EXCELICS EFA040A-100P

EFA040A-100P
Low Distortion GaAs Power FET
UPDATED 11/17/2006
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NON-HERMETIC 100MIL METAL FLANGE PACKAGE
+23.0dBm TYPICAL OUTPUT POWER
9.0dB TYPICAL POWER GAIN AT 12GHz
0.3 X 400 MICRON RECESSED “MUSHROOM” GATE
Si3N4 PASSIVATION
ADVANCED EPITAXIAL HETEROJUNCTION
PROFILE PROVIDES HIGH POWER
EFFICIENCY, LINEARITY AND RELIABILITY
D
G
ELECTRICAL CHARACTERISTICS (Ta = 25 OC)
SYMBOLS
PARAMETERS/TEST CONDITIONS
MIN
TYP
21.0
23.0
23.0
9.0
6.5
PAE
Output Power at 1dB Compression
f= 12GHz
f= 18GHz
VDS = 8V, IDS ≈ 50% IDSS
Gain at 1dB Compression
f= 12GHz
f= 18GHz
VDS = 8V, IDS ≈ 50% IDSS
Power Added Efficiency at 1dB Compression
f=12GHz
VDS = 8V, IDS ≈ 50% IDSS
IDSS
Saturated Drain Current
VDS = 3 V, VGS = 0 V
60
105
GM
Transconductance
VDS = 3 V, VGS = 0 V
45
60
VP
Pinch-off Voltage
VDS = 3 V, IDS = 1.0 mA
P1dB
G1dB
7.5
MAX
UNIT
dBm
dB
35
-2.0
%
160
mA
mS
-3.5
V
BVGD
Drain Breakdown Voltage
IGD = 1.0mA
-13
-15
V
BVGS
Source Breakdown Voltage
IGS = 1.0mA
-7
-14
V
115*
ºC/W
RTH
Thermal Resistance (Au-Sn Eutectic Attach)
Note: * Overall Rth depends on case mounting.
MAXIMUM RATINGS AT 25OC
SYMBOLS
VDS
VGS
Igf
Igr
Pin
Tch
Tstg
Pt
PARAMETERS
Drain-Source Voltage
Gate-Source Voltage
Forward Gate Current
Reverse Gate Current
Input Power
Channel Temperature
Storage Temperature
Total Power Dissipation
ABSOLUTE1
CONTINUOUS2
12V
-5V
1.8 mA
0.3 mA
20 dBm
175oC
-65/175oC
1.2 W
8V
-4V
0.6 mA
0.1 mA
@ 3dB Compression
175oC
-65/175oC
1.2 W
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
page 1 of 2
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
Revised November 2006
EFA040A-100P
UPDATED 11/17/2006
Low Distortion GaAs Power FET
DISCLAIMER
EXCELICS SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. EXCELICS DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN.
LIFE SUPPORT POLICY
EXCELICS SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE
SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF EXCELICS SEMICONDUCTOR,
INC. AS HERE IN:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for
use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be
reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
page 2 of 2
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
Revised November 2006