TI TPS92640

TPS92640
TPS92641
www.ti.com
SNVS902 – NOVEMBER 2012
TPS92640 / TPS92641 Synchronous Buck Controllers for Precision Dimming LED Drivers
FEATURES
DESCRIPTION
•
•
•
•
•
The TPS92640/41 are high voltage, synchronous
NFET controllers for buck current regulators. Output
current regulation is based on valley current-mode
control with a constant on-timer. This control method
eases the design of loop compensation. The
TPS92640/41 includes a high-voltage start-up
regulator that operates over a wide input range of 7V
to 85V. The PWM controller is designed for high
speed capability including an oscillator frequency
range up to 1.0 MHz. The TPS92640/41 is optimized
to give superior dimming performance with both
analog and PWM dimming. Both devices include an
error amplifier, precision reference, thermal shutdown
and low power shutdown mode. Additionally, the
TPS92641 provides shunt FET dimming capability.
1
2
•
•
•
•
VIN range from 7V to 85V
2Ω, 1Apeak MOSFET gate drivers
Adjustable LED Current Sense voltage
Input UVLO and output OVP
Various dimming modes
– 500:1 Analog Dimming
– 2500:1 Standard PWM dimming
– 20000:1 Shunt FET PWM dimming
Shunt Dimming MOSFET gate driver
Programmable switching frequency
Precision Voltage Reference
Low Power Shutdown Mode and Thermal
Shutdown
APPLICATIONS
•
•
•
LED Driver / Constant Current Regulator
Automotive LED Drivers
General LED Illumination
TYPICAL APPLICATION DIAGRAM
VIN
C2
R1
TPS92641
R2
VIN
HG
RON
SW
Q1
L1
C1
C6
D2
LED+
C4
UDIM
UDIM
BOOT
R4
R3
VOUT
R8
C5
D1
Q3*
VCC
LED
LOAD
C3
C7
VREF
LG
IADJ
CS
Q2
R5
R7
R6
C8
COMP
DAP
GND
R9
LEDR10
SDIM*
SDIM
SDRV
*TPS92641 only
GND
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCT PREVIEW information concerns products in the
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.
Copyright © 2012, Texas Instruments Incorporated
PRODUCT PREVIEW
Check for Samples: TPS92640, TPS92641
TPS92640
TPS92641
SNVS902 – NOVEMBER 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PIN CONFIGURATION
TPS92641
PWP Package
(Top View)
TPS92640
PWP Package
(Top View)
VIN
1
14
HG
VIN
1
16
HG
RON
2
13
SW
RON
2
15
SW
UDIM
3
12
BOOT
UDIM
3
14
BOOT
VOUT
4
11
VCC
VOUT
4
13
VCC
VREF
5
10
LG
VREF
5
12
LG
IADJ
6
9
CS
IADJ
6
11
CS
COMP
7
8
GND
COMP
7
10
GND
SDIM
8
9
SDRV
DAP
DAP
PIN FUNCTIONS
PRODUCT PREVIEW
TPS92640
TPS92641
1
1
VIN
NAME
Connect to input voltage. Connect 1µF bypass capacitor
DESCRIPTION
2
2
RON
Connect a resistor to VIN and capacitor to GND to set switching frequency.
3
3
UDIM
Connect resistor divider from VIN to set under-voltage lockout threshold.
4
4
VOUT
Connect resistor divider from VOUT, scaled down feedback of VOUT.
5
5
VREF
Connect to top of resistor divider for IADJ. Bypass with 100nF ceramic capacitor.
6
6
IADJ
Connect resistor divider from VREF or directly to VREF to set analog dimming level. Can be used for
thermal fold-back also.
7
7
COMP
Connect ceramic capacitor to GND to set loop compensation.
8
SDIM
PWM dimming input for shunt FET dimming.
9
SDRV
Connect to gate of external parallel NFET across LED load used for shunt dimming if desired.
8
10
GND
System GND. Connect to DAP.
9
11
CS
Connect to positive terminal of sense resistor at the bottom of the LED stack.
10
12
LG
Connect to gate of low-side NFET of buck regulator.
11
13
VCC
Bypass with 2.2µF ceramic capacitor to provide bias supply for controller.
12
14
BOOT
Connect 100nF ceramic capacitor to switch node and diode to VCC to provide boosted voltage for
high-side gate drive.
