HY62CT08081E Series 32Kx8bit CMOS SRAM Document Title 32K x8 bit 5.0V Low Power Slow SRAM Revision History Revision No History Draft Date 00 Initial Nov.01.2000 Preliminary 01 Marking Information Add Revised - DC / AC Characteristics - AC Test Condition Add : 5pF Test Load Dec.05.2000 Preliminary 02 Revised - Remove L-Part - Change LL-Part Isb1 Limit @E.T/I.T : 15uA => 20uA Feb.13.2001 Final 03 Revised - Marking Information Change : SOP Type Feb.21.2001 Final 04 Changed Logo - HYUNDAI -> hynix - Marking Information Change Apr.30.2001 Remark Final This document is a general product description and is subject to change without notice. Hynix Electronics does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 04 / Apr. 2001 Hynix Semiconductor HY62CT08081E Series DESCRIPTION FEATURES The HY62CT08081E is a high-speed, low power and 32,786 X 8-bits CMOS Static Random Access Memory fabricated using Hynix's high performance CMOS process technology. It is suitable for use in low voltage operation and battery back-up application. This device has a data retention mode that guarantees data to remain valid at the minimum power supply voltage of 2.0 volt. • • • • Product Voltage No. (V) HY62CT08081E-C 5.0 HY62CT08081E-E 5.0 HY62CT08081E-I 5.0 Note 1. Current value is max. Speed (ns) 55/70/85 55/70/85 55/70/85 Fully static operation and Tri-state output TTL compatible inputs and outputs Low power consumption Battery backup - 2.0V(min.) data retention • Standard pin configuration - 28 pin 600mil PDIP - 28 pin 330mil SOP - 28 pin 8x13.4 mm TSOP-I (Standard) Operation Current(mA) 10 10 10 Standby Current(uA) LL 10 20 20 Temperature (°C) 0~70(Normal) -25~85(Extended) -40~85(Industrial) PIN CONNECTION 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 SOP Vcc /WE A13 A8 A9 A11 /OE A10 /CS I/O8 I/O7 I/O6 I/O5 I/O4 /OE A11 A9 A8 A13 /WE Vcc A14 A12 A7 A6 A5 A4 A3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 TSOP-I(Standard) PIN DESCRIPTION Pin Function Chip Select Write Enable Output Enable Address Inputs Data Input/Output Power(+5.0V) Ground BLOCK DIAGRAM A14 /CS /OE /WE Rev 04 / Apr. 2001 ROW DECODER A0 ADD INPUT BUFFER Pin Name /CS /WE /OE A0 ~ A14 I/O1 ~ I/O8 Vcc Vss A10 /CS I/O8 I/O7 I/O6 I/O5 I/O4 Vss I/O3 I/O2 I/O1 A0 A1 A2 MEMORY ARRAY 512x512 I/O1 OUTPUT BUFFER PDIP A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O1 I/O2 I/O3 Vss SENSE AMP Vcc /WE A13 A8 A9 A11 /OE A10 /CS I/O8 I/O7 I/O6 I/O5 I/O4 WRITE DRIVER 28 27 26 25 24 23 22 21 20 19 18 17 16 15 COLUMN DECODER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 I/O8 CONTROL LOGIC A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O1 I/O2 I/O3 Vss 2 HY62CT08081E Series ORDERING INFORMATION Part No. HY62CT08081E-DPC HY62CT08081E-DPE HY62CT08081E-DPI HY62CT08081E-DGC HY62CT08081E-DGE HY62CT08081E-DGI HY62CT08081E-DTC HY62CT08081E-DTE HY62CT08081E-DTI Speed 55/70/85 55/70/85 55/70/85 55/70/85 55/70/85 55/70/85 55/70/85 55/70/85 55/70/85 Power LL-part LL-part LL-part LL-part LL-part LL-part LL-part LL-part LL-part Temp 0 to 70°C -25 to 85°C -40 to 85°C 0 to 70°C -25 to 85°C -40 to 85°C 0 to 70°C -25 to 85°C -40 to 85°C Package PDIP SOP TSOP-I Standard ABSOLUTE MAXIMUM RATING (1) Symbol Vcc, VIN, VOUT TA Parameter Power Supply, Input/Output Voltage Operating Temperature HY62CT08081E-C HY62CT08081E-E HY62CT08081E-I Storage Temperature Power Dissipation Data Output Current Lead Soldering Temperature & Time Rating -0.3 to 7.0 0 to 70 -25 to 85 -40 to 85 -65 to 150 1.0 50 260 •10 Unit V °C °C °C °C W mA °C•sec TSTG PD IOUT TSOLDER Note 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is stress rating only and the functional operation of the device under these or any other conditions above those indicated in the operation of this specification is not implied. Exposure to the absolute maximum rating