IXYS IXEL40N400

IXEL40N400
Very High Voltage
IGBT
VCES
IC110
VCE(sat)
tfi(typ)
( Electrically Isolated Tab)
=
=
≤
=
4000V
40A
3.2V
425ns
ISOPLUS i5-PakTM
Symbol
Test Conditions
VCES
TJ = 25°C to 150°C
VGES
Maximum Ratings
4000
V
Continuous
±20
V
VGEM
Transient
±30
V
IC25
IC110
TC = 25°C
TC = 110°C
90
40
A
A
ICM
Pulse Width Limited by TJM, 1ms, VGE = 25V
400
A
PC
TC = 25°C
380
W
TJ
- 40 ... +150
°C
TJM
150
°C
Tstg
- 40 ... +150
°C
300
260
°C
°C
4000
V~
30..170 / 7..36
Nm/lb-in.
8
g
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062 in.) from Case for 10s
VISOL
IISOL < 1mA, 50/60 Hz, t = 1 minute
FC
Mounting Force
Weight
G
E
C
G = Gate
E = Emitter
Isolated Tab
C = Collector
Features
Silicon Chip on Direct-Copper Bond
(DCB) Substrate
Isolated Mounting Surface
4000V~ Electrical Isolation
UL Recognized Package
High Peak Current Capability
Low Saturation Voltage
Molding Epoxies Meet UL 94 V-0
Flammability Classification
Advantages
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
VGE(th)
IC
5.5
ICES
VCE = VCES, VGE = 0V
IGES
VCE = 0V, VGE = ±20V
VCE(sat)
IC
= 10mA, VCE = VGE
Note 2, TJ = 125°C
= IC110, VGE = 15V, Note 1
TJ = 125°C
© 2012 IXYS CORPORATION, All Rights Reserved
7.0
V
100
μA
mA
±500
nA
3.2
V
V
1.5
2.4
3.0
High Power Density
Easy to Mount
Applications
Capacitor Discharge
Pulser Circuits
DS99385B(09/12)
IXEL40N400
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
IC = IC110, VCE = 10V, Note 1
14
ISC
IC = IC110, VCC = 3400V, VCM < 4000V
ISOPLUS i5-PakTM HV Outline
E
24
S
200
A
VGE = 15V, tSC < 10μs
4
Cies
6040
278
pF
120
pF
RGint
5.2
Ω
Qg(on)
275
nC
63
nC
Qgc
134
nC
td(on)
tri
Eon
td(off)
tfi
160
100
55
630
425
ns
ns
mJ
ns
ns
165
mJ
155
105
85
715
455
205
ns
ns
mJ
ns
ns
mJ
Qge
Eoff
td(on)
tri
Eon
td(off)
tfi
Eoff
RthJC
RthCK
Notes:
VCE = 25V, VGE = 0V, f = 1MHz
IC = IC110, VGE = 15V, VCE = 1000 V
Inductive load, TJ = 25°C
IC = IC110, VGE = 15V
VCE = 2800V, RG = 33Ω
Note 3
Inductive load, TJ = 125°C
IC = IC110, VGE = 15V
VCE = 2800V, RG = 33Ω
Note 3
(Pressure Mount)
