E2C0042-19-62 ¡ Semiconductor ¡ Semiconductor ML9206-xx This version: ML9206-xx Jun. 1999 5 ¥ 7 Dot Character ¥ 16-Digit Display Controller/Driver with Character RAM GENERAL DESCRIPTION The ML9206-xx is a dot matrix vacuum fluorescent display tube controller driver IC which displays characters, numerics and symbols. Dot matrix vacuum fluorescent display tube drive signals are generated by serial data sent from a micro-controller. A display system is easily realized by internal ROM and RAM for character display. The ML9206-xx has low power consumption since it is made by CMOS process technology. -01 is available as a general-purpose code. Custom codes are provided on customer's request. FEATURES • Logic power supply and vacuum fluorescent display tube drive power supply (VDD) : 3.3 V±10% or 5.0 V±10% • Fluorescent display tube drive power supply (VFL) : –20 to –60 V • VFD driver output current (VFD driver output can be connected directly to the fluorescent display tube. No pull-down resistor is required.) - Segment driver (SEG1 to SEG35) : –6 mA (VFL=–60V) - Segment driver (AD1 and AD2) : –15 mA (VFL=–60V) - Grid driver (COM1 to COM16) : –30 mA (VFL=–60V) • General output port output current - Output driver (P1 and P2) : ±1 mA (VDD=3.3V±10%) ±2 mA (VDD=5.0V±10%) • Content of display - CGROM 5¥7 dots : 248 types (character data) - CGRAM 5¥7 dots : 8 types (character data) - ADRAM 16 (display digit) ¥2 bits (symbol data) - DCRAM 16 (display digit) ¥8 bits (register for character data display) - General output port 2 bits (static operation) • Display control function - Display digit : 1 to 16 digits - Display duty (brightness adjustment) : 256 stages - All lights ON/OFF • 3 interfaces with microcontroller : DA, CS, CP (4 interfaces when RESET is added) • 1-byte instruction execution (excluding data write and display duty set mode to RAM) • Built-in oscillation circuit (external R and C) • Package options: 64-pin plastic QFP (QFP64-P-1414-0.80-BK) (Product name : ML9206-xxGS-BK) 64-pin plastic SSOP (SSOP64-P-525-0.80-K) (Product name : ML9206-xxGS-K) xx indicates the code number. 1/32 ¡ Semiconductor ML9206-xx BLOCK DIAGRAM VDD GND VFL DCRAM 16w¥8b SEG1 CGROM 248w¥35b Segment Driver CGRAM 8w¥35b RESET DA CP CS 8bit Shift Register ADRAM 16w¥2b SEG35 AD1 AD Driver AD2 Address Selector Command Decoder Write Address Counter Read Address Counter P1 Port Driver Control Circuit P2 Digit Control Duty Control Timing Generator 1 COM1 Grid Driver COM16 Timing Generator 2 OSC0 OSC1 Oscillator 2/32 ¡ Semiconductor ML9206-xx INPUT AND OUTPUT CONFIGURATION Schematic Diagrams of Logic Portion Input and Output Circuits Input Pin VDD VDD INPUT GND GND Output Pin VDD VDD OUTPUT GND GND Schematic Diagram of Driver Output Circuit VDD VDD OUTPUT VFL VFL 3/32 ¡ Semiconductor ML9206-xx 49 GND 50 OSC0 51 OSC1 52 RESET 53 CS 54 CP 55 DA 56 VDD 57 P1 58 P2 59 AD2 60 AD1 61 SEG1 62 SEG2 63 SEG3 64 SEG4 PIN CONFIGURATION (TOP VIEW) SEG5 1 48 VFL SEG6 2 47 COM16 SEG7 3 46 COM15 SEG8 4 45 COM14 SEG9 5 44 COM13 SEG10 6 43 COM12 SEG11 7 42 COM11 SEG12 8 41 COM10 SEG13 9 40 COM9 SEG14 10 39 COM8 COM1 32 SEG35 31 SEG34 30 SEG33 29 SEG32 28 SEG31 27 SEG30 26 SEG29 25 33 COM2 SEG28 24 34 COM3 SEG20 16 SEG27 23 SEG19 15 SEG26 22 35 COM4 SEG25 21 36 COM5 SEG18 14 SEG24 20 SEG17 13 SEG23 19 37 COM6 SEG22 18 38 COM7 SEG21 17 SEG15 11 SEG16 12 NC: No connection 64-Pin Plastic QFP 4/32 ¡ Semiconductor ML9206-xx P1 1 64 VDD P2 2 63 DA AD2 3 62 CP AD1 4 61 CS SEG1 5 60 RESET SEG2 6 59 OSC1 SEG3 7 58 OSC0 SEG4 8 57 GND SEG5 9 56 VFL SEG6 SEG7 10 11 55 54 COM16 COM15 SEG8 12 53 COM14 SEG9 13 52 COM13 SEG10 14 51 COM12 SEG11 15 50 COM11 SEG12 16 49 COM10 SEG13 SEG14 17 18 48 47 COM9 COM8 SEG15 19 46 COM7 SEG16 20 45 