TI TPS22934YZVR

TPS22934
www.ti.com
SLVSAD4 – AUGUST 2010
ULTRA-SMALL, LOW-INPUT-VOLTAGE, LOW rON LOAD SWITCH
WITH HYSTERESIS CONTROL INPUT
Check for Samples: TPS22934
FEATURES
1
•
•
•
•
•
•
•
•
•
Integrated Single-Channel Load Switch
Ultra Small CSP-4 package
0.9 mm x 0.9 mm, 0.5-mm Pitch, 0.5-mm Thick
Input Voltage: 1.5 V to 3.6 V
Ultra-Low ON Resistance
– rDS(ON) = 63 mΩ at VIN = 3.6 V
– rDS(ON) = 69 mΩ at VIN = 2.5 V
– rDS(ON) = 78 mΩ at VIN = 1.8 V
– rDS(ON) = 87 mΩ at VIN = 1.5 V
1-A Maximum Continuous Switch Current
Integrated Hysteresis Enable Input (ON Pin)
Allows Easy Power Rail Sequencing
Controlled Slew Rate Option: 26 µs at 3.6 V
Quick Output Discharge Transistor
ESD Performance Tested Per JESD 22
– 3000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
DESCRIPTION
The TPS22934 is a small, ultra low ON-resistance
(rON) load switch with controlled turn on. The devices
contain a P-channel MOSFETs that can operate over
an input voltage range of 1.5 V to 3.6 V.
The switch is controlled by an on/off input (ON),
which has built in hysteresis (VTH+(typ) = 2.35 V)
allowing an easy use of TPS22934 in power-rail
sequencing applications.
In TPS22934 a 35-Ω on-chip load resistor is added
for output quick discharge when switch is turned off.
In TPS22934, the rise time of the device is internally
controlled in order to avoid inrush current. TPS22934
feature a typical rise time of 26 µs with a 3.6-V input.
The TPS22934 is available in an ultra-small
space-saving
4-pin
CSP
package
and
is
characterized for operation over the free-air
temperature range of –40ºC to 85ºC.
TYPICAL APPLICATION
1.8-V Power Rail Sequencing
APPLICATIONS
•
•
•
•
•
•
•
•
•
Battery Powered Equipment
Portable Industrial Equipment
Portable Medical Equipment
Portable Media Players
Point Of Sales Terminal
GPS Devices
Digital Cameras
Portable Instrumentation
Smartphones
FEATURE LIST
TPS22934
rON (TYP)
AT 3.6 V
SLEW RATE
(TYP)
AT 3.6 V
QUICK
OUTPUT
DISCHARGE
MAXIMUM
OUTPUT
CURRENT
ENABLE
63 mΩ
26 µs
Yes
1A
Hysteresis Input
VTH+(typ) = 2.35 V
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
TPS22934
SLVSAD4 – AUGUST 2010
www.ti.com
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 85°C
(1)
(2)
(3)
ORDERABLE PART NUMBER
DSBGA – YZP (0.5-mm pitch)
Tape and reel
TPS22934YZVR
Tape and reel
TPS22934YZVT
TOP-SIDE MARKING (3)
____62
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
The actual top-side marking has four preceding characters to denote year, month, sequence code, and the wafer fab/assembly site. Pin
1 identifier indicates solder-bump composition (1 = SnPb, ● = Pb-free).
+--- ------ -+
|
|
| YM SN
|
|
62
|
| O
|
+--- ------ -+
Y
M
S
4TH CHAR
LINE 2
O
=
=
=
=
=
=
YEA R
MON TH
LOT S E Q U E N C E
W A F E R F A B / A S S E M B L Y SITE CODE
D E V I C E N A M E CODE
PIN ONE ( FILLED C I R C L E )
YZV PACKAGE
TERMINALS ASSIGNMENTS (YZP PACKAGE)
B
ON
GND
A
VIN
VOUT
2
1
TERMINAL FUNCTIONS
NO.
