STMICROELECTRONICS BAT30LFILM

BAT30
Small signal Schottky diodes
Features
BAT30JFILM
(Single)
■
Very low conduction losses
■
Negligible switching losses
■
Low forward and reverse recovery times
■
Extremely fast switching
■
Surface mount device
■
Low capacitance diode
SOD-323
BAT30KFILM
(Single)
SOD-523
BAT30LFILM
(Single)
SOD-923
Description
The BAT30 series uses 30 V Schottky barrier
diodes encapsulated in a wide range of packages
such as SOD-323, SOD-523, SOD-923, SOT-23,
SOT-323, or SOT-666. This device is specially
suited for switching mode applications needing
low forward voltage drop diodes.
BAT30FILM
(Single)
BAT30AFILM
(Common anode)
SOT-23
BAT30SFILM
(Series)
BAT30CFILM
(Common cathode)
BAT30WFILM
(Single)
SOT-323
BAT30CWFILM
(Common cathode)
BAT30AWFILM
(Common anode)
BAT30SWFILM
(Series)
Table 1.
Device summary
Symbol
Value
IF
300 mA
VRRM
30 V
C(typ)
14 pF
Tj (max)
150 °C
October 2009
BAT30-07P6FILM
(2 parallel diodes)
SOT-666
BAT30-09P6FILM
(2 opposite diodes)
Configurations in top view
Doc ID 12564 Rev 3
1/14
www.st.com
14
Characteristics
1
BAT30
Characteristics
Table 2.
Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Symbol
VRRM
IF
Parameter
Value
Unit
Repetitive peak reverse voltage
30
V
Continuous forward current
300
mA
1
A
-65 to +150
°C
150
°C
260
°C
Value
Unit
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
tp = 10 ms Sinusoidal
Tj
Maximum operating junction temperature
TL
Maximum soldering temperature
(1)
1. Pulse test: tp = 5 ms, δ < 2 %
Table 3.
Thermal parameters
Symbol
Rth(j-a)
Parameter
Junction to ambient(1)
SOT-23
500
SOT-323, SOD-323,
550
SOD-523, SOT-666
600
SOD-923
900
°C/W
1. On epoxy printed circuit board with recommended pad layout
Table 4.
Symbol
Static electrical characteristics
Parameter
Test conditions
Min.
Typ.
Max.
VR = 5 V
-
-
0.5
VR = 10 V
-
-
1
VR = 25 V
-
0.65
3
VR = 30 V
-
-
5
-
7
20
-
18
50
IF = 0.1 mA
-
-
240
IF = 1 mA
-
-
300
IF = 10 mA
-
-
375
Tj = 25° C IF = 30 mA
-
-
430
IF = 100 mA
-
-
500
IF = 200 mA
-
-
580
IF = 300 mA
-
530
-
Tj = 25 °C
IR(1)
Reverse leakage current
Tj = 70 °C
Tj = 85 °C
VF(2)
Forward voltage drop
VR = 10 V
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
2/14
Doc ID 12564 Rev 3
Unit
µA
mV
BAT30
Characteristics
Table 5.
Dynamic characteristics
Symbol
Test conditions
Parameter
C
Diode capacitance
Figure 1.
Min.
Typ
Max.
VR = 0 V, F = 1 MHz
-
22
-
VR = 1 V, F = 1 MHz
-
14
-
VR = 10 V, F = 1 MHz
-
6
-
Power dissipation versus average
forward current
Figure 2.
Unit
pF
Average forward current versus
ambient temperature (δ = 1)
IF(AV) (A)
P (W)
0.175
0.35
δ=0.05
0.150
δ=0.1
δ=1
δ=0.5
δ=0.2
0.30
0.125
0.25
0.100
0.20
0.075
0.15
0.050
0.10
T
0.025
IF(AV) (A)
0.000
0.00
δ=tp/T
T
0.05
tp
δ=tp/T
Tamb (° C)
tp
0.00
0.05
Figure 3.
0.10
0.15
0.20
0.25
0.30
0.35
Relative variation of thermal
impedance junction to ambient
versus pulse duration
0
25
Figure 4.
50
75
100
125
150
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Zth(j-a) /Rth(j-a)
Zth(j-a) /Rth(j-a)
1.E+00
1.E+00
Single pulse
SOT-23
Single pulse
SOT-323/SOD-323
Epoxy printed board FR4
Copper surface = 2.25 mm2
Coppr thickness = 35 µm
1.E-01
1.E-01
1.E-02
Alumine substrate
10 x 8 x 0.5 mm
1.E-02
1.E-03
tP(s)
tP(s)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E-03
1.E-03
Doc ID 12564 Rev 3
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
3/14
Characteristics
Figure 5.
BAT30
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Figure 6.
Zth(j-a) /Rth(j-a)
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Zth(j-a) /Rth(j-a)
1.E+00
1.E+00
Single pulse
SOT-666
Single pulse
SOD-923
Epoxy printed board FR4
Coppr thickness = 35 µm
1.E-01
1.E-01
tP(s)
tP(s)
1.E-02
1.E-03
1.E-02
Figure 7.
