LAA125 Dual Single-Pole, Normally Open OptoMOS® Relays INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 170 16 Units VP mArms / mADC Features • 3750Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • No Moving Parts • High Reliability • Arc-Free With No Snubbing Circuits • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Small 8-Pin Packages • Machine Insertable, Wave Solderable • Surface Mount and Tape & Reel Versions Available Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Description LAA125 is a 350V, 170mA, 16 dual normally open (1-Form-A) relay. It combines enhanced peak load current capability with low on-resistance. Its MOSFET switches and photovoltaic die provide 3750Vrms of input to output isolation. The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. This dual switch OptoMOS relay provides a more compact design solution than discrete single-pole relays in a variety of applications, and saves board space by incorporating two switches in a single 8-pin package. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 004 Ordering Information Part # LAA125 LAA125S LAA125STR LAA125P LAA125PTR Description 8 Pin DIP (50/Tube) 8 Pin Surface Mount (50/Tube) 8 Pin Surface Mount (1,000/Reel) 8 Pin Flat Pack (50/Tube) 8 Pin Flat Pack (1,000/Reel) Pin Configuration + Control - Switch #1 - Control - Switch #1 + Control - Switch #2 - Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% 10% ILOAD Pb DS-LAA125-R06 ton e3 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION LAA125 Absolute Maximum Ratings @ 25°C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 2 Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Derate linearly 1.33 mW / °C Derate linearly 6.67 mW / °C Electrical Characteristics @ 25°C Parameter Output Characteristics Conditions Symbol Min Typ Max Units Load Current Continuous - IL - - 170 mArms / mADC t =10ms ILPK - - ±400 On-Resistance IL=170mA RON - - 16 mAP Off-State Leakage Current VL=350VP ILEAK - - 1 A ton - - 5 toff - - 5 VL=50V, f=1MHz COUT - 50 - pF IL=170mA IF - - 5 mA - - 0.4 0.7 - mA Input Voltage Drop IF=5mA VF 0.9 1.2 1.4 V Reverse Input Current VR=5V IR - - 10 A - CI/O - 3 - pF Peak Switching Speeds Turn-On Turn-Off Output Capacitance IF=5mA, VL=10V ms Input Characteristics Input Control Current for Activation Input Control Current for Deactivation Input to Output Capacitance 2 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION LAA125 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* 25 20 15 10 5 1.17 15 10 5 Device Count (N) 15 10 5 1.7 1.8 1.9 2.0 Turn-On Time (ms) 2.1 0.30 0.42 0.54 0.66 0.78 LED Current (mA) 10 5 0.2 0.3 0.4 0.5 0.6 Turn-Off Time (ms) 0.7 0.8 Typical On-Resistance Distribution (N=50, IL=170mADC) 35 30 20 15 10 5 25 20 15 10 5 0 0 15 2.2 Typical IF for Switch Dropout (N=50, IL=170mADC) 25 20 20 0 1.6 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=170mADC) 25 Device Count (N) 20 0 0 Typical Turn-Off Time (N=50, IF=10mA, IL=120mADC) 25 Device Count (N) Device Count (N) Device Count (N) 30 25 Typical Turn-On Time (N=50, IF=10mA, IL=120mADC) Device Count (N) 35 Typical LED Forward Voltage Drop (N=50, IF=5mA) 0 0.90 0.18 0.30 0.35 0.40 0.45 LED Current (mA) 12.36 12.5 12.64 12.78 12.92 13.06 On-Resistance (:) 0.78 13.2 Typical Blocking Voltage Distribution (N=50) Device Count (N) 25 20 15 10 5 0 390 IF=50mA 1.2 IF=10mA IF=5mA 1.0 0.8 -40 -20 0 20 40 60 80 Temperature (ºC) 100 120 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) 0.60 0.55 Turn-Off Time (ms) 1.4 Turn-On Time (ms) LED Forward Voltage Drop (V) 1.6 440 Typical Turn-On Time vs. LED Forward Current (IL=170mADC) Typical LED Forward Voltage Drop vs. Temperature 1.8 400 410 420 430 Blocking Voltage (VP) 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 10 15 20 25 30 35 40 45 50 55 LED Forward Current (mA) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LAA125 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* 18 Dual Pole 16 14 Instantaneous 12 10 3.0 2.5 IF=5mA 2.0 1.5 IF=10mA 1.0 -20 0 20 40 60 80 Temperature (ºC) 100 120 -40 -20 0 20 40 60 Temperature (ºC) 80 0.3 IF=5mA 0.2 0.1 -40 150 2.8 1.4 2.4 2.0 1.6 1.2 0.8 Load Current (mA) 200 1.6 LED Current (mA) 1.7 3.2 1.2 1.0 0.8 0.6 -20 0 20 40 60 Temperature (ºC) 80 -40 100 -20 0 20 40 60 Temperature (ºC) 80 IF=10mA IF=5mA 125 Dual Pole 100 75 IF=10mA IF=5mA 0 335 330 325 320 315 310 305 -40 -20 0 20 40 60 80 Temperature (ºC) 100 120 100 100 50 0 -50 Typical Leakage vs. Temperature Measured across Pins 5&6 or 7&8 Leakage (PA) Blocking Voltage (VP) 150 80 -200 -2.0 -1.5 -1.25 -0.625 0 0.625 1.25 1.875 3.0 Load Voltage (V) 100 340 Single Pole 175 20 40 60 Temperature (ºC) Typical Load Current vs. Load Voltage (IF=5mA) Typical Blocking Voltage vs. Temperature Maximum Load Current vs. Temperature 200 0 -150 0 -40 -20 -100 0.4 0.2 0.4 Load Current (mA) 0.4 100 Typical IF for Switch Dropout vs. Temperature (IL=170mADC) Typical IF for Switch Operation vs. Temperature (IL=170mA) 3.6 0.5 0 0 -40 Typical Turn-Off Time vs. Temperature (IL=120mADC) 0.6 0.5 0 LED Current (mA) Typical Turn-On Time vs. Temperature (IL=80mADC) Turn-Off Time (ms) IF=5mA IF=10mA IF=5mA IF=10mA IF=5mA Single Pole Turn-On Time (ms) On-Resistance (:) 20 Typical On-Resistance vs. Temperature (IL=170mADC) -40 -20 0 20 40 60 80 100 10s 100s Temperature (ºC) 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 1.2 Load Current (A) 1.0 0.8 0.6 0.4 0.2 0 10Ps 100Ps 1ms 10ms 100ms 1s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION LAA125 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LAA125 / LAA125S / LAA125P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LAA125 / LAA125S 250ºC for 30 seconds LAA125P 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R06 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LAA125 MECHANICAL DIMENSIONS LAA125 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA125S 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LAA125P 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 7.620 ± 0.254 (0.300 ± 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION LAA125 MECHANICAL DIMENSIONS LAA125STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=16.00 (0.63) Bo=10.30 (0.406) K0 =4.90 (0.193) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 LAA125PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-LAA125-R06 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/19/2012