AOSMD AO4472

AO4472
N-Channel Enhancement Mode Field Effect Transistor
General Description
Features
The AO4472 uses advanced trench technology to provide
excellent RDS(ON), shoot-through immunity, body diode
characteristics and ultra-low gate resistance. This device is
ideally suited for use as a low side switch in Notebook CPU
core power conversion. Standard Product AO4472 is Pbfree (meets ROHS & Sony 259 specifications). AO4472L is
a Green Product ordering option. AO4472 and AO4472L
are electrically identical.
VDS (V) = 30V
ID = 19A (VGS = 10V)
RDS(ON) < 5.2mΩ (VGS = 10V)
RDS(ON) < 7.2mΩ (VGS = 4.5V)
D
S
S
S
G
D
D
D
D
G
SOIC-8
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
TA=25°C
Continuous Drain
Current A
Pulsed Drain Current
ID
IDM
TA=70°C
B
Junction and Storage Temperature Range
Alpha & Omega Semiconductor, Ltd.
±20
V
80
3
W
2.1
TJ, TSTG
°C
-55 to 150
Symbol
t ≤ 10s
Steady-State
Steady-State
A
16
PD
TA=70°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
Maximum Junction-to-Lead C
Units
V
19
TA=25°C
Power Dissipation
Maximum
30
RθJA
RθJL
Typ
31
59
16
Max
40
75
24
Units
°C/W
°C/W
°C/W
AO4472
Electrical Characteristics (T J=25°C unless otherwise noted)
Parameter
Symbol
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=250µA, VGS=0V
1
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±20V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=250µA
1
ID(ON)
On state drain current
VGS=10V, VDS=5V
80
RDS(ON)
Static Drain-Source On-Resistance
TJ=55°C
5
VGS=10V, ID=19A
IS=1A,VGS=0V
Diode Forward Voltage
Maximum Body-Diode Continuous Current
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
Qg(4.5V) Total Gate Charge
V
A
7.5
6
7.2
mΩ
1
V
4.5
A
6060
7270
pF
638
960
pF
355
530
pF
0.45
0.9
Ω
80
103
124
nC
37
48
58
nC
VDS=5V, ID=19A
mΩ
82
0.7
VGS=0V, VDS=15V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
VGS=10V, VDS=15V, ID=19A
nA
2.5
5.2
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
100
6.1
VGS=4.5V, ID=15A
Forward Transconductance
1.9
µA
4.3
TJ=125°C
VSD
Units
V
VDS=24V, VGS=0V
Zero Gate Voltage Drain Current
gFS
Max
30
IDSS
IS
Typ
S
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
15
tD(on)
Turn-On DelayTime
12
16
ns
tr
Turn-On Rise Time
8
12
ns
tD(off)
Turn-Off DelayTime
51.5
70
ns
tf
Turn-Off Fall Time
8.8
14
ns
33.5
44
22
30
ns
nC
VGS=10V, VDS=15V, RL=0.8Ω,
RGEN=3Ω
IF=19A, dI/dt=100A/µs
trr
Body Diode Reverse Recovery Time
Qrr
Body Diode Reverse Recovery Charge IF=19A, dI/dt=100A/µs
18
nC
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The value
in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA
curve provides a single pulse rating.
Rev 0: May 2006
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
AO4472
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
80
60
10V
70
50
3.5V
60
4.5V
40
40
ID(A)
50
ID (A)
VDS=5V
3.0V
30
125°C
30
20
20
10
25°C
10
VGS=2.5V
0
0
0
1
2
3
4
5
1
1.5
VDS (Volts)
Fig 1: On-Region Characteristics
2.5
3
3.5
VGS(Volts)
Figure 2: Transfer Characteristics
8.0
Normalized On-Resistance
1.6
7.0
VGS=4.5V
RDS(ON) (mΩ)
2
6.0
5.0
VGS=10V
4.0
3.0
ID=19A
VGS=4.5V
1.4
VGS=10V
1.2
1
0.8
0
20
40
60
80
0
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
1.0E+02
15
ID=19A
1.0E+01
12
9
IS (A)
RDS(ON) (mΩ)
1.0E+00
125°C
6
1.0E-01
125°C
25°C
1.0E-02
1.0E-03
25°C
3
1.0E-04
1.0E-05
0
2
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
0.0
0.2
0.4
0.6
0.8
VSD (Volts)
Figure 6: Body-Diode Characteristics
1.0
AO4472
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
8000
10
VDS=15V
ID=19A
Capacitance (pF)
VGS (Volts)
8
6
4
2
4000
2000
0
0
20
40
60
80
100
Ciss
6000
Crss
0
120
0
5
15
20
25
VDS (Volts)
Figure 8: Capacitance Characteristics
Qg (nC)
Figure 7: Gate-Charge Characteristics
100.0
100µs
10ms
80
1ms
0.1s
1s
10s
DC
1.0
40
0
0.001
0.1
1
10
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
100
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
ZθJA Normalized Transient
Thermal Resistance
60
20
TJ(Max)=150°C
TA=25°C
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=40°C/W
0.01
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
0.01
0.00001
30
TJ(Max)=150°C
TA=25°C
10µs
Power (W)
ID (Amps)
10.0
10
10
100
RDS(ON)
limited
0.1
Coss
Single Pulse
0.0001
0.001
0.01
0.1
1
T
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
100
1000