conditions for extended period may affect reliability. RECOMMENDED DC OPERATING CONDITIONS Symbol Parameter Min. Vcc Power Supply Voltage 4.5 Vss Ground 0 VIH Input High Voltage 2.2 VIL Input Low Voltage -0.3(1) Note 1. VIL = -3.0V for pulse width less than 50ns Rev 04 / Apr. 2001 Typ. 5.0 0 - Max. 5.5 0 Vcc+0.3 0.8 Unit V V V V 2 HY62CT08081E Series TRUTH TABLE /WE /OE Mode /CS H X X Standby L H H Output Disabled L H L Read L L X Write Note 1. H=VIH, L=VIL, X=Don't Care I/O Operation High-Z High-Z Data Out Data In DC CHARACTERISTICS Vcc = 5V ±10%, TA = 0°C to 70°C (Normal) / -25°C to 85°C (Extended) / -40°C to 85°C (Industrial), unless otherwise specified. Symbol Parameter Test Condition Min. Typ. Max. ILI Input Leakage Current Vss < VIN < Vcc -1 1 ILO Output Leakage Current Vss < VOUT < Vcc, /CS = VIH or -1 1 /OE = VIH or /WE = VIL Icc Operating Power Supply /CS = VIL, 10 Current VIN = VIH or VIL, II/O = 0mA ICC1 Average Operating Current /CS = VIL, VIN = VIH or VIL, 50 Min. Duty Cycle = 100%, II/O = 0mA ISB TTL Standby Current /CS= VIH, 1 (TTL Inputs) VIN = VIH or VIL ISB1 CMOS Standby Current /CS > Vcc - 0.2V, 10 0~70°C (CMOS Inputs) VIN > Vcc - 0.2V or VIN < Vss + 0.2V 20 -25~85°C or -40~85°C VOL Output Low Voltage IOL = 2.1mA 0.4 VOH Output High Voltage IOH = -1.0mA 2.4 - Unit uA uA mA mA mA uA uA V V Note : Typical values are at Vcc =5.0V, TA = 25°C Rev 04 / Apr. 2001 3 HY62CT08081E Series AC CHARACTERISTICS Vcc = 5V ±10%, TA = 0°C to 70°C (Normal) / -25°C to 85°C (Extended) / -40°C to 85°C (Industrial) unless otherwise specified. -55 -70 -85 # Symbol Parameter Min. Max. Min. Max. Min Max. READ CYCLE 1 tRC Read Cycle Time 55 70 85 2 tAA Address Access Time 55 70 85 3 tACS Chip Select Access Time 55 70 85 4 tOE Output Enable to Output Valid 25 35 45 5 tCLZ Chip Select to Output in Low Z 10 10 10 6 tOLZ Output Enable to Output in Low Z 5 5 5 7 tCHZ Chip Disable to Output in High Z 0 20 0 30 0 30 8 tOHZ Out Disable to Output in High Z 0 20 0 30 0 30 9 tOH Output Hold from Address Change 5 5 5 WRITE CYCLE 10 tWC Write Cycle Time 55 70 85 11 tCW Chip Selection to End of Write 45 60 75 12 tAW Address Valid to End of Write 45 60 75 13 tAS Address Set-up Time 0 0 0 14 tWP Write Pulse Width 40 50 60 15 tWR Write Recovery Time 0 0 0 16 tWHZ Write to Output in High Z 0 20 0 25 0 30 17 tDW Data to Write Time Overlap 25 30 40 18 tDH Data Hold from Write Time 0 0 0 19 tOW Output Active from End of Write 5 5 5 - Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns AC TEST CONDITIONS TA = 0°C to 70°C (Normal) / -25°C to 85°C (Extended) / -40°C to 85°C (Industrial) unless otherwise specified. Parameter Value Input Pulse Level 0.8V to 2.4V Input Rise and Fall Time 5ns Input and Output Timing Reference Level 1.5V Output Load tCLZ,tOLZ,tCHZ,tOHZ,tWHZ,tOW CL = 5pF + 1TTL Load Others CL = 100pF + 1TTL Load Rev 04 / Apr. 2001 4 HY62CT08081E Series AC TEST LOADS TTL CL(1) Note : Including jig and scope capacitance CAPACITANCE TA = 25°C, f = 1.0MHz Symbol Parameter CIN Input Capacitance CI/O Input /Output Capacitance Condition VIN = 0V VI/O = 0V Max. 6 8 Unit pF pF Note : These parameters are sampled and not 100% tested Rev 04 / Apr. 2001 5 HY62CT08081E Series TIMING DIAGRAM READ CYCLE 1 tRC ADDR tAA OE tOE tOH tOLZ CS tACS tOHZ tCHZ tCLZ Data Out High-Z Data Valid Note(READ CYCLE): 1. tCHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and arenot referenced to output voltage levels. 2. At any given temperature and voltage condition, tCHZ max. is less than tCLZ min. both for a given device and from device to device. 3. /WE is high for the read cycle. READ CYCLE 2 tRC ADDR tAA tOH tOH Data Out Previous Data Data Valid Note(READ CYCLE): 1. /WE is high for the read cycle. 