2
NAME
DESCRIPTION
B1
GND
Ground
B2
ON
Switch control input, active high. Do not leave floating
A1
VOUT
Switch output
A2
VIN
Switch input, bypass this input with a ceramic capacitor to ground
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
TPS22934
www.ti.com
SLVSAD4 – AUGUST 2010
BLOCK DIAGRAM
FUNCTION TABLE
ON (Control Signal)
VIN to VOUT
VON < VTH-
OFF
VOUT to GND
ON
VON > VTH+
ON
OFF
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
3
TPS22934
SLVSAD4 – AUGUST 2010
www.ti.com
ABSOLUTE MAXIMUM RATINGS (1)
VIN
Input voltage range
VOUT
Output voltage range
VON
Control input voltage range
IMAX
Maximum continuous switch current, TA = -40°C to 85°C
IPLS
Maximum pulsed switch current, 100-µs pulse, 2% duty cycle, TA = -40°C to 85°C
TA
Operating free-air temperature range
Tstg
Storage temperature range
ESD
(1)
MIN
MAX
–0.3
4
V
VIN + 0.3
V
4
V
1
A
–0.3
–40
–65
Electrostatic discharge protection
UNIT
1.4
A
85
°C
150
°C
Human-Body Model (HBM)
3000
Charged-Device Model (CDM)
1000
V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
BOARD
PACKAGE
RqJC
RqJA
DERATING
FACTOR
ABOVE
TA = 25°C
TA < 25°C
TA = 70°C
TA = 85°C
High-K (1)
YZV
28.18°C/W
120.62°C/W
-8.2904 mW/°C
829.04 mW
455.97 mW
331.61 mW
(1)
The JEDEC high-K (2s2p) board used to derive this data was a 3- × 3-inch, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
RECOMMENDED OPERATING CONDITIONS
VIN
Input voltage
VON
Control input voltage
VOUT
Output voltage
CIN
(1)
4
MIN
MAX
1.5
3.6
0
3.6
VIN
Input capacitance
1
(1)
UNIT
V
V
µF
See the Input Capacitor section in Application Information.
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
TPS22934
www.ti.com
SLVSAD4 – AUGUST 2010
ELECTRICAL CHARACTERISTICS
VIN = 1.5 V to 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN TYP (1)
MAX UNIT
IIN
Quiescent current
IOUT = 0, VIN = VON = 3.6 V
Full
3.5
20
µA
IIN(OFF)
OFF-state supply
current
VON = GND, VOUT = 0
Full
2.5
5
µA
25°C
63
77
VIN = 3.6 V
VIN = 2.5 V
rON
ON-state resistance
IOUT = -200 mA
VIN = 1.8 V
VIN = 1.5 V
rPD
Output pulldown
resistance
VIN = 3.3 V, VON < VTH-, IOUT = 30 mA
ION
ON input bias current
UVLO
Undervoltage lockout
VTH+
Positive going ON
voltage threshold
VTHΔVTH
(1)
Full
80
25°C
69
Full
85
89
25°C
78
Full
96
mΩ
100
25°C
87
Full
107
115
25°C
35
65
Ω
VON = 1.5 V to 3.6 V or GND
Full
0.7
1.5
µA
VIN increasing
Full
0.8
1.05
1.4
Full
0.7
0.95
1.3
VIN = 1.5 V to 3.6 V
Full
2.1
2.35
2.7
V
Negative going ON
voltage threshold
VIN = 1.5 V to 3.6 V
Full
1.3
1.45
1.6
V
Hysteresis
(VTH+ – VTH-)
VIN = 1.5 V to 3.6 V
Full
0.7
0.9
1.1
V
VIN decreasing
VON = 3.6 V,
IOUT = -100 mA
V
Typical values are at VIN = 3.3 V and TA = 25°C.
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
5
TPS22934
SLVSAD4 – AUGUST 2010
www.ti.com
SWITCHING CHARACTERISTICS
VIN = 3.6 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tON
Turn-ON time
RL = 500 Ω, CL = 0.1 µF
33
µs
tOFF
Turn-OFF time
RL = 500 Ω, CL = 0.1 µF
17
µs
tr
VOUT rise time
RL = 500 Ω, CL = 0.1 µF
26
µs
tf
VOUT fall time
RL = 500 Ω, CL = 0.1 µF
7.5
µs
SWITCHING CHARACTERISTICS
VIN = 2.5 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tON
Turn-ON time
RL = 500 Ω, CL = 0.1 µF
42
µs
tOFF
Turn-OFF time
RL = 500 Ω, CL = 0.1 µF
17
µs
tr
VOUT rise time
RL = 500 Ω, CL = 0.1 µF
31
µs
tf
VOUT fall time
RL = 500 Ω, CL = 0.1 µF