COM6 SEG17 21 44 COM5 SEG18 22 43 COM4 SEG19 23 42 COM3 SEG20 24 41 COM2 SEG21 SEG22 25 26 40 39 COM1 SEG35 SEG23 27 38 SEG34 SEG24 28 37 SEG33 SEG25 29 36 SEG32 SEG26 30 35 SEG31 SEG27 SEG28 31 34 32 33 SEG30 SEG29 64-Pin Plastic SSOP 5/32 ¡ Semiconductor ML9206-xx PIN DESCRIPTION Pin QFP SSOP Symbol Type Connects to Description 1 to 31, 5 to 39 SEG1 to 35 61 to 64 O Fluorescent tube anode electrode Fluorescent display tube anode electrode drive output. Directly connected to fluorescent display tube and a pull-down resistor is not necessary. IOH>–6 mA 32 to 47 40 to 55 COM1 to 16 O Fluorescent tube grid electrode Fluorescent display tube grid electrode drive output. Directly connected to fluorescent display tube and a pull-down resistor is not necessary. IOH>–30 mA 59, 60 3, 4 AD1, AD2 O Fluorescent tube anode electrode Fluorescent display tube anode electrode drive output. Directly connected to fluorescent display tube and a pull-down resistor is not necessary. IOH>–15 mA 57, 58 1, 2 P1, P2 O LED drive control pins General port output. Output of these pins in static operation, so these pins can drive the LED. 56 64 VDD 49 57 GND — Power supply 48 56 VFL 55 63 DA I Microcontroller Serial data input (positive logic). Input from LSB. 54 62 CP I Microcontroller Shift clock input. Serial data is shifted on the rising edge of CP. 53 61 CS I Microcontroller Chip select input. Serial data transfer is disabled when CS pin is "H" level. Microcontroller or C2, R2 Reset input. "Low" initializes all the functions. Initial status is as follows. address "00"H • Address of each RAM Content is undefined • Data of each RAM 16 digits • Display digit 0/256 • brightness adjusment OFF mode • All lights ON or OFF "Low" level • All outputs 52 60 RESET I VDD-GND are power supplies for internal logic. VDD-VFL are power supplies for driving fluorescent tubes. Apply VFL after VDD is applied. RESET R2 C2 50 58 OSC0 External RC pin for RC oscillation. Connect R and C externally. The RC time constant depends on the VDD voltage used. Set the target oscillation frequency to 2 MHz. I C1, R1 51 59 OSC1 O (Circuit when R and C are connected externally) See Application Circuit. OSC0 R1 OSC1 C1 (RC oscillation circuit) See Application Circuit. 6/32 ¡ Semiconductor ML9206-xx ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Rating Unit Supply Voltage (1) VDD — –0.3 to +6.5 V Supply Voltage (2) VFL — –80 to VDD+0.3 V Input Voltage VIN — –0.3 to VDD+0.3 V Power Dissipation PD Storage Temperature Output Current Ta≥25°C QFP 541 SSOP 590 TSTG — –55 to +150 IO1 COM1 to COM16 –40 to 0.0 IO2 AD1, AD2 –20 to 0.0 IO3 SEG1 to SEG35 –10 to 0.0 IO4 P1, P2 –4.0 to +4.0 mW °C mA RECOMMENDED OPERATING CONDITIONS-1 When the power supply voltage is 5V (typ.) Parameter Symbol Condition Min. Typ. Max. Unit Supply Voltage (1) VDD — 4.5 5.0 5.5 V Supply Voltage (2) VFL — –60 — –20 V High Level Input Voltage VIH All input pins excluding OSC0 pin 0.7VDD — — V Low Level Input Voltage VIL All input pins excluding OSC0 pin — 0.3VDD V CP Frequency — fC — — — 2.0 MHz fOSC R1=3.3kW, C1=47pF 1.5 2.0 2.5 MHz Frame Frequency fFR DIGIT=1 to 16, R1=3.3kW, C1=47pF 183 244 305 Hz Operating Temperature Top — –40 — +85 °C Oscillation Frequency 7/32 ¡ Semiconductor ML9206-xx RECOMMENDED OPERATING CONDITIONS-2 When the power supply voltage is 3.3V (typ.) Parameter Symbol Condition Min. Typ. Max. Unit Supply Voltage (1) VDD Supply Voltage (2) VFL — 3.0 — –60 3.3 3.6 V — –20 V High Level Input Voltage VIH All input pins excluding OSC0 pin 0.8VDD — — V Low Level Input Voltage VIL All input pins excluding OSC0 pin CP Frequency fC — — — 0.2VDD V — — 2.0 MHz Oscillation Frequency fOSC R1=3.3kW, C1=39pF 1.5 2.0 2.5 MHz Frame Frequency fFR DIGIT=1 