NIEC PDMC200B12C2

QS043-401M0061 (2/4)
PDMB200B12C
IGBT Module-Dual
200 A,1200V
□ 回 路 図 : CIRCUIT
□ 外 形 寸 法 図 : OUTLINE DRAWING
3-M6
12.0 11.0 12.0 11.0 12.0
7(G2)
6(E2)
2-Ø6.5
5
4
5(E1)
4(G1)
2
1
5
4
3-M5
9
16
9
23.0
23.0
17.0
24
16
14
9
9
14
4-fasten tab
#110 t=0.5
14
LABEL
7
7
23
LABEL
30 +1.0
- 0 .5
30 +1.0
- 0.5
8
16
25
21.2 7.5
25
7
6
3
4
6
4 18.0
7
3
2
48.0
16.0
14.0
1
15 6
48 ± 0 .2 5
(C1)
3
94.0
80 ±0.25
4-Ø 6.5
6
(E2)
2
108
93 ± 0 .2 5
14 11 14 11 14
62
11 13
20
(C2E1)
1
PDMB200B12C2
PDMB200B12C
PDMB200B12C2
Dimension:[mm]
□ 最 大 定 格 : MAXIMUM RATINGS
(TC=25℃)
Item
コレクタ・エミッタ間電圧
Collector-Emitter Voltage
ゲ ー ト・エ ミ ッ タ 間 電 圧
Gate-Emitter Voltage
Rated
Symbol
Value
Unit
VCES
1,200
V
VGES
±20
V
IC
ICP
200
400
A
コ レ ク タ 損 失
Collector Power Dissipation
PC
960
W
接
合
温
度
Junction Temperature Range
Tj
-40~+150
℃
保
存
温
度
Storage Temperature Range
Tstg
-40~+125
℃
DC
1ms
コ レ ク タ 電 流
Collector Current
絶
縁
耐
圧(Terminal to Base AC,1minute)
Isolation Voltage
Module Base to Heatsink
締 め 付 け ト ル ク
Mounting Torque
Busbar to Main Terminal
□ 電 気 的 特 性
VISO
Ftor
2,500
PDMB200B12C
V(RMS)
3(30.6)
N・m
3(30.6)
PDMB200B12C2 2(20.4) (kgf・cm)
: ELECTRICAL CHARACTERISTICS (TC=25℃)
Characteristic
コ レ ク タ 遮 断 電 流
Collector-Emitter Cut-Off Current
ゲ ー ト 漏 れ 電 流
Gate-Emitter Leakage Current
Symbol
Min.
Typ.
Max.
Unit
ICES
VCE= 1200V,VGE= 0V
-
-
4.0
mA
IGES
VGE= ±20V,VCE= 0V
-
-
1.0
μA
コレクタ・エミッタ間飽和電圧
Collector-Emitter Saturation Voltage
VCE(sat)
IC= 200A,VGE= 15V
-
1.9
2.4
V
ゲ ー ト し き い 値 電 圧
Gate-Emitter Threshold Voltage
VGE(th)
VCE= 5V,IC= 200mA
4.0
-
8.0
V
入
力
容
量
Input Capacitance
上 昇 時 間
ターンオン時間
下 降 時 間
ターンオフ時間
スイッチング時間
Switching Time
Rise
Turn-on
Fall
Turn-off
□フリーホイーリングダイオードの 特 性: FREE
Time
Time
Time
Time
DC
1ms
Characteristic
順
電
圧
Peak Forward Voltage
逆 回 復 時 間
Reverse Recovery Time
□ 熱
的
特 性
Cies
VCE= 10V,VGE= 0V,f= 1MHZ
-
16,600
-
pF
tr
ton
tf
toff
VCC= 600V
RL= 3Ω
RG= 2Ω
VGE= ±15V
-
-
-
-
0.25
0.40
0.25
0.80
0.45
0.70
0.35
1.10
μs
WHEELING DIODE RATINGS & CHARACTERISTICS(TC=25℃)
Item
順
電
流
Forward Current
Test Condition
Rated
Symbol
IF
IFM
Symbol
Test Condition
Value
200
400
Unit
A
Min.
Typ.
Max.
Unit
VF
IF= 200A,VGE= 0V
-
1.9
2.4
V
trr
IF= 200A,VGE= -10V
di/dt= 400A/μs
-
0.2
0.3
μs
Min.
