OKI MSM5299A

E2B0020-27-Y2
¡ Semiconductor
MSM5299A
¡ Semiconductor
This version: MSM5299A
Nov. 1997
Previous version: Mar. 1996
80-DOT LCD SEGMENT DRIVER
GENERAL DESCRIPTION
The MSM5299A is a dot matrix LCD segment driver LSI which is fabricated using CMOS low
power metal gate technology. This LSI consists of an 80-bit bidirectional shift register, 80-bit
latch, 80-bit level shifter and 80-bit 4-level driver.
It receives the display data, which is transferred in 4-bit parallel from a microcomputer or LCD
controller LSI such as MSM6255, then outputs the LCD driving waveform to the LCD.
FEATURES
•
•
•
•
•
Supply voltage
: 4.5 to 5.5V
LCD driving voltage
: 8 to 28V
Applicable LCD duty
: 1/64 to 1/256
LCD Output
: 80
The 4-bit parallel data processing has improved the transfer speed to 1/4 that of the
conventional serial transfer, thereby achieving low power consumption
• Can be interfaced with the LCD controller LSI MSM6255
• Applicable common diriver : MSM5298A (68 outputs)
• Package options:
100-pin plastic QFP (QFP100-P-1420-0.65-K) (Product name : MSM5299AGS-K)
100-pin plastic QFP (QFP100-P-1420-0.65-BK) (Product name : MSM5299AGS-BK)
1/11
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MSM5299A
BLOCK DIAGRAM
O1
O2
O79 O80
V1
V3
80-Bit 4-Level Driver
VDD
V4
VEE
VEE
DF
DISP OFF
80-Bit Level Shifter
VDD
80-Bit Latch (Edge trigger D-F/F)
LOAD
D0
D1
D2
D3
4 x 20-Bit Bidirectional Shift Register
SHL
VDD
SHIFT CP
CP
EL
VSS
Control
Circuit
VSS
ER
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MSM5299A
O34
O33
O32
O31
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
O50
O49
O48
O47
O46
O45
O44
O43
O42
O41
O40
O39
O38
O37
O36
O35
PIN CONFIGURATION (TOP VIEW)
O51
O52
1
80
2
79
O53
3
78
O54
O55
4
77
O28
O27
5
76
O26
O56
6
75
O57
7
74
O58
8
73
O25
O24
O23
O59
O60
9
72
O22
10
71
O61
O62
11
70
O21
O20
12
69
O63
O64
13
68
14
67
O65
15
66
O66
O67
16
65
17
64
O68
O69
18
63
19
62
O70
20
61
O71
O72
21
60
22
59
O73
O74
23
58
O9
O8
24
57
O7
O75
25
56
O76
O77
26
55
O6
O5
27
54
O78
28
53
O79
29
52
O80
30
51
O30
O29
O19
O18
O17
O16
O15
O14
O13
O12
O11
O10
O4
O3
EL
D3
D2
D1
D0
CP
NC
LOAD
ER
NC
VEE
V4
V3
V1
NC
DF
DISPOFF
VDD
SHL
VSS
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
O2
O1
NC : No connection
100-Pin Plastic QFP
Note: The abbreviated part number "M5299A" is imprinted on the package surface.
3/11
¡ Semiconductor
MSM5299A
ABSOLUTE MAXIMUM RATINGS
(VSS=0V)
Symbol
Condition
Rating
Unit
Supply Voltage (1)
VDD
Ta = 25°C
–0.3 to +6
V
Supply Voltage (2)
VLCD
Ta = 25°C, VDD – VEE
0 to 30
V
Input Voltage
VI
Ta = 25°C
–0.3 to VDD+0.3
V
Storage Temperature
TSTG
—
–55 to +150
°C
Parameter
*1
*1 VDD≥V1>V3>V4>VEE
RECOMMENDED OPERATING CONDITIONS
(VSS=0V)
Symbol
Condition
Range
Unit
Supply Voltage (1)
VDD
—
4.5 to 5.5
V
Supply Voltage (2)
VLCD
VDD – VEE
8 to 28
V
Operating Temperature
Top
—
–20 to +85
°C
Parameter
*1
*1 VDD≥V1>V3>V4>VEE
4/11
¡ Semiconductor
MSM5299A
ELECTRICAL CHARACTERISTICS
DC Characteristics
Parameter
(VDD = 5V ± 10%, Ta = –20 to +85°C)
Symbol
Condition
Min.
