
Propagation Delays vs.
 2001-2013 Microchip Technology Inc.
TC1411/TC1411N
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin
No.
TC1411
MSOP, PDIP, SOIC
TC1411N
MSOP, PDIP, SOIC
1
VDD
VDD
2
IN
IN
Control input
No connection
Description
Supply input, 4.5V to 16V
3
NC
NC
4
GND
GND
Ground
5
GND
GND
Ground
6
OUT
OUT
CMOS push-pull output, common to pin 7
7
OUT
OUT
CMOS push-pull output, common to pin 6
8
VDD
VDD
Supply input, 4.5V to 16V
3.1
Supply Input (VDD)
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 16V with respect to the ground
pin. The VDD input should be bypassed to ground with
a local ceramic capacitor. The value of the capacitor is
chosen based on the capacitive load that is being
driven. A value of 1.0 µF is suggested.
3.2
Control Input (IN)
The MOSFET driver input is a high-impedance,
TTL/CMOS-compatible input. The input has 300 mV of
hysteresis between the high and low thresholds that
prevents output glitching even when the rise and fall
time of the input signal is very slow.
3.3
CMOS Push-pull Output
(OUT, OUT)
The MOSFET driver output is a low impedance, CMOS
push-pull style output, capable of driving a capacitive
load with 1A peak currents.
3.4
Ground (GND)
The ground pins are the return path for the bias current
and for the high peak currents which discharge the load
capacitor. The ground pins should be tied into a ground
plane or have very short traces to the bias supply
source return.
3.5
No Connect (NC)
No internal connection.
 2001-2013 Microchip Technology Inc.
DS20001390E-page 7
TC1411/TC1411N
4.0
APPLICATION INFORMATION
+5V
90%
Input
VDD = 16V
0V
4.7 µF
0.1 µF
1, 8
Input
10%
tD1
tD2
tF
VDD
tR
90%
90%
Output
2
6, 7
Output
10%
10%
0V
CL = 1000 pF
Inverting Driver
TC1411
TC1411
TC1411N
+5V
90%
Input
4, 5
Input: 100 kHz,
square wave,
tRISE = tFALL ≤ 10 ns
0V
VDD
10%
tD1 90%
tR
Output
0V
10%
90%
tD2
tF
10%
Non-Inverting Driver
TC1411N
FIGURE 4-1:
DS20001390E-page 8
Switching Time Test Circuit.
 2001-2013 Microchip Technology Inc.
TC1411/TC1411N
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
Example
TC1411
e3 256
CPA^^
1317
OR
TC1411
CPA256
1317
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
RoHS Compliant JEDEC designator for Matte Tin (Sn)
This package is RoHS Compliant. The RoHS Compliant JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will be carried over
to the next line, thus limiting the number of available characters for customer-specific
information.
 2001-2013 Microchip Technology Inc.
DS20001390E-page 9
TC1411/TC1411N
8-Lead SOIC (3.90 mm)
NNN
Example
TC1411C
e3 1317
OA^^
256
OR
TC1411
COA1317
256
8-Lead MSOP (3x3 mm)
Example
1411E
317256
DS20001390E-page 10
 2001-2013 Microchip Technology Inc.
TC1411/TC1411N
8$
1RWH
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2001-2013 Microchip Technology Inc.
DS20001390E-page 11
TC1411/TC1411N
UA
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001390E-page 12
 2001-2013 Microchip Technology Inc.
TC1411/TC1411N
8-Lead Plastic Micro Small Outline Package (UA) [MSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2001-2013 Microchip Technology Inc.
DS20001390E-page 13
TC1411/TC1411N
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DS20001390E-page 14
 2001-2013 Microchip Technology Inc.
TC1411/TC1411N
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2001-2013 Microchip Technology Inc.
DS20001390E-page 15
TC1411/TC1411N
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001390E-page 16
 2001-2013 Microchip Technology Inc.
TC1411/TC1411N
!
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4&'!&"&
5#*!(
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5
 2001-2013 Microchip Technology Inc.
DS20001390E-page 17
TC1411/TC1411N
NOTES:
DS20001390E-page 18
 2001-2013 Microchip Technology Inc.
TC1411/TC1411N
APPENDIX A:
REVISION HISTORY
Revision E (June 2013)
The following is the list of modifications:
• Updated the values for Electrostatic Discharge
(ESD) in the Features and General Description
columns.
• Updated the Pin Description table in Section 3.0,
Pin Descriptions.
• Updated package marking information and drawings in Section 5.0, Packaging Information.
• Minor grammatical and spelling corrections.
Revision D (September 2006)
• Added -40°C to +125°C temperature range to
Temperature Characteristics table and Product
Information System page.
• Added disclaimer to package outline drawings.
Revision C (March 2003)
• Added 8-Lead MSOP Package.
Revision B (May 2002)
• Converted TELCOM data sheet for Embedded
Control Handbook
Revision A (March 2001)
• Original Release of this Document.
 2001-2013 Microchip Technology Inc.
DS20001390E-page 19
TC1411/TC1411N
NOTES:
DS20001390E-page 20
 2001-2013 Microchip Technology Inc.
TC1411/TC1411N
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Temperature
Range
Package
Examples:
a)
b)
Device:
TC1411: 1 A Single MOSFET Driver, Inverting
TC1411N: 1 A Single MOSFET Driver, Non-Inverting
Temperature Range:
C
E
V
Package:
OA
= Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
UA
= Plastic Micro Small Outline (MSOP), 8-lead *
UA713 = Plastic Micro Small Outline (MSOP), 8-lead *
(Tape and Reel)
PA
= Plastic DIP (300 mil Body), 8-lead
c)
=
=
=
0°C to +70°C
-40°C to +85°C
-40°C to +125°C
d)
* MSOP package is only available in E-Temp.
 2001-2013 Microchip Technology Inc.
TC1411COA:
1A Single MOSFET
driver, 8LD SOIC
package, 0°C to +70°C.
TC1411CPA:
1A Single MOSFET
driver, 8LD PDIP
package, 0°C to +70°C.
TC1411EUA713: Tape and Reel, 1A
Single MOSFET driver,
8LD MSOP package,
-40°C to +85°C.
TC1411VOA713: Tape and Reel,
1A Single MOSFET
driver, 8LD SOIC
package,
-40°C to +125°C.
a)
TC1411NCPA:
b)
TC1411NEPA:
c)
TC1411NEUA:
d)
TC1411NVPA:
1A Single MOSFET
driver, 8LD PDIP
package, 0°C to +70°C.
1A Single MOSFET
driver, 8LD PDIP
package,
-40°C to +85°C.
1A Single MOSFET
driver,
8LD MSOP package,
-40°C to +85°C.
1A Single MOSFET
driver, 8LD PDIP
package,
-40°C to +125°C.
DS20001390E-page 21
TC1411/TC1411N
NOTES:
DS20001390E-page 22
 2001-2013 Microchip Technology Inc.
TC1411/TC1411N
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
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To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
 2001-2013 Microchip Technology Inc.
DS20001390E-page 23
TC1411/TC1411N
NOTES:
DS20001390E-page 24
 2001-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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conveyed, implicitly or otherwise, under any Microchip
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62077-244-7
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2001-2013 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20001390E-page 25
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS20001390E-page 26
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
11/29/12
 2001-2013 Microchip Technology Inc.