to 16, R1=3.3kW, C1=39pF 183 244 305 Hz Operating Temperature Top — –40 — +85 °C ELECTRICAL CHARACTERISTICS DC Characteristics-1 (VDD=5.0V±10%, VFL=–60V, Ta=–40 to +85°C, unless otherwise specified) Parameter Symbol High Level Input Voltage VIH Low Level Input Voltage VIL High Level Input Current IIH Low Level Input Current IIL Applied pin CS, CP, DA, RESET CS, CP, DA, RESET CS, CP, DA, RESET CS, CP, DA, RESET Condition Min. Max. Unit — 0.7VDD — V — — 0.3VDD V VIH=VDD –1.0 +1.0 µA VIL=0.0V –1.0 +1.0 µA VOH1 COM1 to 16 IOH1=–30mA VDD–1.5 — V High Level Output VOH2 AD1, AD2 IOH2=–15mA VDD–1.5 — V Voltage VOH3 SEG1 to 35 IOH3=–6mA VDD–1.5 — V VOH4 P1, P2 IOH4=–2mA VDD–1.0 — V — — VFL+1.0 V IOL1=2mA — 1.0 V — 4 mA — 3 mA COM1 to 16 Low Level Output VOL1 AD1, AD2 SEG1 to 35 Voltage VOL2 P1, P2 Duty=240/256 IDD1 fOSC= VDD Supply Current IDD2 2MHz, no load Digit=1 to 16 All output lights ON Duty=128/256 Digit=1 to 9 All output lights OFF 8/32 ¡ Semiconductor ML9206-xx DC Characteristics-2 Parameter (VDD=3.3V±10%, VFL=–60V, Ta=–40 to +85°C, unless otherwise specified) Symbol High Level Input Voltage VIH Low Level Input Voltage VIL High Level Input Current IIH Low Level Input Current IIL Applied pin CS, CP, DA, RESET CS, CP, DA, RESET CS, CP, DA, RESET CS, CP, DA, RESET Condition Min. Max. Unit — 0.8VDD — V — — 0.2VDD V VIH=VDD –1.0 +1.0 µA VIL=0.0V –1.0 +1.0 µA VOH1 COM1 to 16 IOH1=–30mA VDD–1.5 — V High Level Output VOH2 AD1, AD2 IOH2=–15mA VDD–1.5 — V Voltage VOH3 SEG1 to 35 IOH3=–6mA VDD–1.5 — V VOH4 P1, P2 IOH4=–1mA VDD–1.0 — V — — VFL+1.0 V IOL1=1mA — 1.0 V — 3 mA — 2 mA COM1 to 16 Low Level Output VOL1 AD1, AD2 SEG1 to 35 Voltage VOL2 P1, P2 Duty=240/256 IDD1 fOSC= VDD Supply Current IDD2 2MHz, no load Digit=1 to 16 All output lights ON Duty=128/256 Digit=1 to 9 All output lights OFF 9/32 ¡ Semiconductor ML9206-xx AC Characteristics-1 (VDD=5.0V±10%, VFL=–60V, Ta=–40 to +85°C, unless otherwise specified) Parameter Symbol Condition Min. Max. Unit fC — — 2.0 MHz CP Pulse Width tCW — 250 — ns DA Setup Time tDS — 250 — ns DA Hold Time tDH — 250 — ns CS Setup Time tCSS — 250 — ns CS Hold Time tCSH R1=3.3kW, C1=47pF 16 — ms CS Wait Time tCSW — 250 — ns Data Processing Time tDOFF R1=3.3kW, C1=47pF 8 — ms RESET Pulse Width tWRES When RESET signal is input from microcontroller etc. externally 250 — ns RESET Time tRSON When RESET signal is input from microcontroller etc. externally 250 — ns R2=1.0kW, C2=0.1mF — 200 ms DA Wait Time tRSOFF — 250 — ns CP Frequency All Output Slew Rate tR Cl=100pF tF tR=20% to 80% — 2.0 ms tF=80% to 20% — 2.0 ms VDD Rise Time tPRZ When mounted in the unit — 100 ms VDD Off Time tPOF When mounted in the unit, VDD=0.0V 5.0 — ms AC Characteristics-2 (VDD=3.3V±10%, VFL=–60V, Ta=–40 to +85°C, unless otherwise specified) Parameter Symbol Condition Min. Max. Unit fC — — 2.0 MHz CP Pulse Width tCW — 250 — ns DA Setup Time tDS — 250 — ns DA Hold Time tDH — 250 — ns CS Setup Time tCSS — 250 — ns CS Hold Time tCSH R1=3.3kW, C1=39pF 16 — ms CS Wait Time tCSW — 250 — ns Data Processing Time tDOFF R1=3.3kW, C1=39pF 8 — ms RESET Pulse Width tWRES When RESET signal is input from microcontroller etc. externally 250 — ns RESET Time tRSON When RESET signal is input from microcontroller etc. externally 250 — ns R2=1.0kW, C2=0.1mF — 200 ms DA Wait Time tRSOFF — 250 — ns tR=20% to 80% — 2.0 ms tF=80% to 20% — 2.0 ms CP Frequency All Output Slew Rate tR tF Cl=100pF VDD Rise Time tPRZ When mounted in the unit — 100 ms VDD Off Time tPOF When mounted in the unit, VDD=0.0V 5.0 — ms 10/32 ¡ Semiconductor ML9206-xx TIMING DIAGRAM Symbol VDD=3.3V±10% VDD=5.0V±10% VIH 0.8 VDD 0.7 VDD VIL 0.2 VDD 0.3 VDD • Data Timing tCSS tCSW CS tCSH fC tDOFF CP VIH VIL tCW tDH tDS DA tCW VIH