PREPARED BY:
DATE:
I
1 SPEC.No.
ELECTRONIC
COMPONENTS
GROUP
SHARPCORPORATION
I
SPiXIFICATION
DEVICE SPECIFICATION
Ix996047
Opto-Ekctronic
Devices Division
FOR
Light Emitting Diode
MODEL No.
GL6ZS27
1
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharps consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment * Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal)
* Measuring equipment
*
Computers
*
Tooling
machines
r
If the use of the prcxluct in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
1
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals * Gas leakage sensor breakers
* Rescue and security equipment
[ * Other safety equipment
I
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment * Telecommunication equipment (for trunk lines)
C * Nuclear power control equipment * lMedica1 equipment
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
1
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S
DATE:
BY:
APPROVAL
DATE:
PRESENTED BY:
,
M.Katoh,
Department General Manager of
Engineering Dept.,J.II
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
/
DG996047
I
Jurd16/!w
PAGE
MODELa No.
GL6ZS27
GL6ZS27 Swcifkation
1. Application
This specificationappliesto the light emitting diode &vice Model No. GL6ZS27.
[AlGalnP (dicing or scribe/braketype) Sunset-orangeLED device1
2. Outline dimensionsandpin co~ections
. . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage2.
3. Ratingsandcharacteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*.......
3- 1. Absolute maximumratings
3-2. Electra-optical characteristics
3-3. Derating Curve
3-4. CharacteristicsDiagram
Refer to the attachedsheetPage3-4.
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5.
4- 1. Test itemsand testconditions
4-2. Measurementitemsand Failurejudgementcriteria
5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..a Refer to the attachedsheetPage6.
5- 1. Applied standard
5-2. Samplingmethodandlevel
5-3. Test items,judgementcriteria andclassificaof defect
54. Test itemsthe surfaceis be appliedfor flat type, judgementcriteria and classificaof defect
6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to the attachedsheetPage7-8.
6-1. Packing
6-2. Luminousintensity rank
6-3. Dominantwavelengthrank
6-4. Environment
7. ~ecau~onsforuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPageg-10.
7-l. Lead forming method
7-2. Notice of installation
7-3. SolderingConditions
7-4. For cleaning
l/10
I Jun/16/99
Dci996047
PAGE
MODEL No.
I
I
3. Ratingsandcharacteristics
3- 1. Absolutemaximumratings
Symbol -.
Parameter
P
Power dissipation
GL6ZS27
I
I
(Ta=25”C)
Unit
mW
Value
130
Storagetemperature
1 Tstg
1 -40
100 1 “C
soldering temperature(Note2) 1 Tsol
1 26O(within5 seconds) I “C
(Note 1) Duty ratio=l/lO,Pulse width=O.lms
(Note 2) At the positionof 1.6mmfrom the bottom resinpackage
(Note 3) Refer to the suplementitem 6. regardingthe standardof rank classification.
3-3. Derating Curve
Peak
Forward
Current
Derating
Forward
Curve
100
3
L
;
E
2
E
2
Current
Derating
Curve
60
120
3
80
s
=
5
60
5o
40
30
$
r
20
li
10
0
-25
Ambient
Temperature
Ta(‘C)
3110
0
Ambient
25
50
Temperature
75 ‘%OO
Ta (“C)
125
DG996047
MODEL No.
GL6ZS27
Jun/16/99
PAGE
I
Peak
Forward
Current
vs.
I
4110
Duty Ratio
(Ta=25%1
10
l/loo
Duty
3-4. Characteristics
10
1
l/l0
Raito
DR
Diagrarn(typ) (Note 1)
Forward
Current
vs.Forward
Relative
Luminous
intensity
vs. Ambient
Temperature
Voltage
(Ta=25"C)
(IF=2OnA)
100
10
i /i i I
I i II i
1
I I
(),I
I I I I I I/i
1 I I I I
II
11
Y
1
1.2
1.4
1.6
Forward
Relative
Luminous
1.8
2
Voltage
lntmrity
vs.
2.2
2.4
-60-40-20
Ambient
2.6
VFW
Froward
Voltage
(Ta=25"C)
1000
100
0. 1
0.01
0. 1
1
Forward
(Note
1)
Above
characteristic
10
Current
data
100
IF(mA)
are
typical data and not a guarantteed data.
0
20 40
Temprature
60 80
Ta('C)
100 120
r
Jun/16/99
DG996047
MODEL No.
PAGE
GL6ZS27
5110
4. Reliability
The reliability of productsshahbe satisfiedwith itemslistedbelow.