1.E-01
1.E+00
1.E+01
Relative variation of thermal
impedance junction to ambient
versus pulse duration
1.E-02
1.E-03
Figure 8.
Zth(j-a) /Rth(j-a)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Thermal resistance junction to
ambient versus copper surface
under each lead (SOD-923)
Rth(j-a) (°C/W)
1.E+00
900
Single pulse
SOD-523
Epoxy printed board FR4
Copper thichness = 35 µm
800
Epoxy printed board FR4
Coppr thickness = 35 µm
700
1.E-01
600
500
400
300
1.E-02
200
100
tP(s)
SCU(cm²)
0
1.E-03
1.E-03
1.E-02
Figure 9.
1.E-01
1.E+00
1.E+01
Thermal resistance junction to
ambient versus copper surface
under each lead (SOD-323)
Rth(j-a) (°C/W)
0.0
Epoxy printed board FR4
Copper thichness = 35 µm
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Figure 10. Leakage current versus reverse
applied voltage (typical values)
1.E+04
600
0.2
IR (µA)
Tj=150°C
1.E+03
Tj=125°C
500
1.E+02
Tj=85°C
1.E+01
400
1.E+00
Tj=25°C
300
1.E-01
200
1.E-02
0
4/14
VR (V)
SCU(mm²)
5
10
15
20
25
30
35
40
45
50
0
Doc ID 12564 Rev 3
5
10
15
20
25
30
BAT30
Characteristics
Figure 11. Relative variation of reverse
leakage current versus junction
temperature (typical values)
Figure 12. Junction capacitance versus
reverse applied voltage
(typical values)
IR[T j] / IR[T j=25°C]
C(pF)
1.E+04
100
VR=30 V
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
1.E+03
1.E+02
1.E+01
10
1.E+00
1.E-01
Tj(°C)
VR(V)
1
1.E-02
-40
-20
0
20
40
60
80
100
120
140
160
Figure 13. Forward voltage drop versus
forward current (typical values)
1.E+01
1
10
Figure 14. Forward voltage drop versus
forward current (typical values)
IFM(A)
IFM(A)
1.E+01
1.E+00
1.E-01
100
1.E+00
Tj=150 °C
1.E-01
Tj=125 °C
Tj=25 °C
Tj=85 °C
1.E-02
1.E-02
Tj=-40 °C
1.E-03
1.E-03
VFM(V)
VFM(V)
1.E-04
0.0
1.E-04
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
0.0
Doc ID 12564 Rev 3
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
5/14
Ordering information scheme
2
BAT30
Ordering information scheme
Figure 15. Ordering information scheme
BAT30
Signal Schottky diodes
VRRM = 30 V
Configuration
Blank = Single diode
A = Common anode
C = Common cathode
S = Series diodes
07 = Parallel diodes
09 = Opposite diodes
Package
Blank = SOT-23
J = SOD-323
K = SOD-523
L = SOD-923
P6 = SOT-666
W = SOT-323
Packing
FILM = Tape and reel
6/14
Doc ID 12564 Rev 3
xx
xx
FILM
BAT30
3
Package information
Package information
●
Epoxy meets UL94, V0
●
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 6.
SOD-323 dimensions
Dimensions
Ref.
H
Millimeters
Inches
A1
Min.
Max.
Min.
Max.
A
-
1.17
-
0.046
A1
0
0.1
0
0.004
b
0.25
0.44
0.01
0.017
c
0.1
0.25
0.004
0.01
D
1.52
1.8
0.06
0.071
E
1.11
1.45
0.044
0.057
H
2.3
2.7
0.09
0.106
L
0.1
0.46
0.004
0.02
Q1
0.1
0.41
0.004
0.016
b
E
A
D
c
Q1
L
Figure 16. SOD-323 footprint (dimensions in mm)
3.20
0.30
1.06
1.08
Doc ID 12564 Rev 3
1.06
7/14
Package information
Table 7.
BAT30
SOD-523 dimensions
Dimensions
E
Ref.
0.15 M C A B
E1
Millimeters
B
D
2xb
0.20 M C A B
A
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.50
0.60
0.70
0.020
0.024
0.028
E
1.50
1.60
1.70
0.059
0.063
0.067
E1
1.10
1.20
1.30
0.043
0.047
0.051
D
0.70
0.80
0.90
0.028
0.031
0.035
b
0.25
-
0.35
0.010
-
0.014
c
0.07
-
0.20
0.003
-
0.008
L
0.15
0.20
0.25
0.006
0.008
0.010
L1
0.05
-
0.20
0.002
-
0.008
8°
R0.1
A
c
SEATING PLANE
C
7°
L
L1
Figure 17. SOD-523 footprint (dimensions in mm)
0.7
0.3
2
8/14
Doc ID 12564 Rev 3
BAT30
Package information
Table 8.
SOD-923 dimensions
Dimensions
L
Ref.
Millimeters
Min.
Typ.
A
C
A
b
Max.
Inches
Min.
Typ.
0.40
Max.
