DC – 26.5 GHz SPDT GaAs MMIC Switch Technical Data HMMC-2027 Features • Outputs Terminated in 50 Ω When Off • Frequency Range: DC- 26.5␣ GHz • Insertion Loss: 2.5dB @ 26.5 GHz • Isolation: >70 dB @ 45 MHz 30 dB @ 26.5 GHz • Return Loss: 15 dB (Both Input and Selected Output) 12 dB Unselected Output • Switching Speed: <1 ns (10%-90% RF) • P-1dB: 18 dBm @ 10 MHz 27 dBm @ 2 GHz • Harmonics (DC Coupled): <-45 dBc @ 10 MHz and 5␣ dBm <-65 dBc @ 2 GHz and 5␣ dBm Description The HMMC-2027 is a GaAs monolithic microwave integrated circuit (MMIC) designed for low insertion loss and high isolation from DC to 26.5 GHz. It is intended for use as a generalpurpose, single-pole, doublethrow (SPDT), absorptive switch. Two series and two shunt MESFETs per throw provide 3 dB maximum insertion loss and 30␣ dB minimum isolation at 26.5␣ GHz. HMMC-2027 chips use through-substrate vias to provide ground connections to the chip backside and minimize the number of wire bonds required. 5965-5450E SEL2 SEL1 RF OUT2 RF OUT1 RF IN Chip Size: Chip Size Tolerance: Chip Thickness: Pad Dimensions: CHIP ID 900 x 960 µm (35.4 x 37.8 mils) ± 10 µm (± 0.4 mils) 127 ± 15 µm (5.0 ± 0.6 mils) 80 x 80 µm (3.2 x 3.2 mils), or larger Absolute Maximum Ratings[1] Symbol Parameters/Conditions Units Min. Max. V -10.5 +3 Vsel Select Voltages 1 and 2 Pin RF Input Power Top Operating Temperature °C -55 +125 TSTG Storage Temperature °C -65 +165 Tmax Maximum Assembly Temp. °C +200 dBm 15 Punsel[2] Power into Unselected Output dBm 25 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to this device. TA = 25°C except for Top, TSTG, and Tmax. 2. Operation in excess of these @ Top-max may result in permanent damage. 7-32 DC Specifications/Physical Properties, TA = 25°C Symbol Parameters and Test Conditions Units Typ. Max. µA Il Leakage Current @ -10 V Vp Pinch-Off Voltage (VSEL2 = Vp, VRFout2 = +2 V, IRFout2 = 2 mA, VSEL1 = -10 V, VRFout1 = open circuit, VRFin = GND V Breakdown Voltage (Test FET w/VD = VS = GND, IG = -50 µA) V BVgss Min. 200 -6.75 -3.00 -13.0 RF Specifications, TA = 25°C, ZO = 50 Ω, Vsel-high = 0 V, Vsel-low = -10 V Symbol BW Parameters and Test Conditions Guaranteed Operating Bandwidth Units Min. GHz DC Typ. 26.5 IL Insertion Loss, RFin to Selected RFout,f = 26.5 GHz, ON throw dB ISO Isolation, RFin to Unselected RFout,f = 26.5 GHz, OFF throw dB 27 30 ISO Isolation, RFin to Unselected RFout, f = 18 GHz, OFF throw dB 40 43 RL in Input Return Loss dB 12 15 RL out-ON Output Return Loss, ON throw dB 13 16 RL out-OFF Output Return Loss, OFF throw dB 9 12 2.5 P1 dB Input Power where IL increases by 1 dB fin = 2 GHz dBm 27 ts Switching Speed, 10% – 90% RF Envelope fin = 2 GHz ns 1 7-33 Max. 3.0 Applications Assembly Techniques The HMMC-2027 can be used in instrumentation, communications, radar, ECM, EW, and many other systems requiring SPDT switching. It can be used for pulse modulation, port isolation, transfer switching, high-speed switching, replacement of mechanical switches, and so on. Die attach should be done with conductive epoxy. Gold thermosonic bonding is recommended for all bonds. The top and bottom metallization is gold. For more detailed information see HP application note #999, “GaAs MMIC Assembly and Handling Guidelines.” GaAs MMICs are ESD sensitive. Proper precautions should be used when handling these devices. S-Parameters[1], TA = 25°C, ZO = 50 Ω, Vsel high = 0 