4- 1. Test itemsandtest conditions
Confidencelevel: 90%
LTPD
Samples(n)
Defective (C)
(o/o)
Test conditions
Test items
Solderability
230+5=C, 5s
Prior disposition: Dip in rosinflux
n=ll, C=O
20
Soldering
temperature
260+5”c, 5s
n=ll,C=O
20
15 OOOm/s2,
0.5ms.
3timesI iX,*Y,dZ direction
n=ll. C=O
20
200m/s2,100to 2 000 to lOOHz/sweepfor 4min.
,4times/iX,iY,fz
direction
n=ll. C=O
20
Weight:lON, Ss/each terminal
n=ll, C=O
20
Weight:SN, 0” + 90” ---f O”+ -90” + 0”
/each terminal
n=ll, C=O
20
Temperaturecycling
-40~(3Ot~1i1$~-+1~“c(3O111in),30
cycles
n=22, C=O
10
W’ temP*md ‘@’
humidity storage
Ta=+(jf)“C, g()%w, t=lt)oh
n=22, C=O
10
High temperaturestorageTa=100”C, t=lOOOh
n=22, C=O
10
Low temperaturestorageTa=-4Ot, t=lOOOh
n=22. C=O
10
n=22. C=O
10
Mechanicalshock
Variable frequency
vibration
Terminalstrength
(Tension)
Terminal strength
(Bending)
Operationlife
Ta=25”C, IFMAX, t=lOOOh*3
4-2. Measurementitemsand Failurejudgementcriteria *1
Measurement
Symbol
Failurejudgementcriteria *2
Forward voltage
VF
v, > U.S.L. x 1.2
Reversecurrent
IR
Ia > U.S.L. x 2.0
. Luminousintensity
Iv
Iv > The first stagevalueX 2.0 or The first stagevalue X 0.5 > Iv
z Solderability : Sol&r shallbe adhereat the areaof 95% or moreof dippedportion.
z Terminal strength : Packageis not destroyed,and terminalis not slack.
* 1: Measuringcondition is in accordancewith specification.
*2: U.S.L. is shownby Upper SpecificationLimit.
*3: IF w.is
shownby forward current of absolutemaximumratings.
Jun/16/!-w
DG996047
MODEL No.
PAGE
GL6ZS27
5. Incoming inspection
5-1. Applied standard: IS0 2859-l
5-2. Samplingmethodand level : A singlesamplingplannormal inspectionlevel II
: AQL Major defect : 0.065%
Minor defect : 0.4%
5-3. Test items,judgementcriteria andclassificaof defect
VO.
1
Test items
DiscoMection
judgementcriteria
classificaof defec
Not emit light
2
Positionof Cutting off
rim
Different from dimension
3
Reverseterminal
Different from dimension
4
Outline dimensions
Not satisfy outline specification
5
characteristics
Over the limit value of specificationat Vr, Ia, and Iv
6
Cut off the rim
Exceed -0.2mm
7
Foreign substance
White point : Exceed o 0.3mm (on top view)
Black point : Exceed 4 0.3mm (on top view)
String form : Exceed 3.Omm (on top view)
8
Scratch
Exceed d 0.3mmor O.lmm x l.Omm(on top view)
9
Void
Exceed 4 0.3mm (on top view)
10
Uneven density of
material for scattering
Extremely unevendensity
11
Unbalancedcenter
Exceed M.25mm from packagecenter
12
Burr
Exceed +0.2mmagainstprovideddimension
13
Insertion positionof
terminal
Insertionpositionof terminal
Major defect
Minor defect
5-4. Test itemsthe surfaceis be applied for flat type, judgementcriteria and classificaof defect
No.
Test items
judgementcriteria
class&a of defect
14
Chappedthe surface
The surfacechappedis striking for seethe lamptop
Minor defect
15
Hollow the surface
The surfacehollow is striking for seethe lamp top
6110
DG996047
MODEL No.
GL6ZS27
Jun/l6/99
PAGE
7110
6. Supplement
6-I. Packing
6-l- 1. Inner package
Rut 25Gpcs the same luminous intensity rank products into pack and put following label by pack
Product weight : 028g (One P~G~.Kx.,T~~.)
[Indication label sample)
SHIPMENT TABLE
PART No.
GL6ZS27
- Model number
*g
cl
cl01700
OUANTIlY
250
+ Quantity of products
-a+Lotnumber*
.OT No.
KA99B19
a
0
069
0
Cl-Cl tLuminous intensity rank
dominant wavelength rank
SHARP’
+
Production country
MADE IN JAPAN
@
@
@
@
@
Production plant code(to be indicatedalphabetically)
Support code
Year of production(thelasttwo figures of the year)
Month of production
(to be indicatedalphabeticallywith Januarycorrespondingto A)
Date of production(Ol-3 1)
6-l-2. Outer package
Put 8 packs (the sameluminousintensity rank) into outer package.
