LAA110 Dual Single-Pole, Normally Open OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 120 35 Units VP mArms / mADC Features • 3750Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • Arc-Free With No Snubbing Circuits • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Machine Insertable, Wave Solderable • Surface Mount Tape & Reel Packages Available Description LAA110 is a dual 1-Form-A Solid State Relay that has two independently controlled, optically coupled MOSFET switches. The output MOSFET switches and photovoltaic die employ optically coupled MOSFET technology to provide 3750 Vrms of input-to-output isolation. The relay outputs, that use patented OptoMOS architecture, are controlled by a highly efficient GaAlAS infrared LED. This dual pole OptoMOS relay provides a more compact design solution than discrete single-pole relays in a variety of applications, and saves board space by incorporating both switches in a single 8-Pin package. Approvals Applications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls • UL Certified Component: File E76270 • CSA Certified Component: Certificate 1175739 • EN/IEC 60950-1 Certified Component: TUV Certificate B 10 05 49410 006 Ordering Information Part # LAA110 LAA110S LAA110STR LAA110P LAA110PTR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1,000/Reel) 8-Pin Flat Pack (50/Tube) 8-Pin Flat Pack (1,000/Reel) Pin Configuration + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% Pb DS-LAA110-R11 10% ILOAD e3 ton www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION LAA110 Absolute Maximum Ratings @ 25°C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 2 Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Derate linearly 1.33 mW / °C Derate linearly 6.67 mW / °C Electrical Characteristics @ 25°C Parameter Output Characteristics Load Current, Continuous 1 Peak Load Current On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 2 Conditions Symbol Min Typ Max Units t=10ms IL=120mA VL=350VP IL ILPK RON ILEAK - 25 - 120 ±350 35 1 mArms / mADC mAP VL=50V, f=1MHz ton toff COUT - 25 3 3 - ms ms pF IL=120mA IF=5mA VR=5V IF VF IR 0.4 0.9 - 0.7 1.2 - 5 1.4 10 mA mA V A - CI/O - 3 - pF IF=5mA, VL=10V A If both poles operate the load current must be derated so as not to exceed the package power dissipation value. Measurement taken within 1 second of on-time. www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION LAA110 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* 25 25 20 15 10 5 20 15 10 5 1.17 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) 0.56 Typical IF for Switch Operation (N=50, IL=120mADC) 25 Device Count (N) 15 10 5 0 0.65 0.74 0.83 0.92 Turn-On (ms) 1.01 0.65 0.91 1.17 1.43 1.69 LED Current (mA) 10 5 0.04 0.08 0.12 0.16 0.20 Turn-Off (ms) 0.24 0.28 Typical On-Resistance Distribution (N=50, IL=120mADC) 35 30 20 15 10 5 25 20 15 10 5 0 0.39 15 1.1 Typical IF for Switch Dropout (N=50, IL=120mADC) 25 20 20 0 0 0 Device Count (N) 25 Device Count (N) Device Count (N) Device Count (N) 30 Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) Device Count (N) 35 Typical LED Forward Voltage Drop (N=50, IF=5mA) 0 1.95 0.39 0.65 0.91 1.17 1.43 LED Current (mA) 1.69 22.9 1.95 23.3 23.7 24.1 24.5 24.9 On-Resistance (:) 25.3 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 420 IF=50mA 1.2 IF=10mA IF=5mA 1.0 0.8 -40 -20 0 20 40 60 Temperature (ºC) 80 100 120 450 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off vs. LED Forward Current (IL=50mADC) 0.7 0.6 Turn-Off (ms) 1.6 1.4 430 435 440 445 Blocking Voltage (VP) Typical Turn-On vs. LED Forward Current (IL=50mADC) 1.8 Turn-On (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 425 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R11 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LAA110 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 I F =5mA I F =10mA 50 40 I F =5mA I F =10mA Dual Pole 30 20 Single Pole Turn-On (ms) 10 0 -40 0 20 40 60 Temperature (ºC) 80 100 Typical On-Resistance vs. Temperature (IL=50mADC Instantaneous, IF=5mA) 3.0 0 20 40 60 80 50 40 30 20 0 -20 0 20 40 60 80 80 3.0 1.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 -20 -40 100 0 20 40 60 Typical Load Current vs. Load Voltage (IF=5mA) Typical Blocking Voltage vs. Temperature 40 20 0 Load Current (mA) IF=10mA IF=5mA IF=10mA IF=5mA Dual Pole 20 40 60 80 100 120 50 0 -50 -100 -2 -1 0 1 Load Voltage (V) Load Current (A) Leakage (PA) 0.012 0.010 0.008 0.006 0.004 0.002 0 100 420 415 410 405 400 20 40 60 Temperature (ºC) 80 100 2 3 -20 -40 0 20 40 60 Temperature (ºC) Energy Rating Curve 0.014 -20 80 425 395 -3 Typical Leakage vs. Temperature Measured Across Pins 5&6 or 7&8 (VL=350V) 0 -40 100 430 Temperature (ºC) 0.016 80 435 100 -150 0 120 2.0 Maximum Load Current vs. Temperature 80 100 2.5 Temperature (ºC) 100 -20 60 Temperature (ºC) Single Pole -40 40 Typical IF for Switch Dropout vs. Temperature (IL=50mADC) 1.5 150 60 20 Temperature (ºC) 160 120 0 Typical IF for Switch Operation vs. Temperature (IL=50mADC) -40 180 140 -20 Temperature (ºC) 2.0 100 IF=5mA -40 0 -40 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 100 0.5 10 Typical Turn-Off vs. Temperature (IL=50mADC) Temperature (ºC) 2.5 LED Current (mA) On-Resistance (:) 60 Load Current (mA) -20 -40 LED Current (mA) 70 -20 IF=5mA IF=10mA IF=20mA Blocking Voltage (VP) On-Resistance (:) 60 Typical Turn-On vs. Temperature (IL=50mADC) Turn-Off (ms) Typical On-Resistance vs. Temperature (IL=120mADC) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION LAA110 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LAA110 / LAA110S / LAA110P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LAA110 / LAA110S 250ºC for 30 seconds LAA110P 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R11 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LAA110 MECHANICAL DIMENSIONS LAA110 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA110S 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA110P 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION LAA110 MECHANICAL DIMENSIONS LAA110STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=16.00 (0.63) Bo=10.30 (0.406) K0 =4.90 (0.193) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 LAA110PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-LAA110-R11 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/19/2012