DATA SHEET MOS INTEGRATED CIRCUIT µPD4712C/4712D RS-232 LINE DRIVER/RECEIVER The µPD4712C and 4712D are high-voltage silicon gate CMOS line driver/reciever conforming to the EIA/TIA-232-E standard. It can operate with a single +5 V power source because it is provided with a DC-DC converter. In addition, this line driver/receiver has many ancillary functions, including output control, threshold select, and standby functions. Because the µPD4712C and 4712D are provided with four output driver circuits and four receiver circuits, it can constitute an RS-232 interface circuit with a single chip. FEATURES • Conforms to EIA/TIA-232-E (RS-232C) standard • +5 V single power source • Threshold select pin selecting two types of threshold voltages • Standby mode can be set by making standby pin high to reduce circuit current. • Three-state output configuration. Both driver and receiver outputs go into high-impedance state in standby mode. ORDERING INFORMATION Part Number Package µPD4712CCY 28-pin plastic DIP (400 mil) µPD4712DCY 28-pin plastic DIP (400 mil) µPD4712CGT 28-pin plastic SOP (375 mil) µPD4712DGT 28-pin plastic SOP (375 mil) Document No. S10316EJ3V1DS00 (3rd edition) Date Published April 1997 N Printed in Japan © 1995 µPD4712C/4712D BLOCK DIAGRAM/PIN CONFIGURATION (Top View) +10 V + C3 C1 1 VDD 2 + C1 3 VCC 4 – C1 5 GND + DC-DC C4 28 + C4 converter GND 27 + +5 V Bypass capasitor TTL/CMOS INPUT Output control DIN1 DIN2 8 DIN4 9 DCON 10 300 Ω 300 Ω 300 Ω ROUT2 12 ROUT3 13 ROUT4 14 C2 –10 V 24 STBY Standby 7 DIN3 + 26 VSS 25 6 ROUT1 11 TTL/CMOS OUTPUT – C4 300 Ω 23 DOUT1 22 DOUT2 21 DOUT3 RS-232 OUTPUT 20 DOUT4 19 RIN1 5.5 kΩ 5.5 kΩ 5.5 kΩ 5.5 kΩ 18 RIN2 RS-232 17 RIN3 INPUT 16 RIN4 15 RCON Threshold control * VDD and Vss are output pins of voltages internally boosted. Connecting a load directly to these pins is not recommended. ** The standby pin is internally pulled down. *** Use capacitors with a working voltage of 16 V or higher as C1 through C4. Insert a bypass capasitor about 0.1 to 1 µF between VCC pin to GND pin. 2 µPD4712C/4712D TRUTH TABLE Drivers STBY DCON DIN DOUT H L L L Remark X X Z Standby mode (DC-DC converter stops) L X L Mark level output H L H Space level output H H L Mark level output STBY RIN ROUT H X Z Stanby mode (DC-DC converter stops) L L H Mark level input L H L Space level input Receivers Remark Receiver input threshold voltage RCON RIN1 to RIN2 RIN3 to RIN4 L A mode A mode H A mode B mode*/C mode ** *: µPD4712C, **: µPD4712D H: high level, L: low level, Z: high impedance, X: H or L 3 µPD4712C/4712D ABSOLUTE MAXIMUM RATINGS (TA = 25˚C) Parameter Symbol Ratings Unit Supply voltage VCC –0.5 to +6.0 V Driver input voltage DIN –0.5 to VCC +0.5 V Receiver input voltage RIN –30.0 to +30.0 V Driver output voltage DOUT –25.0 to +25.0 Note1 V Receiver output voltage ROUT –0.5 to VCC + 0.5 V Receiver input current IIN ±60.0 mA Operating temperature range TA –40 to +85 ˚C Storage temperature range Tstg –55 to +150 ˚C Power dissipation PT 0.5 W Note 1. Pulse width: 1 ms, duty factor: 10 % MAX. RECOMMENDED OPERATING RANGE Symbol MIN. TYP. MAX. Unit Supply voltage Parameter VCC 4.5 5.0 5.5 V Receiver input voltage RIN –30 +30 V Operating temperature range TA –20 80 ˚C External capacitance Note 2 4.7 47 µF Note 2. The capacitance of an electrolytic capacitor decreases at a low temperature (0 ˚C or lower). Determine the capacitance of the capacitor to be used taking this into consideration when the µPD4712C and 4712D are used at a low temperature. Keep the wiring length between the capacitor and IC as short as possible. ELECTRICAL CHARACTERISTICS (OVERALL) (Unless otherwise specified, VCC = +5 V ±10 %, TA = –20 ˚C to +80 ˚C, C1 to C4 = 22 µF) Parameter Symbol Circuit current Conditions MIN. TYP. MAX. Unit 9.0 18.0 mA 25.0 40.0 mA 50 120 µA 0.8 V VCC = +5 V, no load, RIN pin open ICC1 Circuit current (Standby pin open) VCC = +5 V, RL = 3 kΩ (DOUT), DIN = GND, ICC2 RIN and ROUT pins open (Standby pin open) Standby circuit current ICC (Standby) Standby low-level input voltage Standby high-level input voltage VIL VCC = +5 V, no load, RIN pin open (Standby pin high) Note 3 (Standby) VIH 2.0 (Standby) V Driver input and receiver input Input capacitance CIN VCC = +5 V, vs. GND, f = 1 MHz 10 pF * TYP.: Typical (reference) value at TA = 25 ˚C. Note 3. Because the standby pin is internally pulled down, if the standby pin is left open, operating mode is in effect. 4 µPD4712C/4712D ELECTRICAL CHARACTERISTICS (DRIVER) (Unless otherwise specified, VCC = +5 V ±10 %, TA = –20 ˚C to +80 ˚C, C1 to C4 = 22 µF) Parameter Symbol Low-level input voltage VIL High-level input voltage VIH Conditions MIN. TYP. MAX. Unit 0.8 V 2.0 V Low-level input current IIL 0 –1.0 µA High-level input current IIH 0 1.0 µA VCC = +5.0 V, RL = ∞, TA = 25 ˚C Output voltage VDO Output short current ISC Slew rate SR Propagation delay time Note 4 ±9.7 VCC = +5.0 V, RL = 3 kΩ ±5.5 VCC = +4.5 V, RL = 3 kΩ ±5.0 VCC = +5.0 V, vs. GND V V V ±15 ±40 mA CL = 10 pF, RL = 3 to 7 kΩ 1.5 9 30 V/µs CL = 2500 pF, RL = 3 to 7 kΩ 1.5 5 30 V/µs tPHL tPLH Output resistance RL = 3.5 kΩ, CL = 2500 pF µs 0.8 VCC = VDD = VSS = 0 V Ω RO VOUT = ±2 V Standby output transition time tDAZ Note 5 4 10 µs Standby output transition time tDZA Note 5 25 50 ms 300 * TYP.: Typical (reference) value at TA = 25 ˚C. Note 4. Test point If the output control pin is made low, the driver output goes low regardless of the driver input state. 6 ns 6 ns 5 90 % 90 % Driver input 1.5 V 1.5 V 10 % 10 % 0 tPHL VOH Driver output tPLH 3V –3 V VOL 10 % SR 90 % 3V –3 V SR 5 µPD4712C/4712D Note 5. Test Point 5V Standby input 1.5 V 1.5 V 0V +5 V VOH +5 V High impedance Driver output –5 V –5 V VOL tDZA tDAZ Do not perform communication within the standby output transition time tDZA on power application or on releasing the standby mode. ELECTRICAL CHARACTERISTICS (RECEIVER) (Unless otherwise specified, VCC = +5 V ±10 %, TA = –20 ˚C to +80 ˚C, C1 to C4 = 22 µF) Parameter Symbol Low-level output voltage High-level output voltage VOL VOH Conditions MIN. TYP. IOUT = 4 mA IOUT = –4 mA MAX Unit 0.4 V VCC V –0.8 Low-level input voltage High-level input voltage Propagation delay time Note 7 VIL RCON pin VIH RCON pin RL = 1 kΩ, CL = 150 pF Input current IIN Input resistance RI Input pin release voltage VIO Input threshold A mode only Input threshold A mode VIH Input threshold B mode Note 6 (RCON pin high) Only applicable to the µPD4712C Input threshold C mode Note 6 V V 2.0 tPHL tPLH (RCON pin low) 0.8 µs 0.13 mA 1 3 5 7 kΩ 0.5 V VCC = +5 V 1.6 2.2 2.6 V VIL VCC = +5 V 0.6 1 1.6 V VH VCC = +5 V (hysteresis width) 0.5 1.2 1.8 V VIH VCC = +5 V 1.6 2.2 2.6 V VIL VCC = +5 V –0.4 –1.8 –3.0 V VH VCC = +5 V (hysteresis width) 2.6 4.0 5.4 V VIH VCC = +5 V –0.4 –0.8 –1.6 V VIL VCC = +5 V –0.8 –2.0 –3.0 V Only applicable to the µPD4712D VH VCC = +5 V (hysteresis width) 0.5 1.2 1.8 V Standby output transition time tDAZ Note 8 0.4 1 µs Standby output transiton time tDZA Note 8 0.03 10 ms (RCON pin high) * TYP.: Typical (reference) value at TA = 25 ˚C. Note 6. 