13
15
SW
Connect to switch node of buck regulator.
14
16
HG
Connect to gate of high-side NFET of buck regulator.
DAP
Place 6-9 vias from pad to GND plane for thermal relief
Ordering Information
ORDER NUMBER
PACKAGE TYPE
PACKAGE DRAWING
TPS92640PWP
TPS92640PWPT
14L TSSOP EXP PAD
MXA14A
TPS92640PWPR
92 Units in Rail
16L TSSOP EXP PAD
MXA16A
TPS92641PWPR
2
250 Units on Tape and Reel
2500 Units on Tape and Reel
TPS92641PWP
TPS92641PWPT
SUPPLIED AS
94 Units in Rail
250 Units on Tape and Reel
2500 Units on Tape and Reel
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Product Folder Links: TPS92640 TPS92641
TPS92640
TPS92641
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SNVS902 – NOVEMBER 2012
ABSOLUTE MAXIMUM RATINGS (1)
VIN, UDIM, SW
BOOT
HG
V
–1 (Continuous)
mA
–0.3 to 98.5
V
–0.3 to 90
V
–2.5 for 100
V/ns
98.5 for 100
v/ns
mA
–0.3 to +VCC (Continuous)
V
–2.5 for 100
V/ns
VCC + 2.5 for 100
V/ms
–1 to +1 (Continuous)
mA
–0.3 to 15
V
VCC
GND
UNITS
–1 to +1 (Continuous)
LG, SDRV, CS
VREF, RON, COMP, VOUT, IADJ, SDIM
VALUE
–0.3 to 90
–0.3 to 6
V
–200 to +200 (Continuous)
µA
–0.3 to +0.3 (Continuous)
V
–2.5 to +2.5 for 100
V/ns
Continuous Power Dissipation
Internally Limited
Maximum Junction Temperature
Internally Limited
Storage Temperature Range
–65 to +150
Maximum Lead Temperature (Soldering and Reflow)
ESD Rating
(1)
(2)
(2)
Human Body Model, applicable std. JESD22-A114-C
PRODUCT PREVIEW
If Military/Aerospace specified devices are required, contact the National Semiconductor Sales/Office/Distributors for
availability and specifications.
°C
260
°C
2
kV
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified and do not imply guaranteed performance limits. For specified performance limits and
associated test conditions, see the Electrical Characteristics table. All voltages are with respect to the potential at the GND pin, unless
otherwise specified.
Refer to TI’s packaging website for more detailed information and mounting techniques.
RECOMMENDED OPERATING CONDITIONS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
Input Voltage Range
TJ
(1)
Junction Temperature Range
NOM
MAX
UNIT
7
85
V
–40
125
°C
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified and do not imply guaranteed performance limits. For specified performance limits and
associated test conditions, see the Electrical Characteristics table. All voltages are with respect to the potential at the GND pin, unless
otherwise specified.
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Product Folder Links: TPS92640 TPS92641
3
TPS92640
TPS92641
SNVS902 – NOVEMBER 2012
www.ti.com
ELECTRICAL CHARACTERISTICS (1)
Unless otherwise specified VIN = 24V. Limits appearing in bold type face apply over the entire junction temperature range of
operation, –40°C to 125°C. Specifications appearing in normal type apply for TA = TJ = 25°C. Datasheet min/max specification
limits are specified by design, test or statistical analysis.