VIL VALID VALID VALID VIH VIL VALID • Reset Timing VDD tPRZ tRSON When input externally tWRES tRSOFF = RESET tPOF When external R and C are connected tRSOFF DA 0.8 VDD 0.0 V VIH 0.5 VDD VIL VIH VIL • Output Timing All outputs tR tF 0.8 VDD 0.2 VFL 11/32 ¡ Semiconductor ML9206-xx • Digit Output Timing (for 16-digit display, at a duty of 240/256) T=2/ fOSC COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 AD1, 2 SEG1-35 Frame cycle t1=4096T (t1=4.096 ms when fosc=2.0 MHz) Display timing t2=240T (t2=240 ms when fosc=2.0 MHz) Blank timing t3=16T (t3=16 ms when fosc=2.0 MHz) VDD VFL VDD VFL 12/32 ¡ Semiconductor ML9206-xx FUNCTIONAL DESCRIPTION Commands List Command 1 DCRAM data write 2 CGRAM data write 3 ADRAM data write 1st byte LSB 2nd byte MSB LSB B0 B1 B2 B3 B4 B5 B6 B7 B0 B1 B2 B3 B4 B5 B6 B7 X0 X1 X2 X3 1 0 0 0 C0 C1 C2 C3 C4 C5 C6 C7 C0 C5 C10 C15 C20 C25 C30 C1 C6 C11 C16 C21 C26 C31 C2 C7 C12 C17 C22 C27 C32 C3 C8 C13 C18 C23 C28 C33 C4 C9 C14 C19 C24 C29 C34 * * * * * C0 C1 * * * * * * D1 D2 D3 D4 D5 D6 D7 X0 X1 X2 * 0 1 0 0 X0 X1 X2 X3 1 1 0 0 4 General output port set P1 P2 * * 0 0 1 0 5 Display duty set * * * * 1 0 1 0 D0 6 Number of digits set K0 K1 K2 * 0 1 1 0 7 All lights ON/OFF L H * * 1 1 1 0 * Test mode When data is written to RAM (DCRAM, CGRAM, ADRAM) continuously, addresses are internally incremented automatically. Therefore it is not necessary to specify the 1st byte to write RAM data for the 2nd and later bytes. Xn Cn Pn Dn Kn H L : : : : : : : : MSB 2nd byte 3rd byte 4th byte 5th byte 6th byte Don't care Address specification for each RAM Character code specification for each RAM General output port status specification Display duty specification Number of digits specification All lights ON instruction All lights OFF instruction Note: The test mode is used for inspection before shipment. It is not a user function. 13/32 ¡ Semiconductor ML9206-xx Positional Relationship Between SEGn and ADn (one digit) C0 AD1 ADRAM written data. Corresponds to 2nd byte C1 AD2 CGRAM written data. Corresponds to 2nd byte CGRAM written data. Corresponds to 3rd byte CGRAM written data. Corresponds to 4th byte C0 C1 C2 C3 C4 SEG1 SEG2 SEG3 SEG4 SEG5 C5 C6 C7 C8 C9 SEG6 SEG7 SEG8 SEG9 SEG10 C10 C11 C12 C13 C14 SEG11 SEG12 SEG13 SEG14 SEG15 C15 C16 C17 C18 C19 SEG16 SEG17 SEG18 SEG19 SEG20 C20 C21 C22 C23 C24 SEG21 SEG22 SEG23 SEG24 SEG25 C25 C26 C27 C28 C29 SEG26 SEG27 SEG28 SEG29 SEG30 C30 C31 C32 C33 C34 SEG31 SEG32 SEG33 SEG34 SEG35 CGRAM written data. Corresponds to 6th byte CGRAM written data. Corresponds to 5th byte 14/32 ¡ Semiconductor ML9206-xx Data Transfer Method and Command Write Method Display control command and data are written by an 8-bit serial transfer. Write timing is shown in the figure below. Setting the CS pin to "Low" level enables a data transfer. Data is 8 bits and is sequentially input into the DA pin from LSB (LSB first). As shown in the figure below, data is read by the shift register at the rising edge of the shift clock, which is input into the CP pin. If 8-bit data is input, internal load signals are automatically generated and data is written to each register and RAM. Therefore it is not necessary to input load signals from the outside. Setting the CS pin to "High" disables data transfer. Data input from the point when the CS pin changes from "High" to "Low" is recognized in 8-bit units. tDOFF CS tCSH CP DA B0 B1 B2 B3 B4 B5 B6 B7 LSB 1st byte MSB When data is written to DCRAM* Command and address data * B0 B1 B2 B3 B4 B5 B6 B7 B0 B1 B2 B3 B4 B5 B6 B7 LSB LSB 2nd byte MSB Character code data 2nd byte MSB Character code data of the next address When data is written to RAM (DCRAM, ADRAM, CGRAM) continuously, addresses are internally incremented automatically. Therefore it is not necessary to specify the 1st byte to write RAM data for the 2nd and later bytes. Reset Function Reset is executed when the RESET pin is set to "L", (when turning power on, for example) and initializes all functions. Initial status is as follows. • Address of each RAM .................. address "00"H • Data of each RAM ........................ All contents are undefined • General output port ..................... All general output ports go "Low" • Display digit .................................. 16 digits • Brightness adjustment ................. 0/256 • All display lights ON or OFF ..... OFF mode • Segment output ............................ All segment outputs go "Low" • AD output ..................................... All AD outputs go "Low" Please set again according to "Setting Flowchart" after reset. 15/32 ¡ Semiconductor ML9206-xx Description of Commands and Functions 1. DCRAM data write (Specifies the address of DCRAM and writes the character code of CGROM and CGRAM.) DCRAM (Data Control RAM) has a 4-bit address to store character code of CGROM and CGRAM. The character code specified by DCRAM is converted to a 5¥7 dot matrix character pattern via CGROM or CGRAM. (The DCRAM can store 16 characters.) [Command format] LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 1st byte (1st) X0 X1 X2 X3 LSB 1 0 0 0 MSB : selects DCRAM data write mode and specifies DCRAM address (Ex: Specifies DCRAM address 0H) B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (2nd) C0 C1 C2 C3 C4 C5 C6 C7 : specifies character code of CGROM and CGRAM (written into DCRAM address 0H) To specify the character code of CGROM and CGRAM continuously to the next address, specify only character code as follows. The addresses of DCRAM are automatically incremented. Specification of the 1st byte is unnecessary. 16/32 ¡ Semiconductor ML9206-xx LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (3rd) C0 C1 C2 C3 C4 C5 C6 C7 LSB : specifies character code of CGROM and CGRAM (written into DCRAM address 1H) MSB B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (4th) : specifies character code of CGROM and CGRAM (written into DCRAM address 2H) C0 C1 C2 C3 C4 C5 C6 C7 LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (17th) C0 C1 C2 C3 C4 C5 C6 C7 LSB : specifies character code of CGROM and CGRAM (written into DCRAM address FH) MSB B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (18th) : specifies character code of CGROM and CGRAM (DCRAM address 0H is rewritten) C0 C1 C2 C3 C4 C5 C6 C7 X0 (LSB) to X3 (MSB): DCRAM addresses (4 bits: 16 characters) C0 (LSB) to C7 (MSB): Character code of CGROM and CGRAM (8 bits: 256 characters) [COM positions and set DCRAM addresses] HEX X0 X1 X2 X3 COM position 0 0 0 0 0 COM1 1 1 0 0 0 COM2 2 0 1 0 0 COM3 3 1 1 0 0 COM4 4 0 0 1 0 COM5 5 1 0 1 0 COM6 6 0 1 1 0 COM7 7 1 1 1 0 COM8 8 0 0 0 1 COM9 9 1 0 0 1 COM10 A 0 1 0 1 COM11 B 1 1 0 1 COM12 C 0 0 1 1 COM13 D 1 0 1 1 COM14 E 0 1 1 1 COM15 F 1 1 1 1 COM16 17/32 ¡ Semiconductor ML9206-xx 2. CGRAM data write (Specifies the addresses of CGRAM and writes character pattern data.) CGRAM (Character Generator RAM) has a 3-bit address to store 5¥7 dot matrix character patterns. A character pattern stored in CGRAM can be displayed by specifying the character code (address) by DCRAM. The address of CGRAM is assigned to 00H to 07H. (All the other addresses are the CGROM addresses.) (The CGRAM can store 8 types of character patterns.) [Command format] LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 1st byte (1st) X0 X1 X2 * 0 1 0 LSB 0 MSB : selects CGRAM data write mode and specifies CGRAM address. (Ex: specifies CGRAM address 