SHENZHENFREESCALE AON5810

AON5810
Common-Drain Dual N-Channrl Enhancement
Mode Field Effect Transistor
General Description
The AON5810 uses advanced trench technology to provide excellent R DS(ON) , low gate charge and
operation with gate voltages as low as 1.8V while retaining a 12V V GS(MAX) rating. It is ESD protected. This
device is suitable for use as a uni-directional or bi- directional load switch, facilitated by its common-drain
configuration. Standard Product AON5810 is Pb-free (meets ROHS & Sony 259 specifications). AON5810L
is a Green Product ordering option. AON5810 and AON5810L are electrically identical.
Features
VDS (V) = 20V
ID = 7.7 A (VGS = 4.5V)
RDS(ON) < 18 mΩ (VGS = 4.5V)
RDS(ON) < 19 mΩ (VGS = 4.0V)
RDS(ON) < 21 mΩ (VGS = 3.1V)
RDS(ON) < 25 mΩ (VGS = 2.5V)
RDS(ON) < 40 mΩ (VGS = 1.8V)
ESD Rating: 2000V HBM
D1
DFN 2X5
S2
G2
S1
G1
D2
S2
S1
D1/D2
G1
G2
S1
S2
S2
G2
Top View
G1
S1
Bottom View
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
VGS
Gate-Source Voltage
Continuous Drain
Current RθJA=75°C/W
TA=25°C
Pulsed Drain Current B
Maximum Junction-to-Case
1/4
B
V
7.7
A
30
1.6
PDSM
W
1.0
-55 to 150
TJ, TSTG
Symbol
t ≤ 10s
Steady-State
Steady-State
Units
6.1
IDM
A
TA=25°C
Power Dissipation
RθJA=75°C/W
TA=70°C
Junction and Storage Temperature Range
Maximum
20
±12
ID
TA=70°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
S2
S1
RθJA
RθJC
Typ
30
61
4.5
°C
Max
40
75
6
Units
°C/W
°C/W
°C/W
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AON5810
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
Conditions
Min
ID=250µA, VGS=0V
TJ=55°C
5
µA
0.73
1
V
11
14
18
16
21
26
VGS=4.0V, ID=6A
11
14.5
19
VGS=3.1V, ID=6A
13
16.7
21
mΩ
VGS=2.5V, ID=5A
VGS=1.8V, ID=4A
15
20
25
mΩ
32
40
mΩ
VDS=0V, VGS=±10V
Gate-Source Breakdown Voltage
VDS=0V, IG=±250uA
±12
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250µA
0.5
ID(ON)
On state drain current
VGS=4.5V, VDS=5V
30
VGS=4.5V, ID=7.7A
TJ=125°C
gFS
Forward Transconductance
VDS=5V, ID=7.7A
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=10V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Qg(4.5V) Total Gate Charge
Qgs
Gate Source Charge
µA
10
Gate-Body leakage current
Coss
Units
V
1
IGSS
Static Drain-Source On-Resistance
Max
20
VDS=16V, VGS=0V
BVGSO
RDS(ON)
Typ
VGS=4.5V, VDS=10V, ID=7.7A
25
V
A
28
0.5
0.74
mΩ
mΩ
S
1
V
2.5
A
1360
pF
200
pF
178
pF
1.5
Ω
13.1
nC
2
nC
nC
Qgd
Gate Drain Charge
3.9
tD(on)
Turn-On DelayTime
6.2
ns
tr
Turn-On Rise Time
11
ns
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Qrr
VGS=5V, VDS=10V, RL=1.4Ω,
RGEN=3Ω
40.5
ns
10
ns
IF=7.7A, dI/dt=100A/µs
18.8
Body Diode Reverse Recovery Charge IF=7.7A, dI/dt=100A/µs
8.1
ns
nC
Body Diode Reverse Recovery Time
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The value
in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA
curve provides a single pulse rating.
Rev 1: Sep. 2007
2/4
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AON5810
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
20
30
10V
VDS=5V
25
15
4V
20
6V
ID(A)
ID (A)
2.5V
3V
15
10
125°C
VGS=2V
0.5
10
1
5
5
25°C
0
0
0
1
2
3
4
0
5
0.5
50
1.5
2
2.5
1.8
30
Normalized On-Resistance
VGS=1.8V
40
RDS(ON) (mΩ )
1
VGS(Volts)
Figure 2: Transfer Characteristics
VDS (Volts)
Fig 1: On-Region Characteristics
VGS=2.5V
20
VGS=4.5V
10
VGS=10V
VGS=2.5V
ID=5A
1.6
VGS=4.5V
ID=7.7A
1.4
1.2
VGS=10V
ID=8A
VGS=1.8V
ID=4A
1
0
0
5
10
15
20
0.8
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
0
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
1.0E+01
60
50
1.0E+00
40
1.0E-01
30
IS (A)
RDS(ON) (mΩ )
ID=7.7A
125°C
1.0E-02
25°C
1.0E-03
20
25°C
10
1.0E-04
1.0E-05
0
0
2
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
3/4
125°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
VSD (Volts)
Figure 6: Body-Diode Characteristics
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AON5810
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
5
2400
VDS=10V
ID=7.7A
A
Ciss
1800
Capacitance (pF)
VGS (Volts)
4
3
2
1200
0.5
1
600
1
Coss
0
0
3
6
9
12
Crss
0
15
0
5
10
VDS (Volts)
Figure 8: Capacitance Characteristics
Qg (nC)
Figure 7: Gate-Charge Characteristics
100.0
15
200
10µs
ID (Amps)
10.0
160
Power (W)
RDS(ON)
limited
100µs
1ms
10ms
100ms
1s
10s
1.0
DC
TJ(Max)=150°C, T A=25°C
1
10
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
120
80
40
0
0.0001
0.1
0.1
TJ(Max)=150°C
TA=25°C
100
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toCase (Note E)
Zθ JC Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJA
RθJA=75°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
0.1
PD
Ton
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note E)
4/4
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