8
µs
SWITCHING CHARACTERISTICS
VIN = 1.8 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tON
Turn-ON time
RL = 500 Ω, CL = 0.1 µF
54
µs
tOFF
Turn-OFF time
RL = 500 Ω, CL = 0.1 µF
15
µs
tr
VOUT rise time
RL = 500 Ω, CL = 0.1 µF
37
µs
tf
VOUT fall time
RL = 500 Ω, CL = 0.1 µF
10
µs
SWITCHING CHARACTERISTICS
VIN = 1.5 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tON
Turn-ON time
RL = 500 Ω, CL = 0.1 µF
64
µs
tOFF
Turn-OFF time
RL = 500 Ω, CL = 0.1 µF
14
µs
tr
VOUT rise time
RL = 500 Ω, CL = 0.1 µF
42
µs
tf
VOUT fall time
RL = 500 Ω, CL = 0.1 µF
12
µs
6
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
TPS22934
www.ti.com
SLVSAD4 – AUGUST 2010
PARAMETER MEASURMENT INFORMATION
VON
VON
VOUT
Figure 1. Test Circuit and tON/tOFF Waveforms
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
7
TPS22934
SLVSAD4 – AUGUST 2010
www.ti.com
TYPICAL CHARACTERISTICS
ON Resistance vs Input Voltage
IOUT = -200 mA
ON Resistance (Ohm)
0.120
0.100
0.080
0.060
0.040
25C
0.020
85C
-40C
0.000
1.5
1.8
2.5
3.3
3.6
VIN (V)
ON Resistance vs Temperature
VIN = 3.6 V, IOUT = -200 mA
ON Resistance (Ohm)
0.080
0.070
0.060
0.050
0.040
0.030
0.020
0.010
0.000
-40.00
25.00
85.00
Temperature (°C)
8
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
TPS22934
www.ti.com
SLVSAD4 – AUGUST 2010
TYPICAL CHARACTERISTICS (continued)
IIN (Quiescent Current) vs Input Voltage
VON = VIN = 3.6 V, IOUT = 0
Quiescent Current (A)
3.5E-06
3.0E-06
2.5E-06
2.0E-06
1.5E-06
1.0E-06
25C
5.0E-07
85C
0.0E+00
-40C
4
3.5
3
2.5
2
1.5
1
0.5
0
-5.0E-07
Input Voltage (V)
OFF Current (IINOFF ) vs Input Voltage
VON = 0 V
4.0E-06
OFF Current (A)
3.5E-06
3.0E-06
2.5E-06
2.0E-06
1.5E-06
1.0E-06
25C
5.0E-07
85C
0.0E+00
-40C
4
3.5
3
2.5
2
1.5
1
0.5
0
-5.0E-07
Input Voltage (V)
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
9
TPS22934
SLVSAD4 – AUGUST 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
t ON vs Tem perature (V IN = 3.6 V)
W
CL = 0.1 µF, RL = 500 W
t ON vs Tem perature (V IN = 1.8 V)
CL = 0.1 µF, RL = 500 W
W
65
40
35
tON (µs)
tON (µs)
60
55
30
50
45
-40°C
25°C
25
-40°C
85°C
Tem perature
25°C
85°C
Tem perature
t OFF vs Tem perature (V IN = 1 .8 V)
CL = 0.1 µF, RL = 500 W
W
t OFF vs Tem perature (V IN = 3.6 V)
W
CL = 0.1 µF, RL = 500 W
30
25
25
tOFF (µs)
tOFF (µs)
20
15
20
15
10
-40°C
25°C
Tem perature
10
-40°C
85°C
25°C
85°C
Tem perature
t RISE vs Tem perature (V IN = 3.6 V)
CL = 0.1 µF, RL = 500 W
W
t RISE vs Tem perature (V IN = 1.8 V)
CL = 0.1 µF, RL = 500 W
W
30
45
40
tRISE (µs)
tRISE (µs)
29
28
27
35
26
30
-40°C
25°C
85°C
25
-40°C
10
25°C
85°C
Tem perature
Tem perature
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
TPS22934
www.ti.com
SLVSAD4 – AUGUST 2010
TYPICAL CHARACTERISTICS (continued)
t FALL vs Tem perature (V IN = 3.6 V)
W
CL = 0.1 µF, RL = 500 W
t FALL vs Tem perature (V IN = 1.8 V)
W
CL = 0.1 µF, RL = 500 W
8.0
12
7.8
tFALL (µs)
tFALL (µs)
11
10
9
8
-40°C
7.6
7.4
7.2
25°C
85°C
7.0
-40°C
25°C
85°C
Tem perature
Tem perature
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
11
TPS22934
SLVSAD4 – AUGUST 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
tON Response
0.012
6.0
CL = 0.1 µF
RL = 500 Ohm
VIN = 3.6 V
TA = 25°C
5.0
0.010
0.008
4.0
3.0
0.006
2.0
0.004
1.0
0.002
IOUT (A)
ON (V)
ON
IOUT
0.000
0.0
-0.002
-1.0
-10
0
10
20
30
40
50
60