00H) B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (2nd) C0 C5 C10 C15 C20 C25 C30 LSB * : specifies 1st column data (rewritten into CGRAM address 00H) MSB B0 B1 B2 B3 B4 B5 B6 B7 3rd byte (3rd) C1 C6 C11 C16 C21 C26 C31 LSB * : specifies 2nd column data (rewritten into CGRAM address 00H) MSB B0 B1 B2 B3 B4 B5 B6 B7 4th byte (4th) C2 C7 C12 C17 C22 C27 C32 LSB * : specifies 3rd column data (rewritten into CGRAM address 00H) MSB B0 B1 B2 B3 B4 B5 B6 B7 5th byte (5th) C3 C8 C13 C18 C23 C28 C33 LSB * : specifies 4th column data (rewritten into CGRAM address 00H) MSB B0 B1 B2 B3 B4 B5 B6 B7 6th byte (6th) C4 C9 C14 C19 C24 C29 C34 * : specifies 5th column data (rewritten into CGRAM address 00H) To specify character pattern data continuously to the next address, specify only character pattern data as follows. The addresses of CGRAM are automatically incremented. Specification of the 1st byte is therefore unnecessary. The 2nd to 6th byte (character pattern data) are regarded as one data item, so 300 ns is sufficient for tDOFF time between bytes. 18/32 ¡ Semiconductor ML9206-xx LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (7th) C0 C5 C10 C15 C20 C25 C30 LSB * : specifies 1st column data (rewritten into CGRAM address 01H) MSB B0 B1 B2 B3 B4 B5 B6 B7 6th byte (11th) C4 C9 C14 C19 C24 C29 C34 * : specifies 5th column data (rewritten into CGRAM address 01H) X0 (LSB) to X2 (MSB): CGRAM addresses (3 bits: 8 characters) C0 (LSB) to C34 (MSB) : Character pattern data (35 bits: 35 outputs per digit) * : Don't care [CGROM addresses and set CGRAM addresses] Refer to ROMCODE table HEX X0 X1 X2 CGROM address 00 0 0 0 RAM00(00000000B) 01 1 0 0 RAM01(00000001B) 02 0 1 0 RAM02(00000010B) 03 1 1 0 RAM03(00000011B) 04 0 0 1 RAM04(00000100B) 05 1 0 1 RAM05(00000101B) 06 0 1 1 RAM06(00000110B) 07 1 1 1 RAM07(00000111B) 19/32 ¡ Semiconductor ML9206-xx Positional relationship between the output area of CGROM and that of CGRAM C0 area that corresponds to 2nd byte (1st column) area that corresponds to 3rd byte (2nd column) C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C29 C30 C31 C32 C33 C34 area that corresponds to 6th byte (5th column) area that corresponds to 5th byte (4th column) area that corresponds to 4th byte (3rd column) Note: CGROM (Character Generator ROM) has an 8-bit address to generate 5¥7 dot matrix character patterns. CGRAM can store 248 types of character patterns. General-purpose code -01 is available (see ROM CODE list) and custom codes are provided on customer's request. 20/32 ¡ Semiconductor ML9206-xx 3. ADRAM data write (specifies address of ADRAM and writes symbol data) ADRAM (Additional Data RAM) has a 2-bit address to store symbol data. Symbol data specified by ADRAM is directly output without CGROM and CGRAM. (The ADRAM can store 2 types of symbol patterns for each digit.) The terminal to which the contents of ADRAM are output can be used as a cursor. [Command format] LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 1st byte (1st) X0 X1 X2 X3 1 1 0 LSB 0 MSB : selects ADRAM data write mode and specifies ADRAM address (Ex: specifies ADRAM address 0H) B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (2nd) C0 C1 * * * * * * : sets symbol data (written into ADRAM address 0H) To specify symbol data continuously to the next address, specify only symbol data as follows. The address of ADRAM is automatically incremented. Specification of the 1st byte is therefore unnecessary. LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (3rd) C0 C1 * * * * * LSB * MSB : sets symbol data (written into ADRAM address 1H) B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (4th) C0 C1 * * * * * LSB * : sets symbol data (written into ADRAM address 2H) MSB