TPS2590 www.ti.com....................................................................................................................................................................................................... SLUS960 – JULY 2009 3-V to 20-V High-Current Load Switch FEATURES DESCRIPTION 1 • • • • • • • • • • • Integrated Pass MOSFET 3-V to 20-V Bus Operation Programmable Fault Timer Programmable Fault Current Programmable Hard Current Limit Fast Disable Thermal Shutdown Load Fault Alert Latching and Auto-retry Operation 4-mm x 4-mm QFN -40°C to 125°C Junction Temperature Range The TPS2590 provides highly integrated hot-swap power management and superior protection in applications where the load is powered by voltages between 3.0 V and 20 V. This device is intended for systems where a voltage bus must be protected to prevent load shorts from interrupting or damaging other system components. The TPS2590 is in a 16-pin QFN package. The TPS2590 has multiple programmable protection features. Load protection is accomplished by a non-current limiting fault threshold, a hard current limit threshhold, and a fault timer. The dual current thresholds allow the system to draw high current for short periods without causing a voltage droop at the load. An example of this is a disk drive startup. This technique is ideal for loads that experience brief high demand, but benefit from protection levels consistent with average current draw. APPLICATIONS • • • • • RAID Arrays Telecommunications Plug-In Circuit Boards Disk Drive Notebooks / Netbooks Hotswap MOSFET protection is provided by power limit circuitry which protects the internal MOSFET against SOA related failures. The TPS2590 provides a fault indicator output and allows latch off or retry on fault. 12-V, 3.5-A Aplication IN OUT EN\ FLT\ CT 0.1 uF Output to Vo ltage Bus or DC/DC C onverte r IFLT CLOAD ILIM 49.9k RTRY\ GND 40.2k Input Voltag e Bus TPS2590 Optional: To System Monitor 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated TPS2590 SLUS960 – JULY 2009....................................................................................................................................................................................................... www.ti.com ORDERING INFORMATION DEVICE JUNCTION TEMPERATURE PACKAGE ORDERING CODE MARKING TPS2590 -40°C to 125°C RSA (4-mm x 4-mm QFN) TPS2590RSA TPS2590 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) (2) UNIT Input voltage range IN, OUT -0.3 to 25 Voltage range FLT -0.3 to 20 V Voltage IFAULT, ILIM 1.75 Voltage CT 3.0 Output sink current FLT 10 Input voltage range, EN -0.3 to 6 V 35 uA Input current, RTRY ( RTRY internally clamped to 3 V ) RTRY = 0 V Voltage range CT (3), IFLT (3) ,ILIM (3), RTRY -0.3 to 3 ESD rating, HBM 2 .5 k ESD rating, CDM 400 Operating junction temperature range, TJ (2) (3) V Internally Limited Storage temperature range, Tstg (1) mA °C -65 to 150 Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. All voltage values are with respect to GND. Do not apply voltage to pin. DISSIPATION RATINGS (1) (2) (3) (4) (1) (2) (3) (4) PACKAGE θJA LOW K, °C/W θJA HIGH K, °C/W θJA BEST 4, °C/W RSA 211 55 50 Tested per JEDEC JESD51, natural convection. The definitions of high-k and low-k are per JESD 51-7and JESD 51-3. Low-k (2 signal - no plane, 3 in. by 3 in. board, 0.062 in. thick, 1 oz. copper) test board with the pad soldered, and an additional 0.12 in.2 of top-side copper added to the pad. High-k is a (2 signal – 2 plane) test board with the pad soldered. The best case thermal resistance is obtained using the recommendations per SLMA002A (2 signal - 2 plane with the pad connected to the plane). RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) PARAMETER MIN NOM MAX UNIT Input voltage range IN, OUT 3 Voltage range EN 0 5 Voltage range FLT 0 20 Output sink current FLT 0 1 mA V Voltage range RTRY CCT Junction temperature 2 Submit Documentation Feedback 20 V 0 3 100 p 10 m F -40 125 °C Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS2590 TPS2590 www.ti.com....................................................................................................................................................................................................... SLUS960 – JULY 2009 ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IN UVLO Bias current VIN ↑ 2.6 2.85 2.9 V Hysteresis 150 EN = 2.4 V 25 100 mV µA EN = 0 V 3.9 