70
80
90
Time (µs)
tOFF Response
6.0
0.012
CL = 0.1 µF
RL = 500 Ohm
VIN = 3.6 V
TA = 25°C
5.0
IOUT
0.008
3.0
0.006
2.0
0.004
1.0
0.002
0.0
IOUT (A)
4.0
ON (V)
0.010
0.000
ON
-1.0
-0.002
-5
0
5
10
15
20
25
30
35
40
45
Time (µ)
12
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
TPS22934
www.ti.com
SLVSAD4 – AUGUST 2010
TYPICAL CHARACTERISTICS (continued)
tON Response
6.0
0.012
CL = 10 µF
RL = 500 Ohm
VIN = 3.6 V
TA = 25°C
0.010
ON (V)
4.0
0.008
ON
3.0
0.006
2.0
0.004
1.0
0.002
IOUT (A)
5.0
IOUT
0.0
0.000
-1.0
-20
0
20
40
60
80
100
120
140
160
-0.002
180
Time (µs)
tOFF Response
6.0
0.012
CL = 10 µF
RL = 500 Ohm
VIN = 3.6 V
TA = 25°C
5.0
0.008
3.0
0.006
IOUT
2.0
0.004
1.0
0.002
0.0
IOUT (A)
ON (V)
4.0
0.010
0.000
ON
-1.0
-200
0
200
400
600
800
1000
1200
1400
1600
-0.002
1800
Time (µs)
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
13
TPS22934
SLVSAD4 – AUGUST 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
tON Response
0.006
6.0
CL = 0.1 µF
RL = 500 Ohm
VIN = 1.8 V
TA = 25°C
5.0
0.005
0.004
4.0
3.0
0.003
2.0
0.002
1.0
0.001
IOUT (A)
ON (V)
ON
IOUT
0.000
0.0
-1.0
-20
0
20
40
60
80
Time (µs)
100
120
140
160
-0.001
180
tOFF Response
6.0
0.006
CL = 0.1 µF
RL = 500 Ohm
VIN = 1.8 V
TA = 25°C
ON (V)
IOUT
0.005
4.0
0.004
3.0
0.003
2.0
0.002
1.0
IOUT (A)
5.0
0.001
ON
0.0
0.000
-1.0
-0.001
-5
14
0
5
10
15
20
Time (µs)
25
Submit Documentation Feedback
30
35
40
45
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
TPS22934
www.ti.com
SLVSAD4 – AUGUST 2010
TYPICAL CHARACTERISTICS (continued)
tON Response
0.006
6.0
CL = 10 µF
RL = 500 Ohm
VIN = 1.8 V
TA = 25°C
5.0
0.005
0.004
4.0
3.0
0.003
2.0
0.002
1.0
0.001
IOUT (A)
ON (V)
ON
0.000
0.0
IOUT
-1.0
-20
0
20
40
60
80
100
120
140
160
-0.001
180
Time (µs)
tOFF Response
0.006
6.0
CL = 10 µF
RL = 500 Ohm
VIN = 1.8 V
TA = 25°C
5.0
3.0
0.003
IOUT
2.0
0.002
1.0
0.001
IOUT (A)
0.004
4.0
ON (V)
0.005
0.000
0.0
ON
-1.0
-200
0
200
400
600
800
Time (µs)
1000
1200
1400
1600
-0.001
1800
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
15
TPS22934
SLVSAD4 – AUGUST 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
tON Response
6.0
0.120
CL = 0.1 µF
RL = 36 Ohm
VIN = 3.6 V
TA = 25°C
0.100
ON (V)
4.0
0.080
ON
3.0
0.060
2.0
0.040
1.0
0.020
IOUT (A)
5.0
IOUT
0.0
0.000
-1.0
-0.020
-20
-10
0
10
20
30
40
50
60
70
80
Time (µs)
tOFF Response
6.0
0.120
CL = 0.1 µF
IOUT
RL = 36 Ohm
VIN = 3.6 V
TA = 25°C
5.0
0.100
0.080
ON
3.0
0.060
2.0
0.040
1.0
0.020
0.0
0.000
-1.0
IOUT (A)
ON (V)
4.0
-0.020
-10
-5
0
5
10
15
20
25
30
35
40
Time (µs)
16
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
TPS22934
www.ti.com
SLVSAD4 – AUGUST 2010
TYPICAL CHARACTERISTICS (continued)
tON Response
6.0
0.120
CL = 10 µF
RL = 36 Ohm
VIN = 3.6 V
TA = 25°C
0.100
ON (V)
4.0
0.080
ON
3.0
0.060
2.0
0.040
1.0
0.020
IOUT (A)
5.0
IOUT
0.0
0.000
-1.0
-40
-20
0
20
40
60
80
100
120
140
-0.020
160
Time (µs)
tOFF Response
6.0
0.120
CL = 10 µF
IOUT
RL = 36 Ohm
VIN = 3.6 V
TA = 25°C
5.0
3.0
0.080
0.060
ON
2.0
0.040
1.0
0.020
0.0
0.000
-1.0
-200
-100
0
100
200
300
400
500
600
700
IOUT (A)
ON (V)
4.0
0.100
-0.020
800
Time (µs)
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
17
TPS22934
SLVSAD4 – AUGUST 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
tON Response
6.0
0.120
CL = 0.1 µF
RL = 18 Ohm
VIN = 1.8 V
TA = 25°C
0.100
ON (V)