PARAMETER
CONDITIONS
MIN (2)
TYP (3)
MAX (2)
7.86
8.5
9.14
48
63
78
mA
2
3
mA
UNIT
STARTUP REGULATOR (VCC)
VCCREG
VCC Regulation
ICC = 10 mA, VIN = 24V, 85V
ICCLIM
VCC Current Limit
VCC = 0V
IQ
Quiescent Current
VUDIM = 3.0V,
Static VIN = 7V/24V/85V
ISD
Shutdown Current
VUDIM = 0V
100
VCC increasing
5.04
VCC-UV
VCC UVLO Threshold
VCC-HYS
VCC UVLO Hysteresis
VCC decreasing
4.5
V
µA
5.90
4.9
0.17
V
V
REFERENCE VOLTAGE (VREF)
VREF
Reference Voltage
No Load, VIN = 7V/24V/85V
IVREFLIM
Current Limit
VREF = 0V
2.97
3.03
3.09
V
1.3
2.1
2.9
mA
600
µV
ERROR AMPLIFIER (CS, COMP)
PRODUCT PREVIEW
VCSREF
CS Reference Voltage
VCSREF-OFF
Error Amp Input Offset Voltage
ICOMP
COMP Sink Current
gM-CS
With respect to GND
VADJ/10
–600
0
V
85
µA
COMP Source Current
110
µA
Transconductance
500
µA/V
(4)
Linear Input Range
See
Transconductance Bandwidth
-6dB unloaded response (4)
±125
mV
400
kHz
230
ns
TIMERS / OVER VOLTAGE PROTECTION (RON, VOUT)
tOFF-MIN
Minimum Off-time
tON-MIN
Minimum On-time
CS = 0V
tON
Programmed On-time
RRON
RON Pull-down Resistance
tCL
Current Limit Off-time
tD-ON
RON Thresh - HG Falling Delay
VTH-OVP
VOUT Over-Voltage Threshold
VHYS-OVP
VOUT Over-Voltage Hysteresis
235
VVOUT = 2V, RON = 25 kΩ, CON = 1nF
2.08
35
µs
120
270
µs
25
VOUT rising
2.85
3.05
Ω
ns
3.25
0.13
V
V
GATE DRIVER (HG, LG, BOOT, SW)
1.5
6.0
Ω
1
4.5
Ω
3.9
6.0
Ω
1.1
4.5
Ω
3.4
4.5
V
RSRC-LG
LG Sourcing Resistance
LG = High
RSNK-LG
LG Sinking Resistance
LG = Low
RSRC-HG
HG Sourcing Resistance
HG = High
RSNK-HG
HG Sinking Resistance
HG = Low
VTH-BOOT
BOOT UVLO Threshold
BOOT-SW rising
VHYS-BOOT
BOOT UVLO Hysteresis
BOOT-SW falling
1.8
V
TD-HL
HG to LG deadtime
HG fall to LG rise
60
ns
TD-LH
LG to HG deadtime
LG fall to HG rise
60
ns
(1)
(2)
(3)
(4)
4
1.9
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified and do not imply guaranteed performance limits. For specified performance limits and
associated test conditions, see the Electrical Characteristics table. All voltages are with respect to the potential at the GND pin, unless
otherwise specified.
All limits specified at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits
are 100% production tested. All limits at temperature extremes are specified via correlation using standard Statistical Quality Control
(SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
Typical numbers are at 25°C and represent the most likely norm.
These electrical parameters are specified by design, and are not verified by test.
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: TPS92640 TPS92641
TPS92640
TPS92641
www.ti.com
SNVS902 – NOVEMBER 2012
ELECTRICAL CHARACTERISTICS(1) (continued)
Unless otherwise specified VIN = 24V. Limits appearing in bold type face apply over the entire junction temperature range of
operation, –40°C to 125°C. Specifications appearing in normal type apply for TA = TJ = 25°C. Datasheet min/max specification
limits are specified by design, test or statistical analysis.
PARAMETER
CONDITIONS
MIN (2)
TYP (3)
MAX (2)
UNIT
PWM DIMMING (SDIM, SDRV) (TPS92641 only.)
RSRC-DDRV
SDRV Sourcing Resistance
SDRV = High
5.6
30.0
W
tSDIM-RIS
SDIM to SDRV Rising Delay
SDIM rising
68
100
ns
tSDIM -FALL
SDIM to SDRV Falling Delay
SDIM falling
29
70
VSDIM-RIS
SDIM Rising Threshold
SDIM rising
1.29
1.74
VSDIM -FALL
SDIM Falling Threshold
SDIM falling
RSDIM-PU
SDIM Pull-Up Resistance
0.5
V
V
90
kW
ANALOG ADJUST (IADJ)
VADJ-MAX
IADJ Clamp Voltage
RADJ
IADJ Input Impedance
2.46
2.54
2.62
1
V
MΩ
VTH-UDIM
UDIM Startup Threshold
UDIM rising
1.210
IHYS-UDIM
UDIM Hysteresis Current
tUDIM-RIS
UDIM to HG/LG Rising Delay
UDIM rising
tUDIM-FALL
UDIM to HG/LG Falling Delay
UDIM falling
174
VUDIM-LP
UDIM Low Power Threshold
TUDIM-DET
UDIM Shutdown Detect Timer
12
UDIM falling
8.5
1.276
1.342
V
21
30
µA
168
260
ns
280
ns
370
mV
13
ms
THERMAL SHUTDOWN
TSD
Thermal Shutdown Threshold
THYS
Thermal Shutdown Hysteresis
See
(5)
165
°C
See
(5)
20
°C
THERMAL RESISTANCE
θJA-TPS92640
θJA-TPS92641
(5)
(6)
Junction to Ambient
Junction to Ambient
14L TSSOP EXP PAD (6)
16L TSSOP EXP PAD
(6)
40.0
°C/W
37.4
°C/W
These electrical parameters are specified by design, and are not verified by test.