Typ.
Max.
Unit
"H" Input Voltage
VIH *1
—
0.8VDD
—
VDD
V
"L" Input Voltage
VIL *1
—
VSS
—
0.2VDD
V
"H" Input Current
VIH *1
VIH = VDD, VDD = 5.5V
—
—
1
mA
"H" Input Current
VIL *1
VIL = 0V, VDD = 5.5V
—
—
–1
mA
"H" Output Voltage
VOH *2
IO = –0.2mA, VDD = 4.5V
VDD – 0.4
—
—
V
"L" Output Voltage
VOL *2
IO = 0.2mA, VDD = 4.5V
—
—
0.4
V
ON Resistance
RON *4
—
2
4
kW
—
—
200
mA
—
—
3
mA
—
—
±100
mA
—
5
—
pF
Stand-by Current
IDDSBY
Supply Current (1)
IDD1
Supply Current (2)
IV
Input Capacitance
CI
VDD – VEE = 23V
*3
VN – VO = 0.25V, VDD = 4.5V
fCP = 1MHz, VDD = 5.5V
VDD – VEE = 26V, No load
*5
fCP =1MHz, VDD = 5.5V
VDD – VEE = 26V, No load
*6
fCP = 1MHz, VDD = 5.5V
VDD – VEE = 26V, No load
f = 1MHz
*7
*1 Applicable to LOAD, CP, D0 - D3, EL, ER, SHL, DF, DISP OFF
*2 Applicable to EL, ER.
*3 VN = VDD to VEE, V4 =
2
13
(VDD – VEE), V3 =
(VDD – VEE), V1 = VDD
15
15
*4 Applicable to O1 to O80.
*5 Display data 1010 ......fDF = 40 Hz, Current from VDD to VSS when the display data is not
processing.
*6 Display data 1010 ......fDF = 40 Hz, Current from VDD to VSS when the display data is
processing.
*7 Display data 1010 ......fDF = 40 Hz, Current on V1, V3 and V4.
5/11
¡ Semiconductor
MSM5299A
Switching Characteristics
(VDD = 5V ± 10%, Ta = –20 to +75°C, CL = 15pF)
Parameter
Symbol
Condition
DUTY=50%
Min.
Typ.
Max.
Unit
—
—
3.4
MHz
Clock Frequency
fCP
Clock, Load Pulse Width
tW
—
100
—
—
ns
Clock Pulse Rise/Fall Time
tr, tf
—
—
—
50
ns
Data Set-up Time
tDSU
—
50
—
—
ns
Data Hold Time
tDHD
—
80
—
—
ns
Load Set-up Time
tLSU
—
90
—
—
ns
Load Æ Clock Time
tLC
—
200
—
—
ns
Propagation Delay Time
tPHL
—
—
—
224
ns
ER, EL Set-up Time
tESU
—
70
—
—
ns
tf
tW
CP
0.8VDD
0.8VDD
tDSU
tW
tr
tW
0.8VDD
0.2VDD
0.2VDD
tDHD
0.8VDD
0.8VDD 0.8VDD
0.2VDD 0.2VDD
D0 - D3
tLSU
LOAD
0.8VDD
0.2VDD
1
tLC
0.2VDD
tW
tr
CP
0.8VDD
tf
2
19
0.2VDD
0.8VDD
20
LOAD
tPHL
ER, EL (Output)
EL, ER (Input)
0.2VDD
tESU
0.2VDD
6/11
¡ Semiconductor
MSM5299A
FUNCTIONAL DESCRIPTION
Pin Functional Description
• ER, EL
Pin
Input/Output
ER
Input
EL
Output
EL
Input
ER
Output
Description
SHL
Input pin to ENABLE F/F of MSM5299A.
