ICS ICS853011CMLF

PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS853011C
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
GENERAL DESCRIPTION
FEATURES
The ICS853011C is a low skew, high performance 1-to-2 Differential-to-2.5V/3.3V LVPECL/
HiPerClockS™
ECL Fanout Buffer and a member of the
HiPerClockS ™ family of High Perfor mance
Clock Solutions from ICS. The ICS853011C
is characterized to operate from either a 2.5V or a 3.3V
power supply. Guaranteed output and par t-to-par t skew
characteristics make the ICS853011C ideal for those
clock distribution applications demanding well defined
perfor mance and repeatability.
• 2 differential 2.5V/3.3V LVPECL / ECL outputs
ICS
• 1 differential PCLK, nPCLK input pair
• PCLK, nPCLK pair can accept the following
differential input levels: LVPECL, LVDS, CML, SSTL
• Output frequency: 3GHz
• Translates any single ended input signal to 3.3V
LVPECL levels with resistor bias on nPCLK input
• Output skew: 5ps (typical)
• Part-to-part skew: TBD
• Propagation delay: 250ps (typical)
• LVPECL mode operating voltage supply range:
VCC = 2.375V to 3.8V, VEE = 0V
• ECL mode operating voltage supply range:
VCC = 0V, VEE = -3.8V to -2.375V
• -40°C to 85°C ambient operating temperature
• Pin compatible with MC100LVEP11 and SY100EP11U
BLOCK DIAGRAM
PCLK
nPCLK
PIN ASSIGNMENT
Q0
nQ0
Q1
nQ1
Q0
nQ0
Q1
nQ1
1
2
3
4
8
7
6
5
Vcc
PCLK
nPCLK
VEE
ICS853011C
8-Lead SOIC
3.90mm x 4.90mm x 1.37mm package body
M Package
Top View
ICS853011C
8-Lead TSSOP, 118 mil
3mm x 3mm x 0.95mm package body
G Package
Top View
The Preliminary Information presented herein represents a product in prototyping or pre-production. The noted characteristics are based on initial
product characterization. Integrated Circuit Systems, Incorporated (ICS) reserves the right to change any circuitry or specifications without notice.
853011CM
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REV. A MARCH 19, 2004
1
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS853011C
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
TABLE 1. PIN DESCRIPTIONS
Number
Name
1, 2
Q0, nQ0
Output
Type
Differential output pair. LVPECL interface levels.
3, 4
Q1, nQ1
Output
Differential output pair. LVPECL interface levels.
5
VEE
Power
6
nPCLK
Input
7
PCLK
Input
8
VCC
Power
Description
Negative supply pin.
Pullup/
Pulldown
Pulldown
Clock input. LVPECL interface levels.
Clock input. Default LOW when left floating. LVPECL interface levels.
Positive supply pin.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
RPULLDOWN
Input Pulldown Resistor
75
KΩ
RPULLUP
Input Pullup Resistor
37
KΩ
853011CM
Test Conditions
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2
Minimum
Typical
Maximum
Units
REV. A MARCH 19, 2004
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS853011C
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
ABSOLUTE MAXIMUM RATINGS
Inputs, VI (LVPECL mode)
4.6V (LVPECL mode, VEE = 0) NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage
-4.6V (ECL mode, VCC = 0)
to the device. These ratings are stress specifi-0.5V to VCC + 0.5V
Inputs, VI (ECL mode)
0.5V to VEE - 0.5V
Supply Voltage, VCC
Negative Supply Voltage, VEE
Outputs, IO
Continuous Current
Surge Current
cations only. Functional operation of product at
these conditions or any conditions beyond those
50mA
100mA
listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maxi-
Operating Temperature Range, TA -40°C to +85°C
Storage Temperature, TSTG
-65°C to 150°C
Package Thermal Impedance, θJA
112.7°C/W (0 lfpm)
mum rating conditions for extended periods may
affect product reliability.
(Junction-to-Ambient) for 8 Lead SOIC
Package Thermal Impedance, θJA
101.7°C/W (0 m/s)
(Junction-to-Ambient) for 8 Lead TSSOP
TABLE 3A. POWER SUPPLY DC CHARACTERISTICS, VCC = 2.375V TO 3.8V; VEE = 0V
Symbol
Parameter
VCC
Positive Supply Voltage
Test Conditions
I EE
Power Supply Current
Minimum
Typical
Maximum
Units
2.375
3.3
3.8
V
18
mA
TABLE 3B. LVPECL DC CHARACTERISTICS, VCC = 3.3V; VEE = 0V
-40°C
25°C
85°C
Symbol
Parameter
VOH
Output High Voltage; NOTE 1
2.275
2.295
2.295
V
VOL
Output Low Voltage; NOTE 1
1.545
1.52
1.535
V
VPP
800
800
800
V
IIH
Peak-to-Peak Input Voltage
Input High Voltage
Common Mode Range; NOTE 2, 3
Input
PCLK, nPCLK
High Current
IIL
Input
Low Current
VCMR
Min
Typ
Max
Min
Typ
Max
Min
Max
Units
V
µA
PCLK
µA
nPCLK
Input and output parameters vary 1:1 with VCC. VEE can vary +0.925V to -0.5V.
NOTE 1: Outputs terminated with 50Ω to VCCO - 2V.
NOTE 2: Common mode voltage is defined as VIH.
NOTE 3: For single-ended applications, the maximum input voltage for PCLK, nPCLK is VCC + 0.3V.
853011CM
Typ
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3
µA
REV. A MARCH 19, 2004
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS853011C
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
TABLE 3C. LVPECL DC CHARACTERISTICS, VCC = 2.5V; VEE = 0V
-40°C
Typ
25°C
Typ
85°C
Typ
Symbol
Parameter
VOH
Output High Voltage; NOTE 1
1.475
1.495
1.495
V
VOL
Output Low Voltage; NOTE 1
0.745
0.72
0.735
V
VPP
Peak-to-Peak Input Voltage
Input High Voltage
Common Mode Range; NOTE 2, 3
Input
PCLK, nPCLK
High Current
PCLK
Input
Low Current nPCLK
800
800
800
V
VCMR
IIH
IIL
Min
Max
Min
Max
Min
Max
Units
V
µA
µA
µA
Input and output parameters var y 1:1 with VCC. VEE can var y +0.925V to -0.5V.
NOTE 1: Outputs terminated with 50Ω to VCCO - 2V.
NOTE 2: Common mode voltage is defined as VIH.
NOTE 3: For single-ended applications, the maximum input voltage for PCLK, nPCLK is VCC + 0.3V.
TABLE 3D. ECL DC CHARACTERISTICS, VCC = 0V; VEE = -3.8V TO -2.375V
Symbol
-40°C
Parameter
Min
25°C
Typ
Max
Min
Typ
85°C
Max
Min
Typ
Max
Units
VOH
Output High Voltage; NOTE 1
-1.025
-1.005
-1.005
V
VOL
Output Low Voltage; NOTE 1
-1.755
-1.78
-1.765
V
VPP
Peak-to-Peak Input Voltage
Input High Voltage
Common Mode Range; NOTE 2, 3
Input
PCLK, nPCLK
High Current
Input
PCLK
800
800
800
V
VCMR
IIH
IIL
V
µA
µA
Low Current nPCLK
Input and output parameters vary 1:1 with VCC. VEE can vary +0.925V to -0.5V.
NOTE 1: Outputs terminated with 50Ω to VCCO - 2V.
NOTE 2: Common mode voltage is defined as VIH.
NOTE 3: For single-ended applications, the maximum input voltage for PCLK, nPCLK is VCC + 0.3V.
TABLE 4. AC CHARACTERISTICS, VCC = 0V; VEE = -3.8V TO -2.375V
OR
VCC = 2.375 TO 3.8V; VEE = 0V
-40°C
Symbol
Parameter
fMAX
Output Frequency
t PD
Propagation Delay; NOTE 1
Min
tsk(o)
Output Skew; NOTE 2, 4
tsk(pp)
Par t-to-Par t Skew; NOTE 3, 4
tR/tF
Output Rise/Fall Time
Typ
µA
25°C
Max
Min
Typ
85°C
Max
Min
Typ
Max
Units
3
3
3
GHz
240
250
260
ps
5
5
5
ps
ps
20% to 80%
160
160
160
ps
odc
Output Duty Cycle
f ≤ 1GHz
50
50
50
%
All parameters are measured at f ≤ 1.7GHz, unless otherwise noted.
NOTE 1: Measured from the differential input crossing point to the differential output crossing point.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differential cross points.
NOTE 3: Defined as skew between outputs on different devices operating at the same supply voltages and with equal load
conditions. Using the same type of inputs on each device, the outputs are measured at the differential cross points.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
853011CM
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4
REV. A MARCH 19, 2004
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS853011C
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
PARAMETER MEASUREMENT INFORMATION
2V
VCC
Qx
VCC
SCOPE
nPCLK
LVPECL
V
Cross Points
PP
V
CMR
PCLK
nQx
VEE
V EE
-1.8V to -0.375V
OUTPUT LOAD AC TEST CIRCUIT
DIFFERENTIAL INPUT LEVEL
nQx
PART 1
Qx
nQx
nQy
nQy
Qx
PART 2
Qy
Qy
t sk(pp)
t sk(o)
PART-TO-PART SKEW
OUTPUT SKEW
nPCLK
80%
80%
PCLK
VSW I N G
Clock
Outputs
nQ0, nQ1
20%
20%
tF
tR
Q0, Q1
tPD
OUTPUT RISE/FALL TIME
PROPAGATION DELAY
nQ0, nQ1
Q0, Q1
Pulse Width
t
odc =
PERIOD
t PW
t PERIOD
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
853011CM
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5
REV. A MARCH 19, 2004
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS853011C
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
APPLICATION INFORMATION
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS
Figure 1 shows how the differential input can be wired to accept
single ended levels. The reference voltage V_REF = VCC/2 is
generated by the bias resistors R1, R2 and C1. This bias circuit
should be located as close as possible to the input pin. The ratio
of R1 and R2 might need to be adjusted to position the V_REF in
the center of the input voltage swing. For example, if the input
clock swing is only 2.5V and VCC = 3.3V, V_REF should be 1.25V
and R2/R1 = 0.609.
VCC
R1
1K
Single Ended Clock Input
PCLK
V_REF
nPCLK
C1
0.1u
R2
1K
FIGURE 1. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT
TERMINATION FOR 3.3V LVPECL OUTPUTS
50Ω transmission lines. Matched impedance techniques should
be used to maximize operating frequency and minimize signal
distortion. Figures 2A and 2B show two different layouts which
are recommended only as guidelines. Other suitable clock layouts may exist and it would be recommended that the board
designers simulate to guarantee compatibility across all printed
circuit and clock component process variations.
The clock layout topology shown below is a typical termination for LVPECL outputs. The two different layouts mentioned
are recommended only as guidelines.
FOUT and nFOUT are low impedance follower outputs that generate ECL/LVPECL compatible outputs. Therefore, terminating
resistors (DC current path to ground) or current sources must
be used for functionality. These outputs are designed to drive
3.3V
Zo = 50Ω
125Ω
FOUT
FIN
Zo = 50Ω
Zo = 50Ω
FOUT
50Ω
1
RTT =
Z
((VOH + VOL) / (VCC – 2)) – 2 o
FIN
50Ω
Zo = 50Ω
VCC - 2V
RTT
84Ω
FIGURE 2A. LVPECL OUTPUT TERMINATION
853011CM
125Ω
84Ω
FIGURE 2B. LVPECL OUTPUT TERMINATION
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6
REV. A MARCH 19, 2004
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS853011C
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
TERMINATION FOR 2.5V LVPECL OUTPUT
Figure 3A and Figure 3B show examples of termination for 2.5V
LVPECL driver. These terminations are equivalent to terminating 50Ω to VCC - 2V. For VCC = 2.5V, the VCC - 2V is very close to
ground level. The R3 in Figure 3B can be eliminated and the
termination is shown in Figure 3C.