5 mA 29.5 42.0 mΩ 5 7.5 W 0.77 1.0 V OUT RON RVIN-VOUT, IVOUT < IRLIM or IVOUT < (ISET x 1.25), 1 A ≤ IVOUT ≤ 4.5 A Power limit VIN: 12 V, COUT = 1000 µF, EN: 3 V → 0 V Reverse diode voltage VOUT > VIN , EN = 5 V, IIN = - 1 A 3 IFLT IFLT Fault current threshold IVOUT ↑, ICT: sinking → sourcing, pulsed test (RRFLT = 200 kΩ) 0.8 1 1.2 IVOUT ↑, ICT: sinking → sourcing, pulsed test (RRFLT = 100 kΩ) 1.8 2 2.2 IVOUT ↑, ICT: sinking → sourcing, pulsed test (RRFLT = 49.9 kΩ) 3.6 4 4.4 1.6 2 2.4 2.6 3 3.4 4.6 5 5.4 A ILIM RRLIM = 100 kΩ Current limit program IVOUT , RRLIM = 66.5 kΩ VVIN-VOUT = 0.3 V, pulsed test RRLIM = 40.2 kΩ A CT Charge/discharge current Threshold voltage ON/OFF fault duty cycle ICT sourcing, VCT = 1 V 29 35 41 ICT sinking, VCT = 1 V 1.0 1.4 1.8 VCT ↑ 1.3 1.4 1.5 VCT ↓ 0.1 0.16 0.3 VVOUT = 0 V 2.8 3.7 4.6 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS2590 µA V % 3 TPS2590 SLUS960 – JULY 2009....................................................................................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT EN Threshold voltage Input bias current VEN↓ Hysteresis VEN = 2.4 V (sinking) VEN = 0.2 V (sourcing) 0.8 1.0 1.5 V mV 50 150 250 -1.5 0 0.5 -2 1 0.5 µA Turn on propagation delay VIN = 3.3 V, ILOAD = 1 A, VEN : 2.4 V → 0.2 V, VOUT: ↑ 90% x VIN 350 500 Turn off propagation delay VIN = 3.3 V, ILOAD = 1 A, VEN : 0.2 V → 2.4 V, VOUT: ↓10% x VIN 10 20 VOUT LOW VCT = 1.8 V, IFLT = 1 mA 0.2 0.4 V Leakage current VFLT = 18 V 1 µA Low threshold voltage Auto Retry Mode High threshold Latch mode µs FLT RTRY Input bias current 0.8 2.0 VRTRY = 3.0 V -1.0 0.2 1.0 VRTRY = 0.2 V -50 -25 0 V mA Thermal Shutdown Thermal shutdown TJ 160 Hysteresis 4 Submit Documentation Feedback 10 °C Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS2590 TPS2590 www.ti.com....................................................................................................................................................................................................... SLUS960 – JULY 2009 DEVICE INFORMATION TPS2590 Functional Block Diagram IN IOUT 1 2 3 4 V(DS) Detector + S 10 uA Q Pump Constant Power Engine 14 GND 13 5 R R R FT LCA + + 1.0V + I(D) Detector - 1.6 x ILIM ILIM 7 12 11 OUT 10 15 FAULT\ + + I OUT ______ 200k 8 PWRG\ + IFLT CT Charge THERMAL SHUTDOWN 34 uA CT 1.35 V 9 S Q R Q FLT + FLT 1.25 uA 33 uA + 3V 200 mV 100 k 3V 1.5V + RTRY\ 6 EN\ 16 PWRG\ VIN Internal Rail + 2.7 / 2.6 Figure 1. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS2590 5 TPS2590 SLUS960 – JULY 2009....................................................................................................................................................................................................... www.ti.com VIN 1 VIN 2 EN FLT GND GND TPS2590 PINOUT 16 15 14 13 12 VOUT 11 VOUT TPS2590 4 9 5 6 7 8 IFLT VIN ILIM 10 VOUT RTRY 3 GND VIN CT TERMINAL FUNCTIONS FUNCTION TPS2590 EN 16 Device is enabled when this pin is pulled low. 1-4 Power In and control supply voltage. IN RTRY 6 DESCRIPTION If low, the TPS2590 will attempt to restart after an overcurrent fault. If floating (high) the device will latch off after an overcurrent fault and will not attempt to restart until EN or Vin is cycled off and on. ILIM 7 A resistor to ground sets the current limit level. IFLT 8 A resistor to ground sets the fault current level. CT 9 A capacitor to ground sets the fault time. GND 5, 13, 14 GND OUT 10, 11, 12 Output to the load. FLT 15 Fault low indicated the fault time has expired and the FET is switched off. PIN DESCRIPTION CT: Connect a capacitor form CT to GND to set the fault time. The fault timer starts when the fault current threshold is exceeded, charging the capacitor with 36 µA from GND towards an upper threshold of 1.4 V. If the capacitor reaches the upper threshold, the internal pass MOSFET is turned off. The MOSFET will stay off until EN is cycled if a latching version is used. If an auto-retry version is used, the capacitor will discharge at 5 µA to 0.2 V and then re-enable the pass MOSFET. When the device is disabled, CT is pulled to GND through a 100-kΩ resistor. The timer period must be chosen long enough to allow the external load capacitance to charge. The fault timer period is selected using the following formula where TFAULT is the minimum timer period in seconds and CCT is in Farads. C CT = TFAULT 38.9 ´ 10 3 This equation does not account for component tolerances. In autoretry versions, the second and subsequent retry timer periods will be approximately 85 % as long as the first retry period. In autoretry versions, the fault timer discharges the capacitor for a nominal tSD in seconds with CCT in Farads per the following equation. 