Junction-to-ambient thermal resistance is highly board-layout dependent. In applications where high maximum power dissipation exists,
namely driving a large MOSFET at high switching frequency from a high input voltage, special care must be paid to thermal dissipation
issues during board design. In high-power dissipation applications, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the
maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the package in
the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
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Product Folder Links: TPS92640 TPS92641
5
PRODUCT PREVIEW
UNDER-VOLTAGE / PWM (UDIM)
TPS92640
TPS92641
SNVS902 – NOVEMBER 2012
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
VIN
TPS92640, TPS92641
VCC
VCC BIAS
REGULATOR
VIN
COMP
THERMAL
SHUTDOWN
IADJ
VOLTAGE
REFERENCES
VCC UVLO
VCC
VSW
EA
+
-
R
GATE DRIVE UVLO
+
+
13ms FILTER
FSW
R Q
Shutdown
S
Q
tON
tOFF
LGATE Enable
UDIM
DEAD TIME /
LEVEL SHIFT
tON_ Reset
HG
SW
VCC
LOGIC
RON
H.S.
Driver
VSW
21µA
PWM_DIM / UVLO
+
-
1.276V
BOOT
SD
CS
370mV
VREF
VDD
PWM_DIM
2.54V 9R
370mV
1.276V
2.54V 3.03V
DEAD
TIME
L.S.
Driver
LG
End tON
PRODUCT PREVIEW
+
-
GND
tON_Reset
LEB TIMER
VOUT
3.05V
OVP
+
-
TPS92641 ONLY
VDD
VCC
SDIM
1.276V
6
+
-
PWM
LOGIC
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SDRV
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: TPS92640 TPS92641
TPS92640
TPS92641
www.ti.com
SNVS902 – NOVEMBER 2012
TPS92640 - Precision Analog Dimming Application
VIN
VIN
HG
TPS92640
SW
RON
UDIM
BOOT
VOUT
VCC
VREF
LG
ROFF
ILED
uC
IADJ
CS
DAP
COMP
PRODUCT PREVIEW
GND
TPS92640 – PWM Dimming Application with Thermal Fold-back
VIN
VIN
HG
TPS92640
RON
SW
UDIM
BOOT
VOUT
VCC
VREF
LG
IADJ
NT
C
ILED
CS
DAP
COMP
GND
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: TPS92640 TPS92641
7
TPS92640
TPS92641
SNVS902 – NOVEMBER 2012
www.ti.com
TPS92641 – Shunt FET PWM Dimming Application
VIN
VIN
TPS92641
HG
SW
RON
UDIM
BOOT
VOUT
VCC
VREF
LG
IADJ
CS
COMP
ILED
GND
DAP
uC
PRODUCT PREVIEW
SDIM
8
SDRV
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: TPS92640 TPS92641
TPS92640
TPS92641
www.ti.com
SNVS902 – NOVEMBER 2012
TPS92640 – AC/DC TRIAC Dimming Application (with LM3450)
PWM
VREF
BIAS
DIM
HOLD
Optical
Isolation
+
FB
VDC
VIN
TPS92640
HG
ZCD
FLT1
PWM
FLT2
Optical
Isolation
RON
SW
VCC
LM3450
UDIM
BOOT
VOUT
VCC
VREF
LG
IADJ
CS
PRODUCT PREVIEW
TRIAC
dimmed AC
Line
GATE
VADJ
CS
VAC
COMP
GND
DAP
ISEN
FB
ILED
COMP
GND
FB
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Product Folder Links: TPS92640 TPS92641
9
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