S T G 8203 S amHop Microelectronics C orp. J un.06 2005 ver1.2 Dual N-C hannel E nhancement Mode Field E ffect Transistor F E AT UR E S P R ODUC T S UMMAR Y V DS S 20V ID R DS (ON) S uper high dense cell design for low R DS (ON ). ( m Ω ) Max R ugged and reliable. 27 @ V G S = 4.0V 5A S urface Mount P ackage. 42 @ V G S = 2.5V D2( 8 ) ( 1 ) D1 T S S OP 8 7 6 5 1 2 3 4 (T OP V IE W) G2 ( 5 ) ( 4 ) G1 S 2 ( 6,7 ) ( 2,3 ) S 1 ABS OLUTE MAXIMUM R ATINGS (T A=25 C unless otherwise noted) P arameter S ymbol Limit Unit Drain-S ource Voltage V DS 20 V Gate-S ource Voltage V GS 10 V Drain C urrent-C ontinuous a @ T C =25 C b -P ulsed ID 5 A IDM 25 A Drain-S ource Diode Forward C urrent a IS 2 A Maximum P ower Dissipation a PD 1.5 W T J , T S TG -55 to 150 C R JA 85 C /W Operating Junction and S torage Temperature R ange THE R MAL C HAR AC TE R IS TIC S Thermal R esistance, Junction-to-Ambient a 1 S T G 8203 E LE CTR ICAL CHAR ACTE R IS TICS (T A = 25 C unless otherwise noted) Parameter Min Typ C Max Unit S ymbol Condition Drain-S ource Breakdown Voltage BV DS S V GS = 0V, ID = 250uA Zero Gate Voltage Drain Current IDS S V DS = 16V, V GS = 0V 1 Gate-Body Leakage IGS S V GS = 10V,V DS = 0V 100 nA Gate Threshold Voltage V GS (th) V DS = V GS , ID = 250uA Drain-S ource On-S tate R esistance R DS (ON) OFF CHAR ACTE R IS TICS 20 V uA ON CHAR ACTE R IS TICS b gFS Forward Transconductance 0.5 1.5 V V GS = 4.0V, ID = 4A 24 27 m ohm V GS =2.5V, ID = 3A 35 42 m ohm V DS = 5V, ID =4A 13 S 800 PF 155 PF 125 PF 18.3 ns 4.8 ns 43.5 ns 20 ns 11 nC 2.2 nC 2.5 nC DYNAMIC CHAR ACTE R IS TICS c Input Capacitance C IS S Output Capacitance C OS S R everse Transfer Capacitance S WITCHING CHAR ACTE R IS TICS Turn-On Delay Time R ise Time Turn-Off Delay Time V DS =8V, V GS = 0V f =1.0MH Z CRSS c tD(ON) tr tD(OFF) Fall Time tf Total Gate Charge Qg Gate-S ource Charge Q gs Gate-Drain Charge Q gd V DD = 10V, ID = 1A, V GE N = 4.0V, R L = 10 ohm R GE N = 10 ohm V DS =10V, ID = 4A, V GS =4.0V 2 S T G 8203 E LE CTR ICAL CHAR ACTE R IS TICS (T A=25 C unless otherwise noted) Parameter DR AIN-S OUR CE DIODE CHAR ACTE R IS TICS b Diode Forward Voltage V GS = 0V, Is =2A VSD 0.8 1.2 Notes a.S urface Mounted on FR 4 Board, t 10sec. b.Pulse Test:Pulse Width 300us, Duty Cycle 2%. c.Guaranteed by design, not subject to production testing. 