HITACHI 2SD1471

2SD1471
Silicon NPN Planar, Darlington
Application
High gain amplifier
Outline
UPAK
1
3
2
2
4
1. Base
2. Collector
3. Emitter
4. Collector (Flange)
1
3
2SD1471
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
Collector to base voltage
VCBO
40
V
Collector to emitter voltage
VCEO
30
V
Emitter to base voltage
VEBO
10
V
Collector current
IC
300
mA
500
mA
1
W
Collector peak current
iC(peak)*
1
2
Collector power dissipation
PC *
Junction temperature
Tj
150
°C
Storage temperature
Tstg
–55 to +150
°C
Notes: 1. Pulse ≤ 10 ms, Duty cycle ≤ 20%
2. Value on the alumina ceramic board (12.5 x 30 x 0.7 mm)
Electrical Characteristics (Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Collector to base breakdown
voltage
V(BR)CBO
40
—
—
V
I C = 10 µA, IE = 0
Collector to emitter breakdown V(BR)CEO
voltage
30
—
—
V
I C = 1 mA, RBE = ∞
Emitter to base breakdown
voltage
V(BR)EBO
10
—
—
V
I E = 10 µA, IC = 0
Collector cutoff current
I CBO
—
—
1
µA
VCB = 30 V, IE = 0
µA
VCE = 24 V, RBE = ∞
I CEO
—
—
10
1
2000
—
100000
VCE = 5 V, IC = 10 mA*2
hFE2* 1
3000
—
—
VCE = 5 V, IC = 100 mA*2
hFE3* 1
3000
—
—
VCE = 5 V, IC = 400 mA*2
Collector to emitter saturation
voltage
VCE(sat)
—
—
1.5
V
I C = 100 mA, IB = 0.1 mA*2
Base to emitter saturation
voltage
VBE(sat)
—
—
2.0
V
I C = 100 mA, IB = 0.1 mA*2
DC current transfer ratio
hFE1*
Notes: 1. The 2SD1471 is grouped by h FE as follows.
2. Pulse test
Mark
DT
hFE1
2000 to 100000 5000 to 100000
hFE2
3000 min
10000 min
hFE3
3000 min
10000 min
2
ET
2SD1471
Area of Safe Operation
Maximum Collector Dissipation Curve
1.0
s
0m
Collector Current IC (A)
=1
0.1
0.03
Ta = 25°C
1 Shot Pulse
0.01
0.003
0.001
0
3
100
150
50
Ambient Temperature Ta (°C)
PC =
0.3
0.2
0.1
0
1W
0.4
Ta = 25°C
20
18
16
14
12
10
8
6
4
2µ
IB = 0 A
2
4
6
8
10
Collector to Emitter Voltage VCE (V)
DC Current Transfer Ratio hFE (×103)
0.5
100
300
10
30
Collector to Emitter Voltage VCE (V)
DC Current Transfer Ratio vs.
Collector Current
Typical Output Characteristics
Collector Current IC (A)
s
0.4
0.3
1m
0.8
1 µs
iC(peak)
PW
Collector Power Dissipation PC (W)
(on the alumina ceramic board)
1.2
300
VCE = 3 V
Pulse
100
30
Ta = 75°C
25
–25
10
3
10
30
100
300
Collector Current IC (mA)
1,000
3
Collector to Emitter Saturation Voltage VCE(sat) (V)
Base to Emitter Saturation Voltage VBE(sat) (V)
2SD1471
Saturation Voltage vs.
Collector Current
10
3
VBE(sat)
VCE(sat)
1.0
0.3
Ta = 25°C
IC /IB = 1,000
0.1
10
30
100
300
Collector Current IC (mA)
1,000
Transient Thermal Resistance
Thermal Resistance θj-a (°C/W)
300
100
30
10
3
0.3
1m
4
Ta = 25°C
On The Alumina Ceramic Board (12.5×30×0.7 mm)
1.0
10 m
100 m
1
Time t (s)
10
100
1,000
Unit: mm
1.5 1.5
3.0
0.44 Max
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
(0.2)
(2.5)
(1.5)
(0.4)
0.53 Max
0.48 Max
1.5 ± 0.1
0.44 Max
2.5 ± 0.1
4.25 Max
φ1
0.8 Min
1.8 Max
0.4
4.5 ± 0.1
UPAK
—
Conforms
0.050 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.