V, Vsel low = -10 V Freq. GHz S11 0.5 0.5 1.5 4.0 6.5 9.0 11.5 14.0 16.5 19.0 21.5 24.0 26.5 -26.41 0.048 -57.11 -18.28 0.12 -7.04 -18.53 0.12 -13.70 -18.92 0.11 -27.64 -19.43 0.11 -45.02 -20.57 0.09 -64.07 -21.85 0.08 -2.59 -23.10 0.07 258.44 -24.05 0.06 235.82 -24.59 0.06 224.56 -25.42 0.05 206.39 -24.66 0.06 209.77 -21.90 0.08 223.86 dB Mag. Ang. S21 S31 S22 S33 (Insertion Loss) (Isolation) (ON Throw) (OFF Throw) dB -1.08 -1.33 -1.35 -1.41 -1.47 -1.56 -1.62 -1.74 -1.88 -1.99 -2.10 -2.10 -2.39 Mag. Ang. 0.88 0.86 0.86 0.85 0.84 0.84 0.83 0.82 0.81 0.80 0.79 0.78 0.76 -49.06 -8.52 -14.62 -24.53 -39.56 -55.13 -71.03 -29.63 258.60 242.13 227.84 209.72 191.82 dB dB -67.74 -71.40 -61.02 -51.67 -49.50 -46.87 -44.71 -42.30 -41.74 -37.07 -40.39 -34.46 -31.38 -28.40 -18.44 -18.46 -18.75 -19.10 -19.72 -20.91 -22.41 -24.17 -27.09 -28.85 -24.31 -19.43 Mag. Ang. 0.03 0.12 0.12 0.12 0.11 0.10 0.09 0.08 0.06 0.04 0.04 0.06 0.11 -47.94 -9.89 -19.75 -38.78 -63.22 15.79 243.63 217.48 179.74 133.20 68.10 6.26 -33.31 dB Mag. Ang. -32.26 -16.79 -16.47 -15.36 -14.55 -14.28 -13.84 -13.53 -12.95 -12.76 -13.12 -12.11 -12.03 0.024 0.14 0.15 0.17 0.19 0.19 0.20 0.21 0.23 0.23 0.22 0.25 0.25 47.18 173.87 171.75 168.03 152.55 136.68 121.81 106.44 92.94 74.01 68.84 54.32 38.26 Note: 1. Three-port-wafer-probed data: Port 1 = RF Input, Port 2 = Selected RF Output (i.e., ON throw), and Port 3 = Unselected RF Output (i.e., OFF throw). 7-34 RF IN RF OUT1 RF OUT2 SEL2 SEL1 Figure 1. HMMC-2027 Schematic. Recommended Operating Conditions, TA = 25°C Select Line RF Path SEL1 SEL2 RF IN to RF OUT1 RF IN to RF OUT2 -10 V 0V Isolated Low Loss 0V -10 V Low Loss Isolated 7-35 HMMC-2027 Typical Performance 0 INPUT RETURN LOSS (dB) 0 -20 S21 -2 -3 S31 -40 -60 -80 -4 -5 0.045 26.5 -100 0.045 Figure 2. Insertion Loss[1] vs. Frequency. 26.5 -50 GAIN COMPRESSION (dB) 3 GHz OUTPUT RETURN LOSS (dB) -32 Figure 4. Input Return Loss[1] vs. Frequency. 0 -6 S33 -18 S22 -30 0.045 S11 -24 FREQUENCY (GHz) Figure 3. Input-to-Output Isolation[1] vs. Frequency. 0 -24 -16 FREQUENCY (GHz) FREQUENCY (GHz) -12 -8 -40 0.045 26.5 26.5 FREQUENCY (GHz) Figure 5. Output Return Loss[1] vs. Frequency. Pin = 5 dBm 1 GHz -1 -2 300 MHz 100 MHz -3 -4 -5 17 HARMONICS (dBc) -1 ISOLATION (dB) INSERTION LOSS (dB) 0 -60 Second -70 -80 Third 50 MHz 19 21 23 25 27 POWER INPUT (dBm) Figure 6. Gain Compression[2] vs. Power Input. Notes: 1. Data obtained from wafer-probed measurements. 2. All compression and harmonic data measured on individual device mounted in an HP83040 Series Modular Microcircuit Package @ Tcase = 25°C. 3. Harmonic data points below -80 dBc are at or near the noise floor of the measurement system. 7-36 -90 0 1 2 3 4 5 6 FUNDAMENTAL FREQUENCY (GHz) Figure 7. Harmonics vs. Fundamental Frequency[2,3]. 7 70 375 525 830 900 960 SEL2 SEL1 RF OUT2 740 RF OUT1 RF IN CHIP ID 740 70 0 0 450 Figure 8. HMMC-2027 Bonding Pad Locations. (Dimensions in micrometers) Note: All compression data measured in an individual device mounted in an HP83040 Series Modular Microcircuit Package @ Tcase = 25°C. This data sheet contains a variety of typical and guaranteed performance data. The information supplied should not be interpreted as a complete list of circuit specifications. In this data sheet the term typical refers to the 50th percentile performance. For additional information contact your local HP sales representative. 7-37