HITACHI 3SK290

3SK290
Silicon N-Channel Dual Gate MOS FET
ADE-208-271
1st. Edition
Application
UHF RF amplifier
Features
· Low noise figure.
NF = 2.3 dB Typ. at f = 900 MHz
· High gain.
PG = 19.3 dB Typ. at f = 900 MHz
Outline
CMPAK–4
2
3
1
4
1. Source
2. Gate1
3. Gate2
4. Drain
3SK290
Absolute Maximum Ratings (Ta = 25¡C)
Item
Symbol
Ratings
Unit
Drain to source voltage
VDS
12
V
Gate 1 to source voltage
VG1S
±8
V
Gate 2 to source voltage
VG2S
±8
V
Drain current
ID
25
mA
Channel power dissipation
Pch
100
mW
Channel temperature
Tch
125
°C
Storage temperature
Tstg
–55 to +125
°C
Attention: This device is very sensitive to electro static discharge.
It is recommended to adopt appropriate cautions when handling this transistor.
2
3SK290
Electrical Characteristics (Ta = 25¡C)
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Drain to source breakdown
voltage
V(BR)DSX
12
—
—
V
I D = 200 mA, VG1S = –3 V,
VG2S = –3 V
Gate 1 to source breakdown
voltage
V(BR)G1SS
±8
—
—
V
I G1 = ±10 mA, VG2S = VDS = 0
Gate 2 to source breakdown
voltage
V(BR)G2SS
±8
—
—
V
I G2 = ±10 mA, VG1S = VDS = 0
Gate 1 cutoff current
I G1SS
—
—
±100
nA
VG1S = ±6 V, V G2S = VDS = 0
Gate 2 cutoff current
I G2SS
—
—
±100
nA
VG2S = ±6 V, V G1S = VDS = 0
Drain current
I DS(on)
0.5
—
10
mA
VDS = 6 V, VG1S = 0.5 V,
VG2S = 3 V
Gate 1 to source cutoff voltage VG1S(off)
–0.6
—
+0.5
V
VDS = 10 V, VG2S = 3 V,
I D = 100 mA
Gate 2 to source cutoff voltage VG2S(off)
0
—
+1.0
V
VDS = 10 V, VG1S = 3 V,
I D = 100 mA
Forward transfer admittance
|yfs|
16
22
—
mS
VDS = 6 V, VG2S = 3 V,
I D = 10 mA, f = 1 kHz
Input capacitance
Ciss
1.2
1.8
2.2
pF
VDS = 6 V, VG2S = 3V,
I D = 10 mA, f = 1 MHz
Output capacitance
Coss
0.7
1.2
1.4
pF
Reverse transfer capacitance
Crss
—
0.02
0.03
pF
Power gain
PG
17
19.3
—
dB
Noise figure
NF
—
2.3
2.8
dB
VDS = 4 V, VG2S = 3 V,
I D = 10 mA, f = 900 MHz
Note: Marking is “ZJ–”.
3
3SK290
VG2S = 3 V
I D (mA)
16
150
Drain Current
100
50
0.8 V
0.6 V
8
0.4 V
4
VG1S = 0.2V
50
100
150
200
Ambient Temperature Ta (¡C)
I D (mA)
2.0 V
2.5 V
1.5 V
12
8
VG2S = 1.0 V
4
0.8
20
V DS = 6 V
16
0
0
Drain Current vs.
Gate 1 to Source Voltage
3.0 V
I D (mA)
1.0 V
12
20
1.6
2.4
3.2
4.0
Gate 1 to Source Voltage V G1S (V)
4
Typical Output Characteristics
1.2 V
0
Drain Current
20
200
Drain Current
Channel Power Dissipation
Pch (mW)
Maximum Channel Power
Dissipation Curve
16
2
4
6
8
10
Drain to Source Voltage V DS (V)
Drain Current vs.
Gate 2 to Source Voltage
V DS = 6 V
1.5 V
3.0 V
1.0 V
2.5 V
12
2.0 V
8
VG1S = 0.5 V
4
0
0.8
1.6
2.4
3.2
4.0
Gate 2 to Source Voltage V G2S (V)
Forward Transfer Admittance
vs. Gate 1 to Source Voltage
Power Gain vs. Drain Current
20
30
VDS = 6 V
f = 1 kHz
24
V G2S = 3.0 V
PG (dB)
2.5 V
2.0 V
18
16
12
Power Gain
1.5 V
12
1.0 V
6
0
–0.5
0
0.5
1.0
8
0
2.0
1.5
VDS = 4 V
VG2S = 3 V
f = 900 MHz
4
4
Gate1 to Source Voltage VG1S (V)
8
Drain Current
12
16
20
I D (mA)
Noise Figure vs. Drain Current
NF (dB)
5
Noise Figure
Forward Transfer Admittance |y fs | (mS)
3SK290
VDS = 4 V
VG2S = 3 V
f = 900 MHz
4
3
2
1
0
4
8
Drain Current
12
16
20
I D (mA)
5
3SK290
S21 Parameter vs. Frequency
S11 Parameter vs. Frequency
.8
1
Scale: 1 / div.
