HITACHI 2SK1318

2SK1318
Silicon N Channel MOS FET
High Speed Power Switching
ADE-208-1269 (Z)
1st. Edition
Jan. 2001
Features
•
•
•
•
•
Low on-resistance
High speed switching
Low drive current
4V gate drive device can be driven from 5V source
Suitable for motor drive, DC-DC converter, power switch and solenoid drive
Outline
TO-220FM
D
1
2 3
1. Gate
2. Drain
3. Source
G
S
2SK1318
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
Drain to source voltage
VDSS
120
V
Gate to source voltage
VGSS
±20
V
Drain current
ID
20
A
80
A
1
Drain peak current
I D (peak)*
Body to drain diode reverse drain
current
I DR
20
A
Channel dissipation
Pch*2
35
W
Channel temperature
Tch
150
°C
Storage temperature
Tstg
–55 to +150
°C
Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1%
2. Value at Tc = 25°C
2
2SK1318
Electrical Characteristics (Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Drain to source breakdown
voltage
V(BR)DSS
120
—
—
V
I D = 10mA, VGS = 0
Gate to source breakdown
voltage
V(BR)GSS
±20
—
—
V
I G = ±100µA, VDS = 0
Gate to source leak current
I GSS
—
—
±10
µA
VGS = ±16V, VDS = 0
Zero gate voltege drain current
I DSS
—
—
250
µA
VDS = 100V, VGS = 0
Gate to source cutoff voltage
VGS(off)
1.0
—
2.0
V
I D = 1mA, VDS = 10V
Static drain to source on state
RDS(on)
—
0.095
0.12
I D = 10A, VGS = 10V*1
—
0.11
0.16
I D = 10A, VGS = 4V*1
resistance
Forward transfer admittance
|yfs|
10
17
Å\
S
I D = 10A, VDS = 10V*1
Input capacitance
Ciss
—
1300
Å\
pF
VDS = 10V, VGS = 0,
Output capacitance
Coss
—
430
—
pF
f = 1MHz
Reverse transfer capacitance
Crss
—
60
—
pF
Turn-on delay time
td (on)
—
14
—
ns
I D = 10A,
Rise time
tr
—
70
—
ns
VGS = 10V, RL = 3
Turn-off delay time
td (off)
—
210
—
ns
Fall time
tf
—
90
—
ns
Body–drain diode forward
voltage
VDF
—
1.4
—
V
I F = 20A, VGS = 0
Body–drain diode reverse
recovery time
trr
—
280
—
ns
I F = 20A, VGS = 0,
diF / dt = 50A / µs
Note:
1. Pulse test
3
2SK1318
Main Characteristics
Power vs. Temperature Derating
Maximum Safe Operation Area
100
60
40
20
DC
10
PW
O
1
=
pe
10
ra
s
s
n
3
m
m
tio
(1
(T
C
Operation in this Area
Limited by RDS (on)
1
µs
µs
Drain Current ID (A)
30
0
10
Channel Dissipation Pch (W)
10
=
Sh
ot
)
25
°C
)
0.3
Ta = 25°C
0.1
0
50
100
Case Temperature TC (°C)
1
150
Typical Transfer Characteristics
Typical Output Characteristics
20
20
4V
3V
Pulse Test
12
8
2.5 V
4
VDS = 10 V
Pulse Test
Drain Current ID (A)
Drain Current ID (A)
10 V
16
16
12
4
TC = 25°C
8
4
75¡C
VGS = 2.0 V
0
3
30
10
100 300 1,000
Drain to Source Voltage VDS (V)
4
10
2
6
8
Drain to Source Voltage VDS (V)
—25°C
0
2
1
3
4
Gate to Source Voltage VGS (V)
5
5
Pulse Test
4
3
ID = 20 A
2
10 A
1
5A
8
20
4
12
16
Gate to Source Voltage VGS (V)
0
Static Drain to Source on State Resistance
RDS (on) (Ω)
Drain to Source Saturation Voltage
vs. Gate to Source Voltage
Static Drain to Source on State
Resistance vs. Drain Current
1
0.5
10 V
0.05
0.02
0.01
0.5
ID = 20 A
10 A
5A
0.15
VGS = 4 V
0.1
0.05
10 A
5A
VGS = 10 V
0
—40
0
80
120
40
Case Temperature TC (°C)
1
10
2
5
20
Drain Current ID (A)
50
Forward Transfer Admittance
vs. Drain Current
0.25
Pulse Test
VGS = 4 V
0.1
Static Drain to Source on State
Resistance vs. Temperature
0.2
Pulse Test
0.2
160
Forward Transfer Admittance yfs (S)
Static Drain to Source on State Resistance
RDS (on) (Ω)
Drain to Source Saturation Voltage VDS (on) (V)
2SK1318
100
50
20
VDS = 10 V
Pulse Test
25°C
Tc = —25°C
75°C
10
5
2
1
0.5
1
2
5
20
10
Drain Current ID (A)
50
5
2SK1318
Body to Drain Diode Reverse
Recovery Time
Typical Capacitance vs.