4.0
0.080
ON
3.0
0.060
2.0
0.040
1.0
IOUT (A)
5.0
0.020
IOUT
0.0
0.000
-1.0
-40
-20
0
20
40
60
80
100
120
140
-0.020
160
Time (µs)
tOFF Response
6.0
0.120
CL = 0.1 µF
IOUT
RL = 18 Ohm
VIN = 1.8 V
TA = 25°C
5.0
0.100
0.080
ON
3.0
0.060
2.0
0.040
1.0
0.020
0.0
0.000
-1.0
IOUT (A)
ON (V)
4.0
-0.020
-10
-5
0
5
10
15
20
25
30
35
40
Time (µs)
18
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
TPS22934
www.ti.com
SLVSAD4 – AUGUST 2010
TYPICAL CHARACTERISTICS (continued)
tON Response
6.0
0.120
CL = 10 µF
RL = 18 Ohm
VIN = 1.8 V
TA = 25°C
5.0
0.100
4.0
0.080
3.0
0.060
2.0
0.040
1.0
IOUT (A)
ON (V)
ON
0.020
IOUT
0.0
0.000
-1.0
-20
0
20
40
60
80
100
120
140
160
-0.020
180
Time (µs)
tOFF Response
6.0
0.120
CL = 10 µF
IOUT
RL = 18 Ohm
VIN = 1.8 V
TA = 25°C
5.0
0.080
3.0
0.060
ON
2.0
0.040
1.0
0.020
0.0
0.000
-1.0
-50
0
50
100
150
200
Time (µs)
250
300
350
400
IOUT (A)
ON (V)
4.0
0.100
-0.020
450
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
19
TPS22934
SLVSAD4 – AUGUST 2010
www.ti.com
APPLICATION INFORMATION
ON/OFF Control
The ON pin controls the state of the switch. The TPS22934 has built-in hysteresis on its control inputs. The load
switch is active when the ON voltage is greater than the positive going voltage threshold (VTH+). If the ON voltage
is lower than the negative going voltage threshold (VTH-), then the pass FET is deactivated and the active
pulldown from VOUT to GND is activated.
This is ideal for power rail sequencing applications as shown in Figure 2 where the 2.8-V supply needs to be
valid before the 1.8-V supply turn on:
Figure 2. 1.8-V / 2.8-V Power Rail Sequencing
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-µF ceramic
capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce
the voltage drop.
Output Capacitor
Due to the integral body diode in the PMOS switch, a CIN greater than CL is highly recommended. A CL greater
than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow
through the body diode from VOUT to VIN.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic
electrical effects along with minimizing the case to ambient thermal impedance.
Undervoltage Lockout
The undervoltage lockout turns off the switch if the input voltage drops below the under-voltage lockout
threshold. With the ON pin active, the input voltage rising above the undervoltage lockout threshold causes a
controlled turn-on of the switch, which limits current overshoots.
20
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS22934
PACKAGE OPTION ADDENDUM
www.ti.com
13-Aug-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TPS22934YZVR
ACTIVE
DSBGA
YZV
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Purchase Samples
TPS22934YZVT
ACTIVE
DSBGA
YZV
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Purchase Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Aug-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPS22934YZVR
DSBGA
YZV
4
3000
178.0
9.2
TPS22934YZVT
DSBGA
YZV
4
250
178.0
9.2
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1.02
1.02
0.63
4.0
8.0
Q1
1.02
1.02
0.63
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Aug-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS22934YZVR
DSBGA
YZV
4
3000
220.0
220.0
35.0
TPS22934YZVT
DSBGA
YZV
4
250
220.0
220.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated