IXYS IXBX75N170

Preliminary Technical Information
BiMOSFETTM Monolithic
Bipolar MOS Transistor
IXBK75N170
IXBX75N170
VCES
IC110
VCE(sat)
= 1700V
= 75A
≤ 3.1V
TO-264 (IXBK)
Symbol
Test Conditions
Maximum Ratings
VCES
TJ = 25°C to 150°C
1700
V
VCGR
TJ = 25°C to 150°C, RGE = 1MΩ
1700
V
VGES
Continuous
±20
V
VGEM
Transient
±30
V
IC25
ILRMS
IC110
ICM
TC
TC
TC
TC
200
160
75
580
A
A
A
A
SSOA
VGE = 15V, TVJ = 125°C, RG = 1Ω
ICM = 150
A
(RBSOA)
Clamped Inductive Load
PC
TC = 25°C
= 25°C (Chip Capabilitty)
= 25°C (Lead RMS Limit)
= 110°C
= 25°C, 1ms
G
C
PLUS247TM (IXBX)
G
VCE < 0.8 • VCES
1040
W
-55 ... +150
°C
TJM
150
°C
Tstg
-55 ... +150
°C
300
260
°C
°C
1.13/10
20..120/4.5..27
Nm/lb.in.
N/lb.
10
6
g
g
TJ
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062 in.) from Case for 10
Md
FC
Mounting Torque (TO-264 )
Mounting Force (PLUS247 )
Weight
TO-264
PLUS247
Tab
E
C
E
G = Gate
E = Emitter
Tab
C = Collector
Tab = Collector
Features
z
z
z
z
International Standard Packages
High Blocking Voltage
High Current Handling Capability
Anti-Parallel Diode
Advantages
z
z
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVCES
IC
= 250μA, VGE = 0V
1700
VGE(th)
IC
= 1.5mA, VCE = VGE
2.5
ICES
VCE = 0.8 • VCES, VGE = 0V
V
5.5
TJ = 125°C
IGES
VCE = 0V, VGE = ± 20V
VCE(sat)
IC
= IC110, VGE = 15V, Note 1
TJ = 125°C
© 2009 IXYS CORPORATION, All Rights Reserved
z
High Power Density
Low Gate Drive Requirement
Intergrated Diode Can Be Used for
Protection
2.6
3.1
V
Applications
25 μA
z
2 mA
z
±100 nA
z
3.1
V
V
z
z
Capacitor Discharge
AC Switches
Switch-Mode and Resonant-Mode
Power Supplies
UPS
AC Motor Drives
DS100167A(10/09)
IXBK75N170
IXBX75N170
Symbol Test Conditions
(TJ = 25°C Unless Otherwise Specified)
gfS
Characteristic Values
Min.
Typ.
Max.
IC = IC110, VCE = 10V, Note 1
34
TO-264 AA ( IXBK) Outline
56
S
6930
pF
400
pF
Cres
150
pF
Qg
350
nC
Cies
Coes
Qge
VCE = 25V, VGE = 0V, f = 1MHz
IC = IC110, VGE = 15V, VCE = 0.5 • VCES
Qgc
td(on)
tr
td(off)
tf
td(on)
tr
td(off)
tf
Resistive load, TJ = 25°C
IC = IC110, VGE = 15V
RG = 1Ω, VCE = 0.5 • VCES
Resistive load, TJ = 125°C
IC = IC110, VGE = 15V
RG = 1Ω, VCE = 0.5 • VCES
50
nC
160
nC
46
160
260
440
ns
ns
ns
ns
47
230
260
580
ns
ns
ns
ns
0.12 °C/W
RthJC
RthCS
0.15
°C/W
Reverse Diode
Symbol Test Conditions
(TJ = 25°C Unless Otherwise Specified)
VF
Characteristic Values
Min.
Typ.