B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (17th) C0 C1 * * * * * LSB * MSB : sets symbol data (written into ADRAM address FH) B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (18th) C0 C1 * * * * * * : sets symbol data (ADRAM address 0H is rewritten.) X0 (LSB) to X3 (MSB) : ADRAM addresses (4 bits: 16 characters) C0 (LSB) to C1 (MSB): Symbol data (2 bits: 2-symbol data per digit) * : Don't care 21/32 ¡ Semiconductor ML9206-xx [COM positions and ADRAM addresses] HEX X0 X1 X2 X3 COM position 0 0 0 0 0 COM1 1 1 0 0 0 COM2 2 0 1 0 0 COM3 3 1 1 0 0 COM4 4 0 0 1 0 COM5 5 1 0 1 0 COM6 6 0 1 1 0 COM7 7 1 1 1 0 COM8 8 0 0 0 1 COM9 9 1 0 0 1 COM10 A 0 1 0 1 COM11 B 1 1 0 1 COM12 C 0 0 1 1 COM13 D 1 0 1 1 COM14 E 0 1 1 1 COM15 F 1 1 1 1 COM16 4. General output port set (specifies the general output port status) The general output port is an output for 2-bit static operation. It is used to control other I/O devices and turn on LED. (static operation) When at the "High" level, this output becomes the VDD voltage, and when at the "Low" level, it becomes the ground potential. Therefore, the fluorescent display tube cannot be driven. [Command format] LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 1st byte P1 P2 * * 0 0 1 0 : selects a general output port and specifies the output status P1, P2 : general output port * : don't care [Set data and set state of general output port] P1 P2 Display state of general output port 0 0 Sets P1 and P2 to low 1 0 Sets P1 to high and P2 to low 0 1 Sets P1 to low and P2 to high 1 1 Sets P1 and P2 to high (The state when power is applied or when RESET is input.) 22/32 ¡ Semiconductor ML9206-xx 5. Display duty set (writes display duty value to duty cycle register) Display duty adjusts brightness in 256 stages using 8-bit data. (maximum brightness=240/256) When power is turned on or when the RESET signal is input, the duty cycle register value is "0". Always execute this instruction before turning the display on, then set a desired duty value. [Command format] LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 1st byte * * * * 1 0 LSB 1 0 : selects display duty set mode and sets duty value MSB B0 B1 B2 B3 B4 B5 B6 B7 2nd byte D0 D1 D2 D3 D4 D5 D6 D7 : Sets display duty value D0 (LSB) to D7 (MSB) : display duty data (8 bits: 256 stages) * : don't care [Relation between setup data and controlled COM duty] HEX D0 D1 D2 D3 D4 D5 D6 D7 COM duty 00 0 0 0 0 0 0 0 0 0/256 01 1 0 0 0 0 0 0 0 1/256 02 0 1 0 0 0 0 0 0 2/256 F7 1 1 1 0 1 1 1 1 239/256 F8 0 0 0 1 1 1 1 1 240/256 *The state when power is turned on or when RESET signal is input. No brightness change du to fixed blank time (16/256) FF 1 1 1 1 1 1 1 1 240/256 23/32 ¡ Semiconductor ML9206-xx 6. Number of digits set (writes the number of display digits to the display digit register) The number of digits set can display 1 to 16 digits using 4-bit data. When power is turned on or when a RESET signal is input, the number of digit register value is "0". Always execute this instruction to change the number of digits before turning the dispaly on. [Command format] LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 1st byte K0 K1 K2 K3 0 1 1 0 : selects the number of digit set mode and specifies the number of digit value K0 (LSB) to K3 (MSB) : number of digit data (4 bits: 16 digits) * : don't care [Relation between setup data and controlled COM] HEX K0 K1 K2 K3 0 0 0 0 0 1 1 0 0 0 2 0 1 0 3 1 1 0 4 0 0 5 1 0 6 0 7 1 Number of Number of HEX K0 K1 K2 K3 COM1 to 16 8 0 0 0 1 COM1 to 8 COM1 9 1 0 0 1 COM1 to 9 0 COM1 to 2 A 0 1 0 1 COM1 to 10 0 COM1 to 3 B 1 1 0 1 COM1 to 11 1 0 COM1 to 4 C 0 0 1 1 COM1 to 12 1 0 COM1 to 5 D 1 0 1 1 COM1 to 13 1 1 0 COM1 to 6 E 0 1 1 1 COM1 to 14 1 1 0 COM1 to 7 F 1 1 1 1 COM1 to 15 digits of COM digits of COM *The state when power is turned on or when RESET signal is input. 24/32 ¡ Semiconductor ML9206-xx 7. All display lights ON/OFF set (turns all dispaly lights ON or OFF) All display lights ON is used primarily for display testing. All display lights OFF is primarily used for display blink and to prevent malfunction when power is turned on. This command cannot control the general output port. [Command format] LSB MSB B0 B1 B2 B3 B4 B5 B6 B7 1st byte L H * * 1 1 1 0 : selects all display lights ON or OFF mode L: sets all lights OFF H: sets all lights ON *: Don't care [Set data and display state of SEG and AD] L H Display state of SEG and AD 0 0 Normal display 1 0 Sets all outputs to Low 0 1 Sets all outputs to High 1 1 Sets all outputs to High (The state when power is applied or when RESET is input.) (All lights ON mode has priority.) 25/32 ¡ Semiconductor ML9206-xx Setting Flowchart (Power applying included) Apply VDD Apply VFL All display lights OFF Status of all outputs by RESET signal input General output port setting Number of digits setting Display duty setting Select a RAM to be used CGRAM DCRAM Data write mode Data write mode Data write mode (with address setting) (with address setting) (with address setting) Address is automatically incremented Address is automatically incremented DCRAM Is character code write ended? Address is automatically incremented CGRAM Character code DCRAM Character code NO ADRAM NO YES CGRAM Is character code write ended? YES YES ADRAM Character code NO ADRAM Is character code write ended? YES Another RAM to be set? NO Releases all display lights OFF mode Display operation mode End 26/32 ¡ Semiconductor ML9206-xx Power-off Flowchart Display operation mode Turn off VFL Turn off VDD 27/32 ¡ Semiconductor ML9206-xx APPLICATION CIRCUIT Heater Transformer 5¥7-dot matrix fluorescent display tube ANODE ANODE GRID (SEGMENT) (SEGMENT) (DIGIT) VDD RESET VDD VDD VDD 2 35 16 AD1, 2 SEG1-35 COM1-16 R2 R4 C2 VDD C3 Microcontroller Output Port P1, 2 GND VFL C4 LED ML9206-xx CS CP DA GND R3 GND VFL OSC0 OSC1 R1 2 NPN Tr GND C1 GND ZD Notes: 1. The VDD value depends on the power supply voltage of the microcontroller used. Adjust the values of the constants R1, R2, R4, C1, and C2 to the power supply voltage used. 2. The VFL value depends on the fluorescent display tube used. Adjust the values of the constants R3 and ZD to the power supply voltage used. 28/32 ¡ Semiconductor ML9206-xx Reference data The figure below shows the relationship between the VFL voltage and the output current of each driver. Take care that the total power consumption to be used does not exceed the power dissipation. VFL Voltage-Output Current of Each Driver (mA) –30 COM1 to COM16 (Condition: VOH=VDD–1.5 V) Output Current (mA) –25 –20 –15 AD1 and AD2 (Condition: VOH=VDD–1.5 V) –10 SEG1 to SEG35 (Condition: VOH=VDD–1.5 V) –5 0 –10 –20 –30 –40 –50 –60 (V) VFL Voltage (VDD-n) 29/32 ¡ Semiconductor ML9206-xx ML9206-01 ROM Code 00000000B (00H) to 00000111B (07H) are the CGRAM addresses. MSB 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 LSB 0000 RAM0 0001 RAM1 0010 RAM2 0011 RAM3 0100 RAM4 0101 RAM5 0110 RAM6 0111 RAM7 1000 1001 1010 1011 1100 1101 1110 1111 30/32 ¡ Semiconductor ML9206-xx PACKAGE DIMENSIONS (Unit : mm) QFP64-P-1414-0.80-BK Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.87 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 31/32 ¡ Semiconductor ML9206-xx (Unit : mm) SSOP64-P-525-0.80-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.34 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 32/32 E2Y0002-29-62 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. 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