AOSMD AO8806

Dec 2002
AO8806
Common-Drain Dual N-Channel Enhancement Mode Field Effect
Transistor
General Description
Features
The AO8806 uses advanced trench technology to
provide excellent RDS(ON), low gate charge and
operation with gate voltages as low as 1.8V. This
device is suitable for use as a uni-directional or bidirectional load switch, facilitated by its commondrain configuration.
VDS (V) = 20V
ID = 6 A
RDS(ON) < 25mΩ (VGS = 4.5V)
RDS(ON) < 30mΩ (VGS = 2.5V)
RDS(ON) < 40mΩ (VGS = 1.8V)
TSSOP-8
Top View
D1/D2
S1
S1
G1
1
2
3
4
8
7
6
5
D1
D2
D1/D2
S2
S2
G2
G1
G2
S1
S2
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
TA=25°C
Continuous Drain
Current A
Pulsed Drain Current
ID
IDM
TA=70°C
B
Junction and Storage Temperature Range
Alpha & Omega Semiconductor, Ltd.
±8
V
30
1.5
W
1.08
TJ, TSTG
°C
-55 to 150
Symbol
t ≤ 10s
Steady-State
Steady-State
A
5.4
PD
TA=70°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
Maximum Junction-to-Lead C
Units
V
6.4
TA=25°C
Power Dissipation A
Maximum
20
RθJA
RθJL
Typ
64
89
53
Max
83
120
70
Units
°C/W
°C/W
°C/W
AO8806
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=250µA, VGS=0V
VDS=16V, VGS=0V
20
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
Gate Threshold Voltage
VDS=0V, VGS=±8V
VDS=VGS ID=250µA
On state drain current
VGS=4.5V, VDS=5V
VGS=4.5V, ID=6A
VGS(th)
ID(ON)
RDS(ON)
gFS
VSD
IS
Static Drain-Source On-Resistance
0.4
TJ=125°C
VGS=2.5V, ID=5A
VGS=1.8V, ID=4A
VDS=5V, ID=5A
Qgd
tD(on)
tr
tD(off)
tf
trr
Qrr
VGS=0V, VDS=10V, f=1MHz
Reverse Transfer Capacitance
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
VGS=4.5V, VDS=10V, ID=6A
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
VGS=5V, VDS=10V, RL=1.8Ω,
RGEN=6Ω
IF=6A, dI/dt=100A/µs
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=6A, dI/dt=100A/µs
Units
V
µA
0.6
100
1
nA
V
19.3
27.6
24
25
35
30
mΩ
30.5
23
40
mΩ
0.76
1
2.5
30
Forward Transconductance
Diode Forward Voltage
IS=1A,VGS=0V
Maximum Body-Diode Continuous Current
Output Capacitance
Max
1
5
TJ=55°C
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Crss
Typ
15
A
mΩ
S
940
157
pF
pF
133
pF
15
nC
1
4
nC
nC
6.5
9
56.5
13.2
ns
ns
ns
ns
22.4
8.4
ns
nC
A: The value of R θJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any a given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance
rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The
SOA curve provides a single pulse rating.
Alpha & Omega Semiconductor, Ltd.
V
A
AO8806
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
20
30
8V
VDS=5V
25
20
3V
15
125°C
16
12
2.5V
25°C
ID(A)
ID (A)
2V
4.5V
VGS=1.5V
8
10
4
5
0
0
0
1
2
3
4
5
0
0.5
50
Normalized On-Resistance
RDS(ON) (mΩ)
1.5
2
2.5
1.60
VGS=1.8V
40
30
VGS=2.5V
20
VGS=4.5V
10
VGS=2.5V
ID=6A
VGS=4.5V
1.40
VGS=1.8V
1.20
1.00
0
5
10
15
20
25
50
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
60
1.0E+01
ID=6A
55
1.0E+00
50
45
125°C
1.0E-01
40
35
IS (A)
RDS(ON) (mΩ)
1
VGS(Volts)
Figure 2: Transfer Characteristics
VDS (Volts)
Fig 1: On-Region Characteristics
125°C
30
1.0E-02
25°C
1.0E-03
25
20
1.0E-04
25°C
15
1.0E-05
10
0
2
4
6
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
8
0.0
0.2
0.4
0.6
0.8
VSD (Volts)
Figure 6: Body-Diode Characteristics
1.0
AO8806
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
2000
5
VDS=10V
ID=6A
VGS (Volts)
4
1750
1500
Ciss
1250
3
1000
2
750
Coss
500
1
Crss
250
0
0
0
2
4
6
8
10
12
14
16
18
0
5
10
15
20
Qg (nC)
Figure 7: Gate-Charge Characteristics
10.0
TJ(Max)=150°C
TA=25°C
40
RDS(ON)
limited
100µs
1ms
0.1s
TJ(Max)=150°C
TA=25°C
30
10µs
Power (W)
ID (Amps)
100.0
10ms
1.0
20
10
1s
10s
DC
0
0.001
0.1
0.1
1
10
100
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
ZθJA Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=83°C/W
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
VDS (Volts)
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
T
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
100
1000