6 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS2590 TPS2590 www.ti.com....................................................................................................................................................................................................... SLUS960 – JULY 2009 tSD = 1.0 ´ 106 ´ CCT The nominal ratio of on-to-off times represents about a 3% duty cycle when a hard fault is present on the output of an autoretry version part. FLT: Open-drain output that pulls low on any condition that causes the output to open. These conditions are either an overload with a fault time-out, or a thermal shutdown. FLT becomes operational before UV, when VIN is greater than 1 V. GND: This is the most negative voltage in the circuit and is used as reference for all voltage measurements unless otherwise specified. IFLT: A resistor connected from this pin to ground sets the fault current threshold (IFAULT). Currents between the fault current threshold and the current limit are permitted to flow unimpeded for the period set by the fault timer programmed on CT. This permits loads to draw momentary surges while maintaining the protection provided by a lower average-current limit. The fault timer implemented by CT starts charging CT when current through VIN exceeds IFAULT. If the current doesn’t drop below the IFAULT level before VCT reaches its upper threshold, the output will be shut off. The fault current resistor is set by the following formula where IFAULT is in Amperes and RRFLT is in Ohms. RRFLT = 200kW IFAULT ILIM: A resistor connected from this pin to ground sets ILIM. The TPS2590 will limit current to ILIM. If the current doesn’t drop below the IFAULT level before the timer times out then the output will be shut off. RLIM is set by the formula: RLIM = 201kW ILIM ILIM must be set sufficiently larger than IFAULT to ensure that lLIM could never be less than IFAULT, even after taking tolerances into account. EN: When this pin is pulled low, the IC is enabled. The input threshold is hysteretic, allowing the user to program a startup delay with an external RC circuit. EN is pulled to VIN by a 10-MΩ resistor, pulled to GND by 16.8 MΩ and is clamped to ground by a 7-V Zener diode. Because high impedance pullup/down resistors are used to reduce current draw, any external FET controlling this pin should be low leakage. IN: Input voltage to the TPS2590. The recommended operating voltage range is 3 V to 18 V. All VIN pins should be connected together and to the power source. OUT: Output connection for the TPS2590. When switched on the output voltage will be approximately: VOUT = VIN - 0.04 ´ IOUT All OUT pins should be connected together and to the load. RTRY: When pulled low the TPS2590 will attempt to restart after a fault. If left floating or pulled high the TPS2590 will latch off after a fault. This pin is internally clamped at 3 V and is pulled to the internal 3-V supply by a diode in series with a 100-kΩ resistor. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS2590 7 TPS2590 SLUS960 – JULY 2009....................................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS CURRENT LIMIT vs JUNCTION TEMPERATURE FAULT CURRENT vs JUNCTION TEMPERATURE 2.20 2.20 RMAX = 100 k 2.15 IFAULT – Fault Current – A IIMAX – Current Limit – A 2.10 2.50 2.00 1.95 1.90 2.10 2.50 2.00 1.95 1.90 1.85 1.85 1.80 –50 0 50 – Junction Temperature – °C TJ 100 1.80 –50 150 TJ 0 50 100 – Junction Temperature – °C Figure 2. Figure 3. POWER LIMIT vs JUNCTION TEMPERATURE SLEEP MODE SUPPLY CURRENT (VCC = 12 V) vs JUNCTION TEMPERATURE 8.0 7.5 RFLT = 100 k 2.15 150 24 ILOAD = 1 A Sleep Mode 7.0 ISUPPLY – Supply Current – mA PLIMIT – Power Limit Level – W 22 6.5 6.0 5.5 5.0 4.5 4.0 20 18 16 14 12 3.5 3.0 –50 0 TJ 50 100 150 10 –50 – Junction Temperature – °C Figure 4. 8 TJ 0 50 100 – Junction Temperature – °C 150 Figure 5. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS2590 TPS2590 www.ti.com....................................................................................................................................................................................................... SLUS960 – JULY 2009 TYPICAL CHARACTERISTICS (continued) Figure 6. 