(approximately 670gper one outerpackage)
6-l-3. Outer packageout line dimension
Width : 14Omm,Depth: 225mm, Hight: 9Omm
6-2,Luminousintensitv rank (Note 1)
Rank
Luminousintensity
J
266
518
K
383
746
L
552
1075
M
795
( 1548 )
unit
(Ta=25”c)
Condition
mcd
IF2OmA
(Note 1) Tolerance:*lS%
In regardto luminousintensity, the following rankingshallbe carriedout.
However the quantity of eachrank shall not bepre scribed.
In caseof the distribution of the luminousintensity shift to high, at that
point new upperrank is prescribedand lower rank is delete.
6-3.Dominantwavelengthrank (Note 2)
Dominantwavelength
Rank
I
1
Unit
Ta=25”C)
Condition
(Note 2) The condition of measurement
: The measurement
of the light emissionfrom the front sideof lamp.
This rank value is the settingvalue of when that classifiesit the rank andbe not a guaranteevalue.
Also I shallnot askthe delivery ratio of eachrank.
DG996047
GL6ZS27
6-4. Environment
M-1. Ozonosphexedestructive chemicals.
(1) The device doesn’t contain following substance.
(2) The device doesn’t have a production line whose process requks following substance.
Restricted part: CFCs~~ones,CCb,Trichloroethane(Methyc~~of~)
-2.
Bromic non-burning materials
The &vice doesn’t contain bromic non-burning materials(PBBOs,PBBs)
Jun/16/!3!?
PAGE
MODEL No.
8110
Jud16/99
DG996047
MODEL No.
PAGE
GL6ZS27
g/10
7. Precautionsfor use
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering.
7 - 2. Notice of installation
7-2-l installation on a P W B
Whenmounting an LED lamp on a PW,do not apply
physical stress to the lead pins.
The lead pin pitch should match the PWE!pin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
‘Jhen positioning an LED lampbasically employ
an LED with tie-bar cut or use a spacer.
7-2-2 Whenan LED 1 is mounted directly on a PWB
If the bottom face of an LED lamp is mounted
directly on single-sided PWB,the base of the
lead pins may be subjected to physical stress
due to PWBwarpcutting or clinching of lead
pins. Prior to use, be sure to check that no
disconnection inside of the resin or damageto
resin etc., is found Then an LED lamp is mounted
on a double-sided PWB,theheat during soldering
affects the resin;therefore,keep
the LED lamp
more that 1.6mmafloat above the P!B.
7-2-3 Installation using a holder
During an LED lamp positioning,when a holder is
used, a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-Z-4 Installation to the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure.A hole of the case should
be designed not to subject the inside of resin
to any undue stress.
Hold
dtcn
I lead
farmins
pin
firmly
l
l
Good
&
0
n
1. Sam
L
I
hnil6i99
lx996047
PAGE
MODEL No.
I
GL6ZS27
7 - 3. S oldering Conditions
Solder the lead pins under the following conditions
Type of Soldering
Conditions
1. Manual soldering
295°C25°C) within 3 seconds
2. Wave soldering
260°C+5”c, within 5 seconds
3. Auto soldering
Preheating 70°C to 8O”c, within 30 seconds
1 Soldering 245’C*5”c, within 5 seconds
L
I
(Note) Avoid dipping resin into soldering bath
Avoid applying stress to lead pins while they are heated.For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection may occur.
7 - 4. For cleaning
( 1)
Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 min or less
(2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size,ultrasonic power
output, cleaning time,PBB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
( 3 > Applicable solvent : Ethyl alcohol, hlethyl alcohol, Isopropyl alcohol
In case when the other solvent is us&there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
I
lO/lO
DG996047
MODEL
Judl6/9!9
No.
PAGE
GL6ZS27
2/10
2. Outline dimensions and pin connixtions
n4. 6 f0.
2
5. 8 -CO. 2
-I-
I
I
n:
t
:
r
Colorless
transparency
7
I
---ET
-43
’v!
Pin connections
0. Anode
0. cathode
ote) Unspecified tol. to be t02mm
Note) Cold’iolled
unit
mm
steel leads are plated with but the tie-bar cut portions have no plating do not sol&r this part of the product
Material
Lead : (Fe) Cold rolled steel
Package : Epoxy resin
Finish
Lead : Sn plated or wave soldering
Drawing No.
51106028