Max
IF = IC110, VGE = 0V, Note 1
trr
IRM
QRM
Note
3.0
1.5
50
38.2
IF = 37A, VGE = 0V, -diF/dt = 100A/μs
VR = 100V, VGE = 0V
Terminals:
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
.190
.202
.100
.114
.079
.083
.044
.056
.094
.106
.114
.122
.021
.033
1.020
1.030
.780
.786
.215 BSC
.000
.010
.000
.010
.800
.820
.090
.102
.125
.144
.239
.247
.330
.342
.150
.170
.070
.090
.238
.248
.062
.072
V
PRELIMINARY TECHNICAL INFORMATION
5,049,961
5,063,307
5,187,117
4.82
5.13
2.54
2.89
2.00
2.10
1.12
1.42
2.39
2.69
2.90
3.09
0.53
0.83
25.91 26.16
19.81 19.96
5.46 BSC
0.00
0.25
0.00
0.25
20.32 20.83
2.29
2.59
3.17
3.66
6.07
6.27
8.38
8.69
3.81
4.32
1.78
2.29
6.04
6.30
1.57
1.83
Inches
Min.
Max.
μs
A
μC
Additional provisions for lead-to-lead isolation are required at VCE >1200V.
4,931,844
5,017,508
5,034,796
A
A1
A2
b
b1
b2
c
D
E
e
J
K
L
L1
P
Q
Q1
R
R1
S
T
Millimeter
Min.
Max.
PLUS247TM (IXBX) Outline
1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or moreof the following U.S. patents: 4,850,072
4,881,106
Dim.
6,404,065 B1
6,534,343
6,583,505
Dim.
1 - Gate
2 - Drain (Collector)
3 - Source (Emitter)
Millimeter
Min. Max.
Inches
Min. Max.
A
A1
A2
4.83
2.29
1.91
5.21
2.54
2.16
.190
.090
.075
.205
.100
.085
b
b1
b2
1.14
1.91
2.92
1.40
2.13
3.12
.045
.075
.115
.055
.084
.123
C
D
E
e
L
L1
Q
R
0.61
0.80
20.80 21.34
15.75 16.13
5.45 BSC
19.81 20.32
3.81
4.32
5.59
6.20
4.32
4.83
.024 .031
.819 .840
.620 .635
.215 BSC
.780 .800
.150 .170
.220 0.244
.170 .190
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXBK75N170
IXBX75N170
Fig. 1. Output Characteristics
@ 25ºC
160
320
VGE = 25V
19V
15V
13V
11V
140
120
240
9V
100
80
60
40
0
0
1.0
1.5
2.0
2.5
3.0
9V
120
40
3.5
4.0
7V
4.5
0
2
4
6
8
10
12
14
VCE - Volts
VCE - Volts
Fig. 3. Output Characteristics
@ 125ºC
Fig. 4. Dependence of VCE(sat) on
Junction Temperature
160
18
125
150
VGE = 15V
1.6
1.5
VCE(sat) - Normalized
120
16
1.7
VGE = 25V
19V
15V
13V
11V
140
IC - Amperes
160
20
0.5
11V
200
80
7V
0.0
VGE = 25V
17V
15V
13V
280
IC - Amperes
IC - Amperes
Fig. 2. Extended Output Characteristics
@ 25ºC
100
9V
80
60
7V
40
I
1.4
C
= 150A
1.3
1.2
I
1.1
C
= 75A
1.0
0.9
20
I
0.8
5V
0
C
= 37.5A
0.7
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
-50
-25
0
25
VCE - Volts
50
75
100
TJ - Degrees Centigrade
Fig. 5. Collector-to-Emitter Voltage
vs. Gate-to-Emitter Voltage
Fig. 6. Input Admittance
200
5.5
180
TJ = 25ºC
5.0
160
140
4.0
I
C
IC - Amperes
VCE - Volts
4.5
= 150A
3.5
75A
3.0
120
100
TJ = 125ºC
25ºC
- 40ºC
80
60
2.5
40
37.5A
2.0
20
0
1.5
5
7
9
11
13
15
17
VGE - Volts
© 2009 IXYS CORPORATION, All Rights Reserved
19
21
23
25
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
VGE - Volts
IXYS REF: B_75N170(8T)7-01-09