12-V Startup into 15-Ω, 700-µF Load Figure 7. 12-V Input Addded to an 8-Ω Load Figure 8. Failed Startup into a 4-Ω Load Figure 9. 12-V Soft Overload, 3-A to 4.2-A, Power Limit Not Tripped Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS2590 9 TPS2590 SLUS960 – JULY 2009....................................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) 10 Figure 10. Firm Overload, 3-A to 5.4 A, Power Limit Tripped Figure 11. 12-V Hard Overload, 3.6-A Load then Short Figure 12. Power Dissipation During 12-V Startup into a 60-Ω, 800-µF Load Figure 13. Power Dissipation During 12-V Startup into a 15-Ω, 140-µF Load Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS2590 TPS2590 www.ti.com....................................................................................................................................................................................................... SLUS960 – JULY 2009 TYPICAL CHARACTERISTICS (continued) Figure 14. Startup into a 1-Ω Load Figure 15. Firm Overload, Load Stepped From 3.8 A to 5.5 A Figure 16. Hard Overload, Load Stepped from 3.8 A to 7.1 A Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS2590 11 TPS2590 SLUS960 – JULY 2009....................................................................................................................................................................................................... www.ti.com APPLICATION INFORMATION Maximum Load at Startup The power limiting function of the TPS2590 provides very effective protection for the internal FET. Expectedly, there is a supply voltage dependent maximum load which the device will be able to power up. Loads above this level may cause the device to shut off current before startup is complete. Neglecting any load capacitance, the maximum load ( minimum load resistance ) is calculated using the equation; V 2 RMIN = IN 12 (1) Adding load capacitance may reduce the maximum load which can be present at start up. If EN is tied to GND at startup and IN does not ramp quickly the TPS2590 may momentarily turn off then on during startup. This can happen if a capacitive load momentarily pulls down the input voltage below the UV threshold. If necessary, this can be avoided by delaying EN assertion until VIN is fully up. Transient Protection The need for transient protection in conjunction with hot-swap controllers should always be considered. When the TPS2590 interrupts current flow, input inductance generates a positive voltage spike on the input and output inductance generates a negative voltage spike on the output. Such transients can easily exceed twice the supply voltage if steps are not taken to address the issue. Typical methods for addressing transients include; • Minimizing lead length/inductance into and out of the device. • Transient Voltage Suppressors (TVS) on the input to absorb inductive spikes. • Shottky diode across the output to absorb negative spikes. • A combination of ceramic and electrolytic capacitors on the input and output to absorb energy. The following equation estimates the magnitude of these voltage spikes: Where; VSPIKE(absolute ) = VNOM + ILOAD ´ L • • • • C (2) VNOM equals the nominal supply voltage. ILOAD equals the load current. C equals the capacitance present at the input or output of the TPS2590. L equals the effective inductance seen looking into the source or the load. The inductance due to a straight length of wire equals approximately. Where; æ 4´L ö - 0.75 ÷ (nH) Lstraightwire » 0.2 ´ L ´ ln ç è D ø • • (3) L equals the length of the wire. D equals wire diameter. Some applications may require the addition of a TVS to prevent transients from exceeding the absolute ratings if sufficient capacitance cannot be included. 12 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS2590 PACKAGE MATERIALS INFORMATION www.ti.com 2-Sep-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS2590RSAR QFN RSA 16 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 TPS2590RSAT QFN RSA 16 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 2-Sep-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS2590RSAR QFN RSA 16 3000 346.0 346.0 29.0 TPS2590RSAT QFN RSA 16 250 190.5 212.7 31.8 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP® Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2009, Texas Instruments Incorporated