Connector for W-SIM SCZA Series High reliability contact structure best fit for portable devices. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM Features ● ● ● ● Applications Improved operability from long ejection stroke (5mm) and clear click feel. Good operational feel. Double contact-point for power and ground reduces risk of temporary power failure. Compact and low-profile suitable for portable devices. ● For mobile phones, PCs, and personal digital assistants For Memory Stick™ Combine Type For Compact Flash™ Typical Specifications Items Specifications Applicable media For PC cards supporting CardBus W-SIM Mounting type Surface mounting type Mounting style Standard mount Media ejection structure Push-push type, Manual insertion/removal For Express Card™ Structure Performance For Memory Stick Micro™ Operating temperature range −20℃ to ＋60℃ Voltage proof 500V AC 1minute Insulation resistance（Initial） 1,000MΩ min. Contact resistance（Initial） 100mΩ max. Insertion and removal cycle 10,000cycles For CMOS Camera Module Product Line Media ejection structure Push-push type Manual insertion/removal Mounting system Standard mount Features Stand-off （mm） Packing system Product No. Drawing No. Without boss L type SCZA1A0100 1 With boss L type SCZA1A0200 2 Without boss 0.6mm type SCZA1A0300 3 With boss 0.6mm type SCZA1A0400 4 Without boss 1.2mm type SCZA1A0500 5 With boss 1.2mm type SCZA1A0600 6 With boss L type SCZA2A0100 7 Without boss 0.6mm type SCZA2A0200 8 0 Tray 29 Connector for W-SIM SCZA Series Unit:mm Dimensions No. PC board mounting hole dimensions （Viewed from the mounting face side） Style Push-push type Without boss L type For SD Memory Card For microSD™ Card (1) 0.6 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 1.3 31.3 2.1 min. 2.4 30.1 9.3 min. 6.7 max. 10.4 min. 15.05 min. 15.05 min. 14.25 max. 15.95 min. 14.25 max. 15.95 min. Connector center Connector center 4.65 Card center 13 min. 4-2.6 min. For Compact Flash™ Over travel (1.2) Eject travel(5) For Memory Stick™ Combine Type 15.95 min. 14.25 max. 29.2 4-2 1 (44.6) 30.2 For W-SIM 15.95 min. 14.25 max. 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 min. 1.45 (11) For SIM Card 8pins For Memory Stick Micro™ Center of gravity (vacuum point) 29.5 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 18-0.4 For PC cards supporting CardBus No parts area Land area No pattern area For Express Card™ Push-push type With boss L type 29.5 1.45 (11) V1 0.6 (1) 29.2 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 1.1 V1 Eject travel(5) 15.05 min. 15.05 min. 31.3 14.25 max. 15.95 min. 14.25 max. 15.95 min. Connector center 4.65 Card center Over travel (1.20) Connector center No Part Area Land No Pattern Area 30 4- 2.6 min. 13.65 1.3 30.1 2.1 min. 4-2 23 9.3 min. 6.7 max. 13.65 10.4 min. 4 13 min. V1. 2 (44.6) 2.4 0.6 23 30.2 C 0.1 15.95 min. 14.25 max. 5.1 Center of gravity (Vacuum point) 15.95 min. 14.25 max. 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 min. 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 18-0.4 4.2 For CMOS Camera Module .1 Connector for W-SIM SCZA Series Unit:mm Dimensions No. PC board mounting hole dimensions （Viewed from the mounting face side） Style (1) (44.6) 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 9.3 min. 6.7 min. 4-1.4 27.7 30.2 (11) ALPS 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 min. 4-2.5 2.1 min. 2.4 27.7 Center of gravity (vacuum point) 29.5 For SD Memory Card 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 18-0.4 1.45 0.6 Push-push type Without boss 0.6mm type 4-0.5 4-1.1 3 13 min. 15.05 min. Hole 4-0.6 10.4 min. 15.05 min. 4-1.9 29.35 4- Over