ISC BUW34

Inchange Semiconductor
Product Specification
BUW34
Silicon NPN Power Transistors
DESCRIPTION
・With TO-3 package
・High breakdown voltage
APPLICATIONS
・For high voltage ,fast switching
applications
PINNING (See Fig.2)
PIN
DESCRIPTION
1
Base
2
Emitter
3
Collector
Fig.1 simplified outline (TO-3) and symbol
Absolute maximum ratings(Ta=25℃)
体
半导
SYMBOL
PARAMETER
VALUE
UNIT
500
V
400
V
7
V
10
A
Collector current-peak
15
A
IB
Base current
5
A
PT
Total power dissipation
125
W
Tj
Junction temperature
200
℃
Tstg
Storage temperature
-65~200
℃
VALUE
UNIT
1.4
℃/W
固电
CONDITIONS
VCBO
Collector-base voltage
Open emitter
VCEO
Collector-emitter voltage
Open base
VEBO
Emitter-base voltage
IC
ICM
N
A
H
INC
M
E
S
GE
Collector current
D
N
O
IC
Open collector
TC≤25℃
R
O
T
UC
THERMAL CHARACTERISTICS
SYMBOL
Rth j-c
PARAMETER
Thermal resistance from junction to case
Inchange Semiconductor
Product Specification
BUW34
Silicon NPN Power Transistors
CHARACTERISTICS
Tj=25℃ unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
VCEO(SUS)
Collector-emitter sustaining voltage
IC=100mA ; IB=0
VCEsat
Collector-emitter saturation voltage
IC=5A; IB=1A
1.5
V
VBEsat
Base-emitter saturation voltage
IC=5A; IB=1A
1.5
V
ICES
Collector cut-off current
VCE=500V ;VBE=0
TC=125℃
0.1
3.0
mA
IEBO
Emitter cut-off current
VEB=7V; IC=0
1
mA
hFE-1
DC current gain
IC=1A ; VCE=5V
15
hFE-2
DC current gain
IC=5A ; VCE=5V
8
导体
半
电
固
MIN
Turn-on time
Storage time
tf
Fall time
IC=5A ;IB1=- IB2=1A
VCC=250V
2
UNIT
V
50
R
O
T
UC
D
N
O
IC
M
E
S
GE
N
A
H
INC
ts
MAX
400
Switching times
ton
TYP.
0.7
μs
3.0
μs
0.8
μs
Inchange Semiconductor
Product Specification
BUW34
Silicon NPN Power Transistors
PACKAGE OUTLINE
导体
半
电
固
D
N
O
IC
R
O
T
UC
M
E
S
GE
N
A
H
INC
Fig.2 Outline dimensions
3