-
-
Typ.
-
-
: THERMAL CHARACTERISTICS
Characteristic
熱
抵
抗
IGBT
Thermal Impedance
Diode
Symbol
Rth(j-c)
Test Condition
Junction to Case
日本インター株式会社
Max. Unit
0.125
℃/W
0.24
QS043-401M0061 (3/4)
PDMB200B12
PDMB200B12C
Fig.2- Collector to Emitter On Voltage
vs. Gate to Emitter Voltage (Typical)
Fig.1- Output Characteristics (Typical)
TC=25℃
400
12V
I C=100A
15V
Collector Current I C (A)
300
9V
200
8V
100
7V
0
0
2
TC=25℃
16
10V
Collector to Emitter Voltage V CE (V)
V GE =20V
4
6
8
14
200A
12
10
8
6
4
2
0
10
0
4
Fig.3- Collector to Emitter On Voltage
vs. Gate to Emitter Voltage (Typical)
Collector to Emitter Voltage V CE (V)
Collector to Emitter Voltage V CE (V)
12
10
8
6
4
2
8
12
16
RL=3Ω
TC=25℃
16
700
14
600
12
500
10
8
400
VCE =600V
6
300
400V
4
200
200V
2
100
0
20
0
300
600
900
1200
0
1500
Total Gate Charge Qg (nC)
Gate to Emitter Voltage V GE (V)
Fig.6- Collector Current vs. Switching Time (Typical)
Fig.5- Capacitance vs. Collector to Emitter Voltage (Typical)
100000
50000
VGE =0V
f=1MHZ
TC=25℃
20000
Cies
10000
5000
Coes
2000
1000
1.4
V CC=600V
R G= 2.0 Ω
V GE =±15V
TC=25℃
1.2
Switching Time t (μs)
Capacitance C (pF)
20
1
tOFF
0.8
tf
0.6
0.4
500
Cres
200
100
0.1
0.2
0.5
1
2
5
10
20
50
100
200
0.2
0
tON
tr
0
Collector to Emitter Voltage V CE (V)
50
100
Collector Current IC (A)
日本インター株式会社
150
200
Gate to Emitter Voltage V GE (V)
200A
4
16
800
400A
14
0
12
Fig.4- Gate Charge vs. Collector to Emitter Voltage (Typical)
TC=125℃
16
0
8
Gate to Emitter Voltage V GE (V)
Collector to Emitter Voltage V CE (V)
I C=100A
400A
QS043-401M0061 (4/4)
PDMB200B12
PDMB200B12C
Fig.8- Forward Characteristics of Free Wheeling Diode
(Typical)
Fig.7- Series Gate Impedance vs. Switching Time (Typical)
400
10
VCC=600V
I C=200A
VGE =±15V
TC=25℃
TC=125℃
toff
tr
2
Forward Current I F (A)
Switching Time t (μs)
5
TC=25℃
ton
1
tf
0.5
0.2
300
200
100
0.1
0.05
1
2
5
10
20
50
100
0
200
0
1
3
4
Fig.10- Reverse Bias Safe Operating Area
Fig.9- Reverse Recovery Characteristics (Typical)
1000
1000
IF=200A
TC=25℃
500
R G=2Ω
V GE=±15V
TC≦125℃
500
200
Collector Current I C (A)
200
trr
100
50
20
IRrM
100
50
20
10
5
2
1
0.5
10
0.2
200
400
600
800
1000
0.1
1200
0
400
800
Fig.11- Transient Thermal Impedance
1
5x10 -1
FRD
2x10 -1
IGBT
1x10 -1
5x10 -2
2x10 -2
1x10 -2
5x10 -3
2x10 -3
TC=25℃
1x10 -3
1 Shot Pulse
5x10
-4
10 -5
1200
Collector to Emitter Voltage V CE (V)
-di/dt (A/μs)
(℃/W)
0
(J-C)
5
Transient Thermal Impedance Rth
Peak Reverse Recovery Current I RrM (A)
Reverse Recovery Time trr (ns)
2
Forward Voltage V F (V)
Series Gate Impedance R G (Ω)
10 -4
10 -3
10 -2
10 -1
Time t (s)
日本インター株式会社
1
10 1
1600