travel (1.20) R0 .2 Eject travel (5) .5 Connector center 4.65 For W-SIM For Memory Stick Micro™ Combine Type For Compact Flash™ Connector center Card center For SIM Card 8pins For Memory Stick™ 14.675 4-R0 1.3 For microSD™ Card No No PartPart Area Area Land Land No No Pattern Area Pattern Area For PC cards supporting CardBus 29.2 For Express Card™ Push-push type With boss 0.6mm type R0 Over travel (1.20) 4- Eject travel (5) 29.35 Connector center Connector center 4.65 Card center 0.5 4-R 1.3 23 27.7 14.675 13.65 .2 4-0.6 10.4 min. 15.05 min. 13.65 .4 13 min. 15.05 min. Hole 4 4-2.5 2.1 min. 2.4 23 27.7 4-1.4 4-0.5 4-1.1 φ1 (44.6) 9.3 min. 6.7 max. 4.2 φ1 (11) C0.1 0.6 30.2 ALPS 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 1.1 4-1.9 1.45 0.6 (1) 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 min. φ 1. 1 Center of gravity (vacuum point) 29.5 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 18-0.4 5.1 For CMOS Camera Module No Part Area Land No Pattern Area 29.2 31 Connector for W-SIM SCZA Series Unit:mm Dimensions PC board mounting hole dimensions （Viewed from the mounting face side） Push-push type Without boss 1.2mm type For SD Memory Card Center of gravity (vacuum point) For microSD™ Card (11) 0.6 (1) 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 4-0.5 4-1.1 5 13 min. 4-1.2 Eject travel (5) 10.4 min. 15.05 min. 15.05 min. Holes 14.675 Combine Type 4-R0 29.35 Connector center Card center 4.65 For Compact Flash™ For PC cards supporting CardBus .5 4-1.9 Connector center 4R0 .2 1.3 Over travel (1.20) For Memory Stick™ No Part Area Land No Pattern Area 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 18-0.4 Center of gravity (vacuum point) (1) 4.2 1.45 φ1 29.5 (11) 4-0.5 4-1.1 6 4-1.2 Eject travel (5) 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 1.1 9.3 min. 6.7 min. 23 27.7 4-1.4 30.2 13.65 Hole 13min. 15.05min. 10.4min. 15.05min. 29.2 4-R0 29.35 No Part Area Land No Pattern Area 4-1.9 1 .5 Connector center 4.65 Card center Connector center 1. 1.3 Over travel (1.20) 14.675 φ (44.6) C 0.1 0.6 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 4R0 .2 0.6 For CMOS Camera Module 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 4-2.5 2.1min. 2.4 23 27.7 Push-push type With boss 1.2mm type 5.1 29.2 For Express Card™ 32 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 min. 9.3 min. 6.7 min. 27.7 4-1.4 For W-SIM 30.2 (44.6) For SIM Card 8pins For Memory Stick Micro™ 1.45 29.5 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 18-0.4 27.7 Style 4-2.5 2.1 min. 2.4 No. Connector for W-SIM SCZA Series Unit:mm Dimensions No. PC board mounting hole dimensions （Viewed from the mounting face side） Style φ For microSD™ Card φ For SD Memory Card φ 7 Manual insertion/removal With boss L type For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ 1.90 2.50 1.10 0.50 0 0.2 4.85 1.80 18- 0.80 4-R 23.40 min. 27.80 min. :No Part Area :Land :No Pattern Area 8 For CMOS Camera Module 26.55 20.95 18.65 16.35 14.05 11.75 9.45 7.15 1.55 max. 8.05 min. 7.65 min. 5.55 max. 1.45 min. Manual insertion/removal Without boss 0.6mm type 33 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition（Reference） For SD Memory Card 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）. 3. Temperature profile（Surface of products）. For microSD™ Card For W-SIM For Memory Stick Micro™ For Memory Stick™ Temperature (˚C ) For SIM Card 8pins 240℃(max.) 230℃(min.) 200 180℃ 150℃ 100 Room temperature Time (s) Pre-heating 90±30 sec. 10 sec.(max.) Combine Type Heating time sec. For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 50 Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.