0.016
b
0.25
0.30
0.35
0.010
0.012
0.014
c
0.08
0.145
0.21
0.003
0.006
0.008
D
0.55
0.60
0.65
0.022
0.024
0.026
E
0.95
1.00
1.05
0.037
0.039
0.041
E1
0.75
0.825
0.90
0.030
0.032
0.035
L
-
-
0.20
-
-
0.008
D
E1
E
Figure 18. SOD-923 footprint (dimensions in mm)
0.37
0.34
0.58
1.32
Doc ID 12564 Rev 3
9/14
Package information
Table 9.
BAT30
SOT-23 dimensions
Dimensions
Ref.
Millimeters
A
Inches
Min.
Max.
Min.
Max.
A
0.89
1.4
0.035
0.055
A1
0
0.1
0
0.004
B
0.3
0.51
0.012
0.02
c
0.085
0.18
0.003
0.007
D
2.75
3.04
0.108
0.12
e
0.85
1.05
0.033
0.041
e1
1.7
2.1
0.067
0.083
E
1.2
1.6
0.047
0.063
H
2.1
2.75
0.083
0.108
E
e
B
D
e1
S
A1
L
c
H
L
0.6 typ.
S
0.35
0.65
Figure 19. SOT-23 footprint (dimensions in mm)
0.95
0.61
1.26
0.73
10/14
3.25
Doc ID 12564 Rev 3
0.024 typ.
0.014
0.026
BAT30
Package information
Table 10.
SOT-323 dimensions
Dimensions
Ref.
A
E
e
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.8
-
1.1
0.031
-
0.043
A1
0.0
-
0.1
0.0
-
0.004
b
0.25
-
0.4
0.010
-
0.016
c
0.1
-
0.26
0.004
-
0.010
D
1.8
2.0
2.2
0.071
0.079
0.086
E
1.15
1.25
1.35
0.045
0.049
0.053
e
-
0.65
-
-
0.026
-
H
1.8
2.1
2.4
0.071
0.083
0.094
L
0.1
0.2
0.3
0.004
0.008
0.012
q
0
-
30°
0
-
30°
D
b
A1
c
θ
L
H
Figure 20. SOT-323 footprint (dimensions in mm)
0.95
1.0
0.8
Doc ID 12564 Rev 3
2.9
0.50
11/14
Package information
BAT30
Table 11.
SOT-666 dimensions
Dimensions
b1
Ref.
Millimeters
Inches
L1
L3
Min.
Typ.
A
0.45
-
A3
0.08
b
Max.
Min.
Typ.
Max.
0.60 0.018
-
0.024
-
0.18 0.003
-
0.007
0.17
-
0.34 0.007
-
0.013
b1
0.19
0.27
D
1.50
-
1.70 0.059
-
0.067
E
1.50
-
1.70 0.059
-
0.067
E1
1.10
-
1.30 0.043
-
0.051
e
-
0.50
-
-
0.020
-
L1
-
0.19
-
-
0.007
-
L2
0.10
L3
-
b
D
E1
0.34 0.007 0.011 0.013
A
L2
E
A3
0.30 0.004
0.012
e
0.10
Figure 21. SOT-666 footprint (dimensions in mm)
0.50
0.62
0.99
0.30
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Doc ID 12564 Rev 3
2.60
-
-
0.004
-
BAT30
4
Ordering information
Ordering information
Table 12.
5
Ordering information
Order code
Marking
Package
Weight
Base qty
Packing mode
BAT30-07P6FILM
P3
SOT-666 Parallel
2.9 mg
5000
Tape and reel
BAT30-09P6FILM
Q3
SOT-666 Opposite
2.9 mg
5000
Tape and reel
BAT30AFILM
A30
SOT-23
Common anode
10 mg
3000
Tape and reel
BAT30AWFILM
A30
SOT-323
Common anode
6 mg
3000
Tape and reel
BAT30CFILM
C30
SOT-23
Common cathode
10 mg
3000
Tape and reel
BAT30CWFILM
C30
SOT-323
Common cathode
6 mg
3000
Tape and reel
BAT30FILM
B30
SOT-23 Single
10 mg
3000
Tape and reel
BAT30JFILM
30
SOD-323 Single
5 mg
3000
Tape and reel
BAT30KFILM
30
SOD-523 Single
1.4 mg
3000
Tape and reel
BAT30LFILM
31
SOD-923 Single
0.56 mg
10000
Tape and reel
BAT30SFILM
S30
SOT-23 Serial
10 mg
3000
Tape and reel
BAT30SWFILM
S30
SOT-323 Serial
6 mg
3000
Tape and reel
BAT30WFILM
B30
SOT-323 Single
6 mg
3000
Tape and reel
Revision history
Table 13.
Document revision history
Date
Revision
Changes
24-Jul-2006
1
First issue
08-Jul-2009
2
Added SOD-923 package. Table 12 sorted on alphabetic sequence
of order code. Updated ECOPACK statement.
13-Oct-2009
3
Updated Table 7 quote “L1” from 0.10 to 0.05.
Doc ID 12564 Rev 3
13/14
BAT30
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