2. Device is continuously selected /CS= VIL. 3. /OE =VIL. Rev 04 / Apr. 2001 6 HY62CT08081E Series WRITE CYCLE 1(/OE Clocked) tWC ADDR OE tAW tCW CS tAS tWR tWP WE tDW Data In tDH Data Valid tOHZ Data Out WRITE CYCLE 2 (/OE Low Fixed) tWC ADDR tAW tCW tWR CS tAS tWP WE tDW Data In tDH Data Valid tWHZ tOW (7) (8) Data Out Rev 04 / Apr. 2001 7 HY62CT08081E Series Notes(WRITE CYCLE): 1. A write occurs during the overlap of a low /CS and a low /WE. A write begins at the latest transition among /CS going low and /WE going low: A write ends at the earliest transition among /CS going high and /WE going high. tWP is measured from the beginning of write to the end of write. 2. tCW is measured from the later of /CS going low to the end of write . 3. tAS is measured from the address valid to the beginning of write. 4. tWR is measured from the end of write to the address change. tWR is applied in case a write ends as /CS, or /WE going high. 5. If /OE and /WE are in the read mode during this period, and the I/O pins are in the output low-Z state, input of opposite phase of the output must not be applied because bus contention can occur. 6. If /CS goes low simultaneously with /WE going low, or after /WE going low, the outputs remain in high impedance state. 7. DOUT is the same phase of the latest written data in this write cycle. 8. DOUT is the read data of the new address. DATA RETENTION CHARACTERISTIC TA = 0°C to 70°C (Normal) / -25°C to 85°C (Extended) / -40°C to 85°C (Industrial) unless otherwise specified. Symbol Parameter Test Condition Min VDR Vcc for Data Retention CS>Vcc-0.2V, 2.0 VIN>Vcc - 0.2V or VIN<Vss + 0.2V ICCDR Data Retention Current Vcc=3.0V, 0~70°C /CS>Vcc - 0.2V, VIN>Vcc - 0.2V or -25~85°C or VIN<Vss + 0.2V -40~85°C tCDR Chip Deselect to Data See Data Retention 0 Retention Time tR Operating Recovery Time Timing Diagram tRC(2) Notes 1. Typical values are under the condition of TA = 25°C. 2. tRC is read cycle time. Typ - Max - Unit V 0.5 5 uA 0.5 8 uA - - ns - - ns DATA RETENTION TIMING DIAGRAM DATA RETENTION MODE VCC 4.5V tCDR tR 2.2V VDR CS>VCC-0.2V CS VSS Rev 04 / Apr. 2001 8 HY62CT08081E Series PACKAGE INFORMATION 28pin 600mil Dual In-Line Package(Blank) • UNIT : INCH(mm) MAX. MIN. 1.467(37.262) 1.447(36.754) 0.600(15.240)BSC 0.090(2.286) 0.065(1.650) 0.070(1.778) 0.050(1.270) 0.550(13.970) 0.155(3.937) 0.530(13.462) 0.145(3.683) 0.035(0.889) 0.020(0.508) 0.140(3.556) 0.021(0.533) 0.100(2.54)BSC 3 deg 11 deg 0.120(3.048) 0.014(0.356) 0.008(0.200) 0.015(0.381) 28pin 330mil Small O utline Package(FW) 0.346(8.788) UNIT : INCH(mm) MAX .MIN. 0.338(8.585) 0.480(12.192) 0.460(11.684) 0.110(2.794) 0.728(18.491) 0.720(18.288) 0.094(2.388) 0.012(0.305) 0.014(0.356) 0.002(0.051) 0.050(1.270)BSC Rev 04 / Apr. 2001 0.020(0.508) 0.014(0.356) 0.008(0.203) 0.050(1.270) 0.030(0.762) 9 HY62CT08081E Series 28pin 8x13.4mm Thin Small Outline Package Standard(T) UNIT : INCH(mm) MAX. MIN. 0.468(11.9) 0.460(11.7) 0.536(13.6) 0.520(13.2) 0.319(8.1) 0.311(7.9) 0.027(0.7) 0.012(0.3) Rev 04 / Apr. 2001 0.008(0.2) 0.004(0.1) 0.040(1.02) 0.036(0.91) 0.008(0.20) 0.002(0.05) 0.022(0.55 BSC) 10 HY62CT08081E Series MARKING INFORMATION Package Marking Example PDIP SOP TSOP-I h y n i x H Y 6 2 C K O R E A h y n i x H Y 6 2 C K O R E A h y n i x H Y 6 2 C K O R E A T 0 T T 8 y y w w p 0 8 1 E c s s t x x x x x x x x y y w w p E c s s t 0 1 8 1 y y w w p E c s s t Index • hynix • KOREA • HY62CT081E • xxxxxxxx : hynix Logo : Origin Country : Part Name - HY62CT081E : HY62CT08081E : Year ( ex : 00 = year 2000, 01 = year 2001 ) : Work Week ( ex : 12 = ww12 ) : Process Code : Power Consumption -L : Low Power -D : Low Low Power : Speed - 55 : 55ns - 70 : 70ns : Temperature -C : Commercial ( 0 ~ 70 °C ) -E : Extended ( -25 ~ 85 °C ) -I : Industrial ( -40 ~ 85 °C ) : Lot Number Note - Capital Letter - Small Letter : Fixed Item : Non-fixed Item ( Except hynix ) • yy • ww •p •c • ss •t Rev 04 / Apr. 2001 11