2SK1521, 2SK1522 Silicon N-Channel MOS FET Application High speed power switching Features • • • • • Low on-resistance High speed switching Low drive current Built-in fast recovery diode (trr = 120 ns) Suitable for motor control, switching regulator, DC-DC converter Outline TO-3PL D G 1 S 2 3 1. Gate 2. Drain 3. Source 2SK1521, 2SK1522 Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage 2SK1521 Symbol Ratings Unit VDSS 450 V 2SK1522 500 Gate to source voltage VGSS Drain current ID Drain peak current I D(pulse)* Body to drain diode reverse drain current I DR 2 1 ±30 V 50 A 200 A 50 A Channel dissipation Pch* 250 W Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1% 2. Value at TC = 25°C 2 2SK1521, 2SK1522 Electrical Characteristics (Ta = 25°C) Item Symbol Min Drain to source 2SK1521 V(BR)DSS 450 breakdown voltage 2SK1522 500 Typ Max Unit Test conditions — — V I D = 10 mA, VGS = 0 Gate to source breakdown voltage V(BR)GSS ±30 — — V I G = ±100 µA, VDS = 0 Gate to source leak current I GSS — — ±10 µA VGS = ±25 V, VDS = 0 Zero gate voltage 2SK1521 I DSS — — 250 µA VDS = 360 V, VGS = 0 drain current 2SK1522 Gate to source cutoff voltage VDS = 400 V, VGS = 0 VGS(off) 2.0 — 3.0 V I D = 1 mA, VDS = 10 V Static Drain to source 2SK1521 RDS(on) — 0.08 0.10 Ω I D = 25 A, VGS = 10 V *1 on state resistance — 0.085 0.11 2SK1522 Forward transfer admittance |yfs| 22 35 — S I D = 25 A, VDS = 10 V *1 Input capacitance Ciss — 8700 — pF VDS = 10 V, VGS = 0, Output capacitance Coss — 2400 — pF f = 1 MHz Reverse transfer capacitance Crss — 235 — pF Turn-on delay time t d(on) — 85 — ns I D = 25 A, VGS = 10 V, Rise time tr — 250 — ns RL = 1.2 Ω Turn-off delay time t d(off) — 600 — ns Fall time tf — 250 — ns Body to drain diode forward voltage VDF — 1.1 — V I F = 50 A, VGS = 0 Body to drain diode reverse recovery time t rr — 120 — ns I F = 50 A, VGS = 0, diF/dt = 100 A/µs Note: 1. Pulse test 3 2SK1521, 2SK1522 Power vs. Temperature Derating Maximum Safe Operation Area 1,000 300 Drain Current ID (A) Channel Dissipation Pch (W) 300 200 100 rea sa thi S (on) n ni RD tio by era ited p DC O lim is 100 30 Op er 10 3 1 8V 5V 4.5 V Drain Current ID (A) Drain Current ID (A) = Sh ot ) 25 2SK1521 2SK1522 3 10 30 100 300 1,000 Drain to Source Voltage VDS (V) 60 40 20 VGS = 4 V 4 1 (T 80 Pulse Test 5.5 V 0 at ion s s( VDS = 20 V Pulse Test 6V 60 20 1m m 100 10 V 40 10 Typical Transfer Characteristics Typical Output Characteristics 100 80 = µs µs ) 0.1 150 0 °C 1 Ta = 25°C 50 100 Case Temperature TC (°C) 10 10 C 0.3 0 PW 4 12 16 8 20 Drain to Source Voltage VDS (V) TC = 75°C 25°C –25°C 0 2 6 8 4 10 Gate to Source Voltage VGS (V) Drain to Source Saturation Voltage vs. Gate to Source Voltage 5 Static Drain to Source on State Resistance vs. Drain Current Static Drain to Source on State Resistance RDS (on) (Ω) Drain to Source Saturation Voltage VDS (on) (V) 2SK1521, 2SK1522 50 A Pulse Test 4 3 2 20 A ID = 10 A 1 0 1 Pulse Test 0.5 0.2 VGS = 10, 15 V 0.1 0.05 0.02 0.01 5 4 12 16 8 20 Gate to Source Voltage VGS (V) 10 0.5 Pulse Test 0.4 0.3 0.2 0.1 0 –40 ID = 50 A 20 A 10 A 0 80 120 40 Case Temperature TC (°C) 500 Forward Transfer Admittance vs. Drain Current 160 Forward Transfer Admittance yfs (S) Static Drain to Source on State Resistance RDS (on) (Ω) Static Drain to Source on State Resistance vs. Temperature 20 50 100 200 Drain Current ID (A) 50 TC = –25°C 20 25°C 75°C 10 5 2 1 VDS = 20 V Pulse Test 0.5 0.5 1 2 5 10 20 Drain Current ID (A) 50 5 2SK1521, 2SK1522 Typical Capacitance vs. Drain to Source Voltage Body to Drain Diode Reverse Recovery Time 10,000 500 200 Capacitance C (pF) Reverse Recovery Time trr (ns) Ciss 100 50 20 10 di/dt = 100 A/µs, Ta = 25°C VGS = 0 Pulse Test 5 0.5 Coss 1,000 100 Crss VGS = 0 f = 1 MHz 10 1 2 5 10 20 Reverse Drain Current IDR (A) 50 0 20 10 30 40 Drain to Source Voltage VDS (V) Dynamic Input Characteristics 16 250 V 400 V 300 VGS 12 VDS 200 8 ID = 50 A 100 VDD = 400 V 4 250 V 100 V 0 6 80 240 320 160 Gate Charge Qg (nc) 0 400 Switching Time t (ns) VDD = 100 V 5,000 Gate to Source Voltage VGS (V) Drain to Source Voltage VDS (V) 400 Switching Characteristics 20 500 50 . VGS = 10 V, VDD =. 30 V PW = 2 µs, duty < 1% 2,000 1,000 td (off) 500 tf 200 tr td (on) 100 50 0.5 1 2 5 10 20 Drain Current ID (A) 50 2SK1521, 2SK1522 Reverse Drain Current vs. Source to Drain Voltage Reverse Drain Current IDR (A) 100 Pulse Test 80 60 40 20 VGS = 0, –5 V Normalized Transient Thermal Impedance γS (t) 0 10 V 0.8 2.0 0.4 1.2 1.6 Source to Drain Voltage VSD (V) Normalized Transient Thermal Impedance vs. Pulse Width 3 TC = 25°C 1 D=1 0.5 0.3 0.2 θch–c (t) = γS (t) · θch–c θch–c = 0.5°C/W, TC = 25°C 0.1 0.1 0.05 PDM 0.02 0.03 0.01 lse Pu hot T 1S 0.01 10 µ 100 µ 1m 10 m Pulse Width PW (s) 100 m Switching Time Test Circuit PW D = PW T 1 10 Waveforms Vin Monitor 90% Vout Monitor D.U.T Vin 10% RL Vout 10% 10% 50 Ω Vin 10 V VDD . =. 30 V td (on) 90% tr 90% td (off) tf 7 5.0 ± 0.2 20.0 ± 0.3 φ3.3 ± 0.2 20.0 ± 0.6 2.5 ± 0.3 26.0 ± 0.3 6.0 ± 0.2 Unit: mm 1.4 3.0 2.2 1.2 +0.25 –0.1 5.45 ± 0.5 5.45 ± 0.5 0.6 +0.25 –0.1 2.8 ± 0.2 1.0 3.8 7.4 Hitachi Code JEDEC EIAJ Weight (reference value) TO-3PL — — 9.9 g Cautions 1. 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