25 20 25 C V G S =10,9,8,7,6,5,4,3V 20 V G S =2V I D , Drain C urrent (A) ID , Drain C urrent(A) 16 12 8 4 0 0 2 4 6 8 15 T j=125 C 10 5 0 0.0 12 10 -55 C V DS , Drain-to-S ource Voltage (V ) 2.2 es is tance R DS (ON) , On-R (Normalized ) 1200 C is s 600 300 0 0 C os s 2 4 6 8 10 0.9 1.2 1.5 1.8 V G S =4V I D =4A 1.8 C rs s 0.6 F igure 2. Trans fer C haracteris tics 1500 900 0.3 V G S , G ate-to-S ource Voltage (V ) F igure 1. Output C haracteris tics C , C apacitance (pF ) 5 C Min Typ Max Unit Condition S ymbol 1.4 1.0 0.6 0.2 0 12 -50 -25 0 25 50 75 100 125 T j( C ) V DS , Drain-to S ource Voltage (V ) F igure 4. On-R es is tance Variation with Temperature F igure 3. C apacitance 3 V 1.3 B V DS S , Normalized Drain-S ource B reakdown V oltage V th, Normalized G ate-S ource T hres hold V oltage S T G 8203 V DS =V G S I D =250uA 1.2 1.1 1.0 0.9 0.8 0.7 0.6 -50 -25 0 25 50 75 100 125 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125 T j, J unction T emperature ( C ) with T emperature F igure 6. B reakdown V oltage V ariation with T emperature 20 10 Is , S ource-drain current (A) 25 20 15 10 5 V DS =5V 0 0 5 10 15 20 1 T J =25 C 0 0.4 25 0.6 0.8 1.0 1.2 1.4 I DS , Drain-S ource C urrent (A) V S D , B ody Diode F orward V oltage (V ) F igure 7. T rans conductance V ariation with Drain C urrent F igure 8. B ody Diode F orward V oltage V ariation with S ource C urrent 50 5 V DS =10V I D =4A 4 I D , Drain C urrent (A) gF S , T rans conductance (S ) I D =250uA 1.10 T j, J unction T emperature ( C ) 30 V G S , G ate to S ource V oltage (V ) 1.15 3 2 1 10 R 0 2 4 6 8 10 12 14 16 L im it 10 10 0.1 0m ms s 1s DC V G S =4V S ingle P ulse T c=25 C 0.1 Qg, T otal G ate C harge (nC ) N) 11 0.03 0 (O DS 1 10 20 50 V DS , Drain-S ource V oltage (V ) F igure 10. Maximum S afe O perating Area F igure 9. G ate C harge 4 S T G 8203 V DD ton 5 V IN D tf 90% 90% V OUT V OUT VG S R GE N toff td(off) tr td(on) RL INVE R TE D 10% 10% G 90% S V IN 50% 50% 10% P ULS E WIDTH F igure 12. S witching Waveforms F igure 11. S witching T es t C ircuit Thermal Resistance Normalized Transient 10 1 0.5 0.2 P DM 0.1 0.1 t1 0.05 on 0.02 0.01 0.01 0.00001 1. 2. 3. 4. Single Pulse 0.0001 0.001 0.01 0.1 1 Square Wave Pulse Duration(sec) Normalized Thermal Transient Impedance Curve 5 10 t2 R thJ A (t)=r (t) * R thJ A R thJ A =S ee Datas heet T J M-T A = P DM* R thJ A (t) Duty C ycle, D=t1/t2 100 1000 S T G 8203 6 S T G 8203 TSSOP-8 Tape and Reel Data TSSOP-8 Carrier Tape UNIT : ㎜ PACKAGE A0 B0 K0 D0 D1 E E1 E2 P0 P1 P2 T TSSOP 8 6.08 4.40 1.60 ψ1.50 + 0.1 - 0.0 ψ1.50 + 0.1 - 0.0 12.00 ± 0.3 1.75 5.50 ± 0.05 8.00 4.00 2.00 ±0.05 0.30 ±0.05 M N W W1 H K S G 16.0 ψ13.0 + 0.5 - 0.2 10.6 2.0 ±0.5 TSSOP-8 Reel UNIT : ㎜ TAPE SIZE 12 ㎜ REEL SIZE ψ330 330 100 12.5 7 R V