Drain to Source Voltage
10,000
200
Capacitance C (pF)
Reverse Recovery Time trr (ns)
500
100
50
20
di/dt = 50 A/µs
VGS = 0, Ta = 25°C
Pulse Test
10
5
0.2
Ciss
1,000
Coss
100
10
0.5
2
10
5
1
Reverse Drain Current IDR (A)
0
20
Dynamic Input Characteristics
12
VGS
VDS
80
40
8
VDD = 100 V
50 V
25 V
ID = 20 A
4
0
0
6
20
60
80
40
Gate Charge Qg (nc)
100
td (off)
Switching Time t (ns)
16
50 V
25 V
500
Gate to Source Voltage VGS (V)
Drain to Source Voltage VDS (V)
VDD = 100 V
120
20
50
10
30
40
Drain to Source Voltage VDS (V)
Switching Characteristics
20
200
160
Crss
VGS = 0
f = 1 MHz
200
100
VGS = 10 V, PW = 2 µs
.
duty <
= 1%, VDD =. 30 V
50
tf
20
tr
td (on)
10
5
0.2
0.5
2
5
10
1
Drain Current ID (A)
20
2SK1318
Reverse Drain Current vs.
Source to Drain Voltage
Reverse Drain Current IDR (A)
20
12
VGS = 10 V
15 V
8
VGS = 0, —5 V
4
0
Normalized Transient Thermal Impedance γS (t)
Pulse Test
16
1
2.5
0.5
1.5
2
Source to Drain Voltage VSD (V)
Normalized Transient Thermal Impedance vs. Pulse Width
3
1.0
TC = 25°C
D=1
0.5
0.3
0.2
0.03
θch - c (t) = γS (t) • θch—c
θch - c = 3.57°C/W, TC = 25°C
0.1
0.1
0.05
PDM
0.02
0.01 ulse
P
hot
1S
0.01
10 µ
100 µ
T
1m
10 m
Pulse Width PW (s)
100 m
PW
1
D = PW
T
10
7
2SK1318
Switching Time Test Circuit
Waveforms
Vin Monitor
90%
Vout Monitor
D.U.T
Vin
10%
RL
Vout
50 Ω
Vin
10 V
VDD
.
=. 30 V
90%
td (on)
8
10%
tr
10%
90%
td (off)
tf
2SK1318
Package Dimensions
10.0 ± 0.3
7.0 ± 0.3
As of January, 2001
2.5 ± 0.2
Unit: mm
0.7 ± 0.1
2.54 ± 0.5
2.54 ± 0.5
4.45 ± 0.3
2.5
14.0 ± 1.0
5.0 ± 0.3
1.2 ± 0.2
1.4 ± 0.2
2.0 ± 0.3
12.0 ± 0.3
17.0 ± 0.3
0.6
φ 3.2 ± 0.2
2.8 ± 0.2
0.5 ± 0.1
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
TO-220FM
—
Conforms
1.8 g
9
2SK1318
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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Copyright  Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
Colophon 2.0
10