IXBK75N170
IXBX75N170
Fig. 8. Forward Voltage Drop of
Intrinsic Diode
Fig. 7. Transconductance
90
300
TJ = - 40ºC
80
125ºC
250
70
TJ = 25ºC
25ºC
200
IF - Amperes
g f s - Siemens
60
50
40
30
TJ = 125ºC
150
100
20
50
10
0
0
0
20
40
60
80
100
120
140
160
180
200
220
0.4
0.6
0.8
1.0
1.2
1.6
1.8
2.0
2.2
2.4
Fig. 10. Capacitance
Fig. 9. Gate Charge
16
100,000
f = 1 MHz
VCE = 850V
14
I C = 75A
Capacitance - PicoFarads
I G = 10mA
12
VGE - Volts
1.4
VF - Volts
IC - Amperes
Cies
10,000
10
8
6
4
1,000
Coes
100
Cres
2
10
0
0
40
80
120
160
200
240
280
320
0
360
5
10
15
20
25
30
35
40
VCE - Volts
QG - NanoCoulombs
Fig. 12. Maximum Transient Thermal Impedance
Fig. 11. Reverse-Bias Safe Operating Area
160
1.000
140
Z(th)JC - ºC / W
IC - Amperes
120
100
80
60
40
20
0
200
0.100
0.010
TJ = 125ºC
RG = 1Ω
dV / dt < 10V / ns
400
600
800
1000
1200
1400
1600
1800
VCE - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
0.001
0.00001
0.0001
0.001
0.01
Pulse Width - Seconds
0.1
1
10
IXBK75N170
IXBX75N170
Fig. 14. Resistive Turn-on
Rise Time vs. Collector Current
Fig. 13. Resistive Turn-on
Rise Time vs. Junction Temperature
450
400
RG = 1Ω , VGE = 15V
RG = 1Ω , VGE = 15V
400
VCE = 850V
VCE = 850V
I
320
C
350
= 150A
t r - Nanoseconds
t r - Nanoseconds
360
280
240
TJ = 125ºC
300
250
200
TJ = 25ºC
150
200
100
I C = 75A
160
50
120
0
25
35
45
55
65
75
85
95
105
115
30
125
40
50
60
70
80
TJ - Degrees Centigrade
I C = 150A
500
700
70
600
65
400
60
I C = 75A
300
55
200
100
1
2
3
4
5
6
7
8
9
t d(off) - - - -
150
VCE = 850V
280
I C = 75A
500
260
400
240
300
220
I C = 150A
50
200
45
100
200
25
10
35
45
55
65
75
85
95
105
115
180
125
TJ - Degrees Centigrade
Fig. 18. Resistive Turn-off
Switching Times vs. Gate Resistance
1000
t d(off) - - - -
900
320
800
280
tf
t d(off) - - - -
480
TJ = 125ºC, VGE = 15V
440
VCE = 850V
600
400
I C = 75A
600
260
500
240
400
220
300
200
200
240
180
100
200
160
150
0
200
TJ = 125ºC, 25ºC
100
30
40
50
60
70
80
90
100
110
120
IC - Amperes
© 2009 IXYS CORPORATION, All Rights Reserved
130
140
500
360
400
320
300
I
C
280
= 150A
t d(off) - Nanoseconds
700
520
700
300
VCE = 850V
t f i - Nanoseconds
tf
RG = 1Ω, VGE = 15V
340
t d(off) - Nanoseconds
t f - Nanoseconds
140
300
RG = 1Ω, VGE = 15V
Fig. 17. Resistive Turn-off
Switching Times vs. Collector Current
800
130
320
tf
RG - Ohms
900
120
t d(off) - Nanoseconds
VCE = 850V
75
t d(on) - Nanoseconds
t r - Nanoseconds
t d(on) - - - -
TJ = 125ºC, VGE = 15V
600
110
800
80
t f - Nanoseconds
800
tr
100
Fig. 16. Resistive Turn-off
Switching Times vs. Junction Temperature
Fig. 15. Resistive Turn-on
Switching Times vs. Gate Resistance
700
90
IC - Amperes
160
1
2
3
4
5
6
7
8
9
10
RG - Ohms
IXYS REF: B_75N170(8T)7-01-09