2.5V
2.5V
2.5V
VCCO=2.5V
VCCO=2.5V
R1
250
R3
250
Zo = 50 Ohm
Zo = 50 Ohm
+
+
Zo = 50 Ohm
Zo = 50 Ohm
-
-
2,5V LVPECL
Driv er
2,5V LVPECL
Driv er
R2
62.5
R1
50
R4
62.5
R2
50
R3
18
FIGURE 3B. 2.5V LVPECL DRIVER TERMINATION EXAMPLE
FIGURE 3A. 2.5V LVPECL DRIVER TERMINATION EXAMPLE
2.5V
VCCO=2.5V
Zo = 50 Ohm
+
Zo = 50 Ohm
2,5V LVPECL
Driv er
R1
50
R2
50
FIGURE 3C. 2.5V LVPECL TERMINATION EXAMPLE
853011CM
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7
REV. A MARCH 19, 2004
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS853011C
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
LVPECL CLOCK INPUT INTERFACE
here are examples only. If the driver is from another vendor,
use their termination recommendation. Please consult with the
vendor of the driver component to confirm the driver termination requirements.
The PCLK /nPCLK accepts LVPECL, CML, SSTL and other
differential signals. Both VSWING and VOH must meet the VPP
and VCMR input requirements. Figures 4A to 4E show interface
examples for the HiPerClockS PCLK/nPCLK input driven by
the most common driver types. The input interfaces suggested
2.5V
3.3V
3.3V
3.3V
2.5V
3.3V
R2
50
R1
50
CML
R3
120
SSTL
R4
120
Zo = 60 Ohm
Zo = 50 Ohm
PCLK
PCLK
Zo = 60 Ohm
nPCLK
Zo = 50 Ohm
nPCLK
HiPerClockS
PCLK/nPCLK
R1
120
FIGURE 4A. HIPERCLOCKS PCLK/NPCLK INPUT DRIVEN
BY A CML DRIVER
HiPerClockS
PCLK/nPCLK
R2
120
FIGURE 4B. HIPERCLOCKS PCLK/NPCLK INPUT DRIVEN
BY AN SSTL DRIVER
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
R4
125
R3
125
Zo = 50 Ohm
Zo = 50 Ohm
C1
LVDS
R3
1K
R4
1K
PCLK
PCLK
R5
100
Zo = 50 Ohm
nPCLK
LVPECL
R1
84
C2
nPCLK
Zo = 50 Ohm
HiPerClockS
Input
R1
1K
R2
84
FIGURE 4C. HIPERCLOCKS PCLK/NPCLK INPUT DRIVEN
BY A 3.3V LVPECL DRIVER
HiPerClockS
PCL K/n PC LK
R2
1K
FIGURE 4D. HIPERCLOCKS PCLK/NPCLK INPUT DRIVEN
BY A 3.3V LVDS DRIVER
3.3V
3.3V
3.3V
3.3V LVPECL
Zo = 50 Ohm
C1
Zo = 50 Ohm
C2
R3
84
R4
84
PCLK
nPCLK
R5
100 - 200
R6
100 - 200
R1
125
HiPerClockS
PCLK/nPCLK
R2
125
FIGURE 4E. HIPERCLOCKS PCLK/NPCLK INPUT DRIVEN
BY A 3.3V LVPECL DRIVER WITH AC COUPLE
853011CM
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8
REV. A MARCH 19, 2004
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS853011C
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS853011C.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS853011C is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.8V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)MAX = VCC_MAX * IEE_MAX = 3.8V * 18mA = 68.4mW
Power (outputs)MAX = 30.94mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 30.94mW = 61.88mW
Total Power_MAX (3.8V, with all outputs switching) = 68.4mW + 61.88mW = 130.3mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 103.3°C/W per Table 5A below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.130W * 103.3°C/W = 98.4°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 5A. THERMAL RESISTANCE θJA
FOR
8-PIN SOIC, FORCED CONVECTION
θJA by Velocity (Linear Feet per Minute)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
153.3°C/W
112.7°C/W
128.5°C/W
103.3°C/W
115.5°C/W
97.1°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 5B. THERMAL RESISTANCE θJA
FOR
8-PIN TSSOP, FORCED CONVECTION
θJA by Velocity (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
853011CM
0
1
2
101.7°C/W
90.5°C/W
89.8°C/W
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9
REV. A MARCH 19, 2004
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS853011C
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 5.
VCC
Q1
VOUT
RL
50
VCC - 2V
FIGURE 5. LVPECL DRIVER CIRCUIT
AND
TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination
voltage of V - 2V.
