2SK522 Silicon N-Channel Junction FET Application VHF amplifier, Mixer, local oscillator Outline SPAK 1 23 1. Gate 2. Source 3. Drain 2SK522 Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Gate to drain voltage VGDO –30 V Gate current IG 10 mA Drain current ID 20 mA Channel power dissipation Pch 200 mW Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test conditions Gate to drain breakdown voltage V(BR)GDO –30 — — V I G = –100 µA, IS = 0 Gate cutoff current I GSS — — –10 nA VGS = –0.5 V, VDS = 0 4 — 20 mA VDS = 5 V, VGS = 0 1 Drain current I DSS* Gate to source cutoff voltage VGS(off) — — –3 V VDS = 5 V, ID = 10 µA Forward transfer admittance y fs 8 10 — mS VDS = 5 V, VGS = 0, f = 1 kHz Input capacitance Ciss — 6.8 — pF VDS = 5 V, VGS = 0, f = 1 MHz Reverse transfer capacitance Crss — 0.1 — pF Power gain PG 20 27 — dB Noise figure NF — 1.7 2.5 dB Note: 1. The 2SK522 is grouped by I DSS as follows. Drain D E F I DSS 4 to 8 6 to 10 10 to 20 2 VDS = 5 V, VGS = 0, f = 100 MHz 2SK522 Typical Output Characteristics (1) 10 300 0 –0.2 V m 6 20 W 100 = 200 8 h Drain Current ID (mA) VGS = 0 Pc Channel Power Dissipation Pch (mW) Maximum Channel Power Dissipation Curve –0.4 4 –0.6 2 –0.8 –1.0 0 0 50 100 150 Ambient Temperature Ta (°C) 10 20 30 40 Drain to Source Voltage VDS (V) 50 Typical Transfer Characteristics Typical Output Characteristics (2) 15 10 Drain Current ID (mA) Drain Current ID (mA) VGS = 0 8 –0.2 V 6 –0.4 4 –0.6 2 0 –0.8 –1.0 1 2 3 4 Drain to Source Voltage VDS (V) VDS = 5 V 10 F E 5 D 5 0 –3.0 –2.0 –1.0 Gate to Source Voltage VGS (V) 0 3 2SK522 Ta = –25°C 25°C 75°C 10 5 VGS = 0 f = 1 kHz 0 5 10 Drain to Source Voltage VDS (V) Input Capacitance vs. Drain to Source Voltage Input Capacitance Ciss (pF) 20 VGS = 0 f = 1 MHz 10 5 2 0.1 4 0.5 1.0 2 5 10 0.2 Drain to Source Voltage VDS (V) 15 Forward Transfer Admittance yfs (mS) 15 Forward Transfer Admittance vs. Drain Current 50 20 10 5 2 VDS = 5 V f = 1 kHz 1.0 0.5 0.2 0.5 1.0 2 5 10 Drain Current ID (mA) 20 Reverse Transfer Capacitance vs. Drain to Source Voltage Reverse Transfer Capacitance Crss (pF) Forward Transfer Admittance yfs (mS) Forward Transfer Admittance vs. Drain to Source Voltage 5 2 1.0 0.5 VGS = 0 f = 1 MHz 0.2 0.1 0.05 0.1 0.2 0.5 1.0 2 5 Drain to Source Voltage VDS (V) 10 2SK522 Power Gain vs. Drain to Source Voltage Output Capacitance vs. Drain to Source Voltage 30 100 VGS = 0 f = 1 MHz Power Gain PG (dB) 50 20 10 VGS = 0 f = 100 MHz 20 10 5 2 0.1 0.2 0.5 1.0 2 5 10 Drain to Source Voltage VDS (V) 0 5 10 Drain to Source Voltage VDS (V) 15 Noise Figure vs. Drain to Source Voltage 8 Noise Figure NF (dB) Output Capacitance Coss (pF) 200 6 VGS = 0 f = 100 MHz 4 2 0 4 8 12 16 Drain to Source Voltage VDS (V) 5 2SK522 Power Gain and Noise Figure Test Circuit 5.4 SG Output Impedance 50 C1 S.G. Shield 3.0 D.U.T. L1 C2 L2 4,700 50 1,000 VDD V.V Unit R : Ω C : pF C1, C2 : 0 to 30pF Max Variable Air L1 : 3.5 T φ1 mmφ Copper Ribbon, Tin plated 10 mm Inside dia. L2 : 4.5 T φ1 mmφ Copper Ribbon, Tin plated 10 mm Inside dia. 6 Unit: mm 2.2 Max 0.6 0.6 Max 0.45 ± 0.1 14.5 Min 1.8 Max 3.2 Max 4.2 Max 0.4 ± 0.1 1.27 1.27 2.54 Hitachi Code JEDEC EIAJ Weight (reference value) SPAK — — 0.10 g Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. 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