3.2x2.4mm SMD CHIP LED LAMP APD3224SYC SUPER BRIGHT YELLOW Features Description !3.2x2.4mm SMT LED, 2.4mm THICKNESS. The Super Bright Yellow source color devices !LOW POWER CONSUMPTION. are made with DH InGaAlP on GaAs substate !IDEAL FOR BACKLIGHT AND INDICATOR. Light Emitting Diode. !VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 1500PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAB0026 APPROVED : J. Lu REV NO: V.3 CHECKED : Allen Liu DATE:MAR/22/2003 DRAWN:D.L.HUANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e APD3224SYC Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT YELLOW (InGaAlP) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 180 70 0 20 ° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er D ev i c e λpeak Peak Wavelength Super Bright Yellow λD Dominate Wavelength ∆λ1/2 Ty p . Max . Un it s Tes t Co n d it io n s 590 nm I F =20mA Super Bright Yellow 588 nm I F =20mA Spectral Line Half-width Super Bright Yellow 28 nm I F =20mA C Capacitance Super Bright Yellow 25 pF VF=0V;f=1MHz VF Forward Voltage Super Bright Yellow 2.0 2.5 V I F =20mA IR Reverse Current Super Bright Yellow 10 uA V R = 5V Absolute Maximum Ratings at T)=25°°C P ar am e t e r Su p er B r ig h t Yello w Un it s Power dissipation 125 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAB0026 APPROVED : J. Lu REV NO: V.3 CHECKED : Allen Liu DATE:MAR/22/2003 DRAWN:D.L.HUANG PAGE: 2 OF 4 Super Bright Yellow SPEC NO: DSAB0026 APPROVED : J. Lu APD3224SYC REV NO: V.3 CHECKED : Allen Liu DATE:MAR/22/2003 DRAWN:D.L.HUANG PAGE: 3 OF 4 APD3224SYC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAB0026 APPROVED : J. Lu REV NO: V.3 CHECKED : Allen Liu DATE:MAR/22/2003 DRAWN:D.L.HUANG PAGE: 4 OF 4