CC
•
For logic high, VOUT = V
OH_MAX
(V
CC_MAX
•
-V
OH_MAX
OL_MAX
CC_MAX
-V
OL_MAX
CC_MAX
–0.935V
) = 0.935V
For logic low, VOUT = V
(V
=V
=V
CC_MAX
– 1.67V
) = 1.67V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
))/R ] * (V
– (V
- 2V))/R ] * (V
-V
) = [(2V - (V
-V
-V
)=
Pd_H = [(V
OH_MAX
CC_MAX
CC_MAX
OH_MAX
CC_MAX
OH_MAX
CC_MAX
OH_MAX
L
L
[(2V - 0.935V)/50Ω] * 0.935V = 19.92mW
Pd_L = [(V
OL_MAX
– (V
CC_MAX
- 2V))/R ] * (V
L
CC_MAX
-V
OL_MAX
) = [(2V - (V
CC_MAX
-V
OL_MAX
))/R ] * (V
L
CC_MAX
-V
)=
OL_MAX
[(2V - 1.67V)/50Ω] * 1.67V = 11.02mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30.94mW
853011CM
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10
REV. A MARCH 19, 2004
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS853011C
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
RELIABILITY INFORMATION
TABLE 6A.
θJAVS. AIR FLOW TABLE FOR 8 LEAD SOIC
θJA by Velocity (Linear Feet per Minute)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
153.3°C/W
112.7°C/W
128.5°C/W
103.3°C/W
115.5°C/W
97.1°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 6B. θJAVS. AIR FLOW TABLE
FOR
8 LEAD TSSOP
θJA by Velocity (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
2
101.7°C/W
90.5°C/W
89.8°C/W
TRANSISTOR COUNT
The transistor count for ICS853011C is: 96
853011CM
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REV. A MARCH 19, 2004
PRELIMINARY
Integrated
Circuit
Systems, Inc.
PACKAGE OUTLINE - M SUFFIX
ICS853011C
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
FOR
8 LEAD SOIC
TABLE 7A. PACKAGE DIMENSIONS
SYMBOL
Millimeters
MINIMUN
N
A
MAXIMUM
8
1.35
1.75
A1
0.10
0.25
B
0.33
0.51
C
0.19
0.25
D
4.80
5.00
E
3.80
4.00
e
H
1.27 BASIC
5.80
6.20
h
0.25
0.50
L
0.40
1.27
α
0°
8°
Reference Document: JEDEC Publication 95, MS-012
853011CM
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12
REV. A MARCH 19, 2004
PRELIMINARY
Integrated
Circuit
Systems, Inc.
PACKAGE OUTLINE - G SUFFIX
ICS853011C
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
FOR
8 LEAD TSSOP
TABLE 7B. PACKAGE DIMENSIONS
SYMBOL
Millimeters
Minimum
N
A
Maximum
8
--
1.10
A1
0
0.15
A2
0.79
0.97
b
0.22
0.38
c
0.08
0.23
D
3.00 BASIC
E
4.90 BASIC
E1
3.00 BASIC
e
0.65 BASIC
e1
1.95 BASIC
L
0.40
0.80
α
0°
8°
aaa
--
0.10
Reference Document: JEDEC Publication 95, MO-187
853011CM
www.icst.com/products/hiperclocks.html
13
REV. A MARCH 19, 2004
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS853011C
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
TABLE 8. ORDERING INFORMATION
Part/Order Number
Marking
Package
Count
Temperature
ICS853011CM
853011C
8 lead SOIC
96 per tube
-40°C to 85°C
ICS853011CMT
853011C
8 lead SOIC on Tape and Reel
2500
-40°C to 85°C
ICS853011CMLF
3011CLF
"Lead Free" 8 lead SOIC
96 per tube
-40°C to 85°C
ICS853011CMLFT
3011CLF
"Lead Free" 8 lead SOIC on Tape and Reel
2500
-40°C to 85°C
ICS853011CG
011C
8 lead TSSOP
96 per tube
-40°C to 85°C
ICS853011CGT
011C
8 lead TSSOP on Tape and Reel
2500
-40°C to 85°C
The aforementioned trademark, HiPerClockS™ is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not
recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product
for use in life support devices or critical medical instruments.
853011CM
www.icst.com/products/hiperclocks.html
14
REV. A MARCH 19, 2004