L
Output pin of ENABLE F/F. EL is connected to next MSM5299A's
ER when MSM5299As are connected in series (cascade
connection).
Input pin to ENABLE F/F of MSM5299A.
H
Output pin of ENABLE F/F. ER is connected to next MSM5299A's
EL when MSM5299As are connected in series (cascade
connection).
When single MSM5299A is used, ER (EL) should be set at "L" level.
When a cascade connection is required, set the ER (EL) pin of the first MSM5299A at "L" level
and connect the EL (ER) pin of the first MSM5299A to the ER (EL) pin of the second MSM5299A,
then connect the EL (ER) pin of the second MSM5299A to the ER (EL) pin of the third MSM5299A.
• CP
Clock pulse input pin for the 4-bit parallel shift register. The data is shifted to 4 ¥ 20-bit shift
register at the falling edge of the clock pulse. The clock pulse is activated when the ENABLE
F/F is set and is deactivated when the ENABLE F/F is not set.
• SHL
Input pin to switch the input or output of pins ER and EL, and the shift direction of the 4-bit
parallel bidirectional shift register.
The shift direction of the 4-bit parallel data, the correspondence of the data D0 to D3 to the
driver outputs O1 to O80, and the input and output state of pins ER and EL are shown in the
table below.
SHL
L
H
ER
Input
Output
EL
Shift direction
Output
D0
D1
D2
D3
O1
O2
O3
O4
O5
O6
O7
O8
O77
O78
O79
O80
Input
D0
D1
D2
D3
O80
O79
O78
O77
O76
O75
O74
O73
O4
O3
O2
O1
end data
start data
7/11
¡ Semiconductor
MSM5299A
• D0, D1, D2, D3
Display data input pins for 4 ¥ 20-bit shift register. The display data is clocked into the shift
register at the falling edge of the clock pulse. The combinations of D0 to D3 level, DF signal
level, display data output level and the display on the LCD panel are described on the table
below.
D0 to D3
DF
Display data output level
Display on the LCD
L
L
Nonselect level (V3)
OFF
H
L
Select level (V1)
ON
L
H
Nonselect level (V4)
OFF
H
H
Select level (VEE)
ON
• LOAD
The signal for latching the shift register contents is input to this pin. The display data stored
in the shift register is latched at the falling edge of the load pulse.
• DF
Synchronous signal input pin for alternate signal for LCD driving.
• VDD, VSS
Supply voltage pins, VDD should be 4.5 to 5.5V. VSS is a ground pin (VSS = 0V)
• V1, V3, V4, VEE
Bias supply voltage pin to drive the LCD. Use an external bias voltage supply for driving the
LCD.
8/11
¡ Semiconductor
MSM5299A
• O1 - O80
Display data output pins, which correspond to the respective latch contents. One of V1, V3,
V4 and VEE is selected as a display driving voltage source according to the combination of the
latched data level and DF signal. Refer to the Truth Table.
The outputs O1 to O80 are connected to the segment side of the LCD panel.
• DISP OFF
Input pin to control outputs of O1 to O80. V1 level is output from O1 to O80 pins during "L"
level input. Refer to the Truth Table.
Truth Table
DF
Latched data
DISP OFF
L
LCD driver output (O1 - O80)
L
H
V3
L
H
H
V1
H
L
H
V4
H
H
H
VEE
X
X
L
V1
X : Don't care
NOTES ON USE
Note the following when turning power on and off:
The LCD drivers of this IC require a high voltage. For this reason, if a high voltage is applied to
the LCD drivers with the logic power supply floating, excess current flows. This may damage
the IC. Be sure to carry out the following power-on and power-off sequences:
When turning power on:
First VDD ON, next VEE, V4, V3, V1 ON. Or both ON at the same time.
When turning power off:
First VEE, V4, V3, V1 OFF, next VDD OFF. Or both OFF at the same time.
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¡ Semiconductor
MSM5299A
PACKAGE DIMENSIONS
(Unit : mm)
QFP100-P-1420-0.65-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.29 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
10/11
¡ Semiconductor
MSM5299A
(Unit : mm)
QFP100-P-1420-0.65-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.29 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
11/11