90¡
1.5
.6
60¡
120¡
2
.4
3
30¡
150¡
4
5
.2
10
.2
0
.4
.6 .8 1.0 1.5 2
3 45
10
180¡
0¡
–10
–5
–4
–.2
–30¡
–150¡
–3
–.4
–2
–.6
–.8
–1
–90¡
Condition: V DS = 4 V , V G2S = 3 V
I D = 10 mA , Zo = 50 W
50 to 1000 MHz (50 MHz step)
Condition: V DS = 4 V , V G2S = 3 V
I D = 10 mA , Zo = 50 W
50 to 1000 MHz (50 MHz step)
S22 Parameter vs. Frequency
S12 Parameter vs. Frequency
90¡
.8
Scale: 0.002 / div.
1
.6
60¡
120¡
–60¡
–120¡
–1.5
1.5
2
.4
3
30¡
150¡
4
5
.2
10
180¡
0¡
.2
0
.4
.6 .8 1.0 1.5 2
3 45
10
–10
–5
–4
–.2
–30¡
–150¡
–3
–.4
–60¡
–120¡
–90¡
Condition: V DS = 4 V , V G2S = 3 V
I D = 10 mA , Zo = 50 W
50 to 1000 MHz (50 MHz step)
6
–2
–.6
–.8
–1
–1.5
Condition: V DS = 4 V , V G2S = 3 V
I D = 10 mA , Zo = 50 W
50 to 1000 MHz (50 MHz step)
3SK290
S Parameter (VDS = 4 V, VG2S = 3 V, ID = 10 mA, ZO = 50 ½)
Freq.
S11
S21
S12
S22
(MHz)
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
50
0.998
–3.3
2.17
176
0.001
41.3
0.971
–1.9
100
0.994
–6.7
2.20
172
0.001
88.9
0.971
–4.5
150
0.997
–10.2
2.19
168
0.002
74.4
0.970
–7.1
200
0.991
–13.5
2.17
163
0.003
81.6
0.969
–9.8
250
0.993
–16.9
2.16
159
0.004
79.7
0.967
–12.1
300
0.980
–20.8
2.12
155
0.004
72.6
0.965
–14.8
350
0.976
–23.7
2.10
151
0.005
66.9
0.962
–17.3
400
0.971
–27.0
2.08
146
0.005
70.9
0.959
–19.7
450
0.962
–30.7
2.05
142
0.006
67.7
0.956
–22.1
500
0.955
–33.7
2.03
139
0.006
63.9
0.953
–24.8
550
0.945
–36.9
1.99
135
0.006
64.1
0.950
–27.2
600
0.939
–40.2
1.96
131
0.006
63.9
0.946
–29.5
650
0.927
–43.3
1.93
127
0.006
59.9
0.942
–32.1
700
0.925
–46.5
1.90
123
0.006
60.0
0.939
–34.6
750
0.911
–49.4
1.87
120
0.006
58.3
0.933
–36.7
800
0.901
–52.3
1.84
116
0.006
60.3
0.930
–39.1
850
0.893
–55.9
1.81
112
0.005
62.0
0.925
–41.5
900
0.881
–59.0
1.78
108
0.005
61.2
0.921
–43.8
950
0.876
–61.5
1.75
105
0.005
65.0
0.917
–46.1
1000
0.869
–64.3
1.71
102
0.005
68.8
0.913
–48.4
7
Unit: mm
0.95
0 – 0.1
0.65
0.1
0.6 +– 0.05
0.16 – 0.06
2.8
1.5 ± 0.15
+ 0.1
0.4 – 0.05
+ 0.1
0.65
+ 0.1
0.4 – 0.05
0.4 – 0.05
+ 0.2
– 0.6
+ 0.1
2.95 ± 0.2
1.9 ± 0.2
0.95 0.95
0.85
1.1 – 0.1
+ 0.2
0.3
1.8 ± 0.2
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
MPAK-4
—
Conforms
0.013 g
Cautions
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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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