AOSMD AO6420

AO6420
N-Channel Enhancement Mode Field Effect Transistor
General Description
Features
The AO6420 uses advanced trench technology to
provide excellent RDS(ON) and low gate charge. This
device is suitable for use as a load switch or in PWM
applications. Standard Product AO6420 is Pb-free
(meets ROHS & Sony 259 specifications).
VDS (V) = 60V
ID = 4.2A (VGS = 10V)
RDS(ON) < 60mΩ (VGS = 10V)
RDS(ON) < 75mΩ (VGS = 4.5V)
Rg,Ciss,Coss,Crss Tested!
TSOP-6
Top View
D
D
G
1 6
2 5
3 4
D
D
D
S
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
TA=25°C
Continuous Drain
Current A,F
Pulsed Drain Current
TA=70°C
ID
IDM
B
Junction and Storage Temperature Range
Alpha & Omega Semiconductor, Ltd.
±20
V
20
2.00
W
1.28
TJ, TSTG
-55 to 150
Symbol
t ≤ 10s
Steady-State
Steady-State
A
3.4
PD
TA=70°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
Maximum Junction-to-Lead C
Units
V
4.2
TA=25°C
Power Dissipation
Maximum
60
RθJA
RθJL
Typ
48
74
35
°C
Max
62.5
110
40
Units
°C/W
°C/W
°C/W
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AO6420
N Channel Electrical Characteristics (T J=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
Conditions
Min
ID=250µA, VGS=0V
1
TJ=55°C
5
Gate-Body leakage current
VDS=0V, VGS= ±20V
Gate Threshold Voltage
VDS=VGS ID=250µA
1
ID(ON)
On state drain current
VGS=10V, VDS=5V
20
VGS=10V, I D=4.2A
TJ=125°C
Static Drain-Source On-Resistance
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Rg
Gate resistance
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
Qg(4.5V) Total Gate Charge
V
50
60
A
85
13
IS=1A,VGS=0V
Diode Forward Voltage
Maximum Body-Diode Continuous Current
Coss
nA
3
VDS=5V, ID=4.2A
Forward Transconductance
Crss
100
60
gFS
VGS=0V, VDS=0V, f=1MHz
VGS=10V, VDS=30V, I D=4.2A
75
mΩ
mΩ
S
0.78
450
VGS=0V, VDS=30V, f=1MHz
µA
2.3
VGS=4.5V, I D=3A
VSD
Units
V
VDS=60V, VGS=0V
VGS(th)
IS
Max
60
IGSS
RDS(ON)
Typ
1
V
3
A
540
pF
60
pF
25
pF
1.65
2
Ω
9.5
11.5
nC
4.3
5.5
nC
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
2.2
tD(on)
Turn-On DelayTime
5.1
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
1.6
nC
nC
7
ns
VGS=10V, VDS=30V, RL=7Ω,
RGEN=3Ω
2.6
4
ns
15.9
20
ns
2
3
ns
25.1
35
28.7
ns
nC
trr
Body Diode Reverse Recovery Time
IF=4.2A, dI/dt=100A/µs
Qrr
Body Diode Reverse Recovery Charge
IF=4.2A, dI/dt=100A/µs
A: The value of R θJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The value in
any given application depends on the user's specific board design. The current rating is based on the t≤ 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA curve
provides a single pulse rating.
F.The current rating is based on the t ≤ 10s thermal resistance rating.
Rev0: Feb. 2007
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE
Alpha & Omega Semiconductor, Ltd.
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AO6420
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: N-CHANNEL
20
15
10.0V
5.0V
VDS=5V
10
4.5V
125°C
ID(A)
ID (A)
15
10
4.0V
5
5
25°C
VGS=3.5V
0
0
1
2
3
4
0
5
2
2.5
VDS (Volts)
Fig 1: On-Region Characteristics
4
4.5
5
2
Normalized On-Resistance
90
80
RDS(ON) (mΩ)
3.5
VGS(Volts)
Figure 2: Transfer Characteristics
100
VGS=4.5V
70
60
50
VGS=10V
40
30
20
0
5
10
15
VGS=10
ID=4.2A
1.8
1.6
VGS=4.5V
1.4
ID=3A
1.2
1
0.8
20
0
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
1.0E+01
160
ID=4.2A
140
1.0E+00
125°C
1.0E-01
100
IS (A)
120
RDS(ON) (mΩ)
3
125°C
1.0E-02
25°C
1.0E-03
80
1.0E-04
25°C
60
1.0E-05
40
0.0
2
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics
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AO6420
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: N-CHANNEL
800
10
VDS=30V
ID= 4.2A
Capacitance (pF)
VGS (Volts)
8
6
4
2
600
Ciss
400
Coss
200
Crss
0
0
0
2
4
6
8
10
0
Qg (nC)
Figure 7: Gate-Charge Characteristics
30
40
50
60
40
TJ(Max)=150°C
TA=25°C
10.0
10µs
RDS(ON)
limited
1.0
0.1
100µ
1ms
10ms
0.1s
1s
DC
TJ(Max)=150°C
TA=25°C
30
Power (W)
ID (Amps)
20
VDS (Volts)
Figure 8: Capacitance Characteristics
100.0
0.1
1
VDS (Volts)
10
0
0.001
100
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=110°C/W
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
10
20
10
10s
0.0
0.01
ZθJA Normalized Transient
Thermal Resistance
10
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
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