6 This data is applicable to receivers 3 and 4 only. Receiver 1 and 2 are fixed in input threshold A mode. µPD4712C/4712D Note 7. Test Point 10 ns 10 ns 5 90 % 90 % Receiver input VIH TYP. VIL TYP. 10 % 10 % –5 tPHL tPLH VOH Receiver output 1.5 V 1.5 V VOL Note 8. Test Point 5V Standby input 1.5 V 1.5 V 0V VOH 90 % High impedance Receiver output 10 % VOL tDAZ tDZA The receiver output is undefined during the standby output transition time t DZA. Do not perform communication in the standby output transition time t DZA on power application or on releasing the standby mode. 7 µPD4712C/4712D TEST CIRCUIT Driver output voltage/Output current (+ side) +10 V + C3 C1 1 VDD + 1 2 C 3 VCC 4 C – 1 5 GND + DC-DC C4 28 + C4 converter GND 27 + +5 V – C4 + 26 C2 –10 V VSS 25 STBY 24 6 300 Ω 7 300 Ω 8 300 Ω 9 300 Ω 10 23 22 21 20 19 5.5 kΩ 11 18 5.5 kΩ 12 13 17 5.5 kΩ 14 V IDO VDO 16 15 5.5 kΩ Driver output voltage/Output current (– side) +10 V + C3 C1 +5 V 1 VDD 2 C + 1 3 VCC 4 C – 1 5 GND DC-DC C4 + + C4 – 300 Ω 8 300 Ω 9 300 Ω 10 13 14 + C2 –10 V STBY 24 7 12 26 VSS 25 300 Ω 11 + GND 27 6 8 28 C4 converter 23 22 21 20 19 5.5 kΩ 5.5 kΩ 5.5 kΩ 5.5 kΩ 18 17 16 15 V IDO VDO µPD4712C/4712D PACKAGE DRAWINGS 28PIN PLASTIC DIP (400 mil) 28 15 1 14 A K L P I J H F D G C N M NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" to center of leads when formed parallel. M R B ITEM MILLIMETERS INCHES A B 35.56 MAX. 1.27 MAX. 1.400 MAX. 0.050 MAX. C 2.54 (T.P.) 0.100 (T.P.) D 0.50±0.10 0.020 +0.004 –0.005 F 1.1 MIN. 0.043 MIN. G H 3.5±0.3 0.51 MIN. 0.138±0.012 0.020 MIN. I J 4.31 MAX. 5.72 MAX. 0.170 MAX. 0.226 MAX. K 10.16 (T.P.) 0.400 (T.P.) L 8.6 0.339 M 0.25 +0.10 –0.05 0.010 +0.004 –0.003 N 0.25 P 0.9 MIN. R 0~15 ° 0.01 0.035 MIN. 0~15° P28C-100-400-1 9 µPD4712C/4712D 28 PIN PLASTIC SOP (375 mil) 28 15 P detail of lead end 1 14 A H J E K F G I B C D M L N M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 18.07 MAX. 0.712 MAX. B 0.78 MAX. 0.031 MAX. C 1.27 (T.P.) 0.050 (T.P.) D 0.40 +0.10 –0.05 0.016 +0.004 –0.003 E 0.1±0.1 0.004±0.004 F 2.9 MAX. 0.115 MAX. G 2.50 0.098 H 10.3±0.3 0.406 +0.012 –0.013 I 7.2 0.283 J 1.6 0.063 K 0.15 +0.10 –0.05 0.006 +0.004 –0.002 L 0.8±0.2 M 0.12 0.005 N 0.15 0.006 P 3 ° +7° –3° 3° +7° –3° 0.031 +0.009 –0.008 P28GM-50-375B-3 10 µPD4712C/4712D RECOMMENDED SOLDERING CONDITIONS Soldering the µPD4712C and 4712D under the conditions listed in the table below is recommended. For soldering methods and conditions other than those recommended, consult NEC. Surface mount type For the details of the recommended soldering conditions of the surface mount type, refer to Information document “Semiconductor Device Mounting Technology Manual” (C10535EJ7V0IF00) µPD4712CGT, 4712DGT Soldering Method Infrared reflow Soldering Condition Package peak temperature: 235 ˚C, Time: 3 0 seconds MAX. Recommended Condition Symbol IR35-00-2 (210 ˚C MIN.), Number of times: 2, Number of days: not limited* VPS Package peak temperature: 215 ˚C, Time: 40 seconds MAX. VP15-00-2 (200 ˚C MIN.), Number of times: 2, Number of days: not limited* Wave soldering Soldering bath temperature: 260 ˚C MAX., Time: 10 seconds WS60-00-1 MAX., Number of times: 1, Number of days: not limited* Pin partial heating Pin temperature: 300 ˚C MAX. (lead temperature), Time: 3 seconds MAX. (per lead pin), Number of days: not limited* * The number of days the device can be stored at 25 ˚C, 65 % RH MAX. after the dry pack has been opened. Caution Do not use two or more soldering methods in combination (except the pin partial heating method). Throught-hole type µPD4712CCY, 4712DCY Soldering Method Soldering Conditions Wave soldering Soldering bath temperature: 260 ˚C MAX., Time: 10 seconds MAX. REFERENCE DOCUMENTS “NEC Semiconductor Device Reliability/Quality Control System” (IEI-1212) “Quality Grade on NEC Semiconductor Devices” (IEI-1209) “Semiconductor Device Mounting Technology Manual” (C10535EJ7V0IF00) 11 µPD4712C/4712D [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 12