0.15
1 2
pF
Cres
Coes
S
0.26 °C/W
°C/W
+
3
c
e1
e1
b3
b2
Pin 1
Pin 2
Pin 3
Tab 4
SYM
INCHES
MIN
MAX
b1
e
= Gate
= Emitter
= Collector
= Isolated
MILLIMETER
MIN
MAX
A
0.190
0.205
4.83
5.21
A1
0.102
0.118
2.59
3.00
A2
0.046
0.055
1.17
1.40
b
0.045
0.055
1.14
1.40
b1
0.063
0.072
1.60
1.83
b2
0.058
0.068
1.47
1.73
c
0.020
0.029
0.51
0.74
D
1.020
1.040
25.91
26.42
E
0.770
0.799
19.56
20.29
e
0.150 BSC
e1
L
0.450 BSC
0.780
0.820
3.81 BSC
L1
0.080
0.102
2.03
2.59
Q
0.210
0.235
5.33
5.97
11.43 BSC
19.81
20.83
Q1
0.490
0.513
12.45
13.03
R
0.150
0.180
3.81
4.57
R1
0.100
0.130
2.54
3.30
S
0.668
0.690
16.97
17.53
T
0.801
0.821
20.34
20.85
U
0.065
0.080
1.65
2.03
1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
2. Part must be heatsunk for high-temp ICES measurement.
3. Switching times & energy losses may increase for higher VCE(Clamp), TJ or RG.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXEL40N400
Fig. 1. Output Characteristics @ T J = 25ºC
Fig. 2. Extended Output Characteristics @ T J = 25ºC
80
300
VGE = 25V
21V
19V
17V
15V
70
250
13V
17V
200
50
IC - Amperes
IC - Amperes
60
VGE = 25V
21V
19V
11V
40
30
15V
150
13V
100
20
9V
10
11V
50
9V
0
0
0.5
1
1.5
2
2.5
3
3.5
0
4
0
5
10
15
VCE - Volts
80
2.0
VGE = 25V
21V
19V
17V
15V
30
VGE = 15V
1.8
13V
50
VCE(sat) - Normalized
IC - Amperes
60
25
Fig. 4. Dependence of VCE(sat) on
Junction Temperature
Fig. 3. Output Characteristics @ T J = 125ºC
70
20
VCE - Volts
11V
40
30
9V
20
I
1.6
= 80A
C
1.4
1.2
I
= 40A
C
1.0
0.8
I
0.6
10
C
= 20A
7V
0.4
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
-50
5
-25
0
25
VCE - Volts
Fig. 5. Collector-to-Emitter Voltage vs.
Gate-to-Emitter Voltage
5.5
100
125
150
Fig. 6. Input Admittance
180
TJ = 25ºC
5.0
160
4.5
140
IC - Amperes
VCE - Volts
75
200
6.0
4.0
3.5
50
TJ - Degrees Centigrade
I
C
= 80A
3.0
2.5
120
100
80
TJ = - 40ºC
25ºC
125ºC
60
40A
2.0
40
1.5
20
20A
1.0
0
9
11
13
15
17
19
VGE - Volts
© 2012 IXYS CORPORATION, All Rights Reserved
21
23
25
5
6
7
8
9
10
11
VGE - Volts
12
13
14
15
16
IXEL40N400
Fig. 8. Gate Charge
Fig. 7. Transconductance
16
45
TJ = - 40ºC
40
35
I C = 40A
I G = 10mA
12
25ºC
30
g f s - Siemens
VCE = 1000V
14
VGE - Volts
125ºC
25
20
10
8
6
15
4
10
2
5
0
0
0
50
100
150
0
200
40
80
160
200
240
280
Fig. 10. Reverse-Bias Safe Operating Area
Fig. 9. Capacitance
100,000
180
f = 1 MHz
160
10,000
140
Cies
IC - Amperes
Capacitance - PicoFarads
120
QG - NanoCoulombs
IC - Amperes
1,000
Coes
120
100
80
60
100
Cres
10
0
5
10
15
20
25
30
35
40
40
TJ = 125ºC
20
RG = 33Ω
dv / dt < 10V / ns
0
500
1000
1500
2000
2500
3000
3500
4000
VCE - Volts
VCE - Volts
Fig. 11. Maximum Transient Thermal Impedance
Z(th)JC - ºC / W
1
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
1
10
100
IXEL40N400
Fig. 12. Typ. Swicthing Characteristics vs.
Collector Current
Fig. 13. Typ. Swicthing Characteristics vs.
Gate Resistor
0.30
0.40
0.36
VCC = 2800V, RG = 33Ω
0.32
VGE = 15V, TJ = 125ºC
0.25
E on, Eoff - Joule
0.28
E on, Eoff - Joule
Eoff
Eoff
0.24
0.20
0.16
Eon
0.12
0.08
0.20
0.15
0.10
Eon
VCC = 2800V, IC = 40A
0.05
VGE = 15V, TJ = 125ºC
0.04
0.00
0.00
0
10
20
30
40
50
60
IC - Amperes
© 2012 IXYS CORPORATION, All Rights Reserved
70
80
90
0
50
100
150
200
250
RG - Ohms
IXYS REF: EL_40N400 9-27-12