TYSEMI WPM2341A

Product specification
WPM2341A
P-Channel Enhancement Mode Mosfet
Features
z Higher Efficiency Extending Battery Life
z Miniature SOT23-3 Surface Mount Package
z Super high density cell design for extremely low RDS (ON)
3
1
Applications
2
zDC/DC Converter
zLoad Switch
zBattery
Powered System
z
zLCD Display inverter
zPower Management in Portable, Battery Powered Products
SOT 23-3
pin connections :
PïChannel
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Steady
Parameter
Symbol
Drain-Source Voltage
VDS
-20
Gate-Source Voltage
VGS
±12
Continuous Drain Current
a
(TJ = 150 °C)
TA=25°C
TA=80°C
Pulsed Drain Current
IS
(Diode Conduction) a
Dissipation
a
TA=25°C
TA=80°C
Operating Junction and Storage
Temperature Range
PD
State
-3.5
-3.2
-2.5
G
1
3
S
-1.7
-1
1.25
0.75
Top View
Marking:
Drain
3
W41U
W
G
0.42
2
1
TJ, Tstg
- 55 to 150
D
2
A
-20
0.7
Unit
V
-4.3
IDM
Continuous Source Current
Maximum Power
ID
5s
Gate
°C
Source
W 41= Specific Device Code
a. Surface Mounted on FR4 Board using 1 in sq pad size,2oz Cu.
U = Date Code
Order information
PartNumber
WPM2341AͲ3/TR
http://www.twtysemi.com
Package
SOT23-3
Shipping [email protected]
3000Tape&Reel
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Product specification
WPM2341A
THERMAL RESISTANCE RATINGS Parameter
Symbol
Junction-to-Ambient Thermal Resistance b
t”5s
Steady State
Typical
Maximum
75
100
125
165
RșJA
Unit
°C/W
b. Surface Mounted on FR4 Board using 1 in sq pad size, 2oz Cu.
MOSFET ELECTRICAL CHARACTERISTICS(TJ =25 ć unless otherwise specified)
Parameter
Symbol
Test Condition
Off Characteristics
Drain-Source Breakdown Voltage
BVDSS
VGS = 0V,ID = -250ȝA
Zero Gate Voltage Drain Current
IDSS
VDS =-16V,VGS = 0V
Gate –Source leakage current
IGSS
VGS = f12 V ,VDS = 0V
On Characteristics
Gate Threshold Voltage
VGS(th)
VGS = VDS, ID =-250ȝA
Static Drain-Source
VGS = -4.5V, ID = -3.3A
RDS(on)
On-Resistance
VGS = -2.5V,ID = -2.8 A
Forward Transconductance
gFS
VDS = -5 V, ID = -3.3A
Dynamic Characteristics
Input Capacitance
Ciss
VDS = -6 V, VGS = 0V,
Output Capacitance
Coss
f = 1.0 MHz
Reverse Transfer Capacitance
Crss
Switching Characteristics
Turn-On Delay Time
td(on)
Turn-On Rise Time
tr
VGS = -4.5V, VDD = -6 V,
ID = -1.0A, RG=6.0ȍ,
Turn-Off Delay Time
td(off)
Turn-Off Fall Time
tf
Total Gate Charge
QG(TOT)
Threshold gate charge
QG(TH)
VDS = -6 V,ID = -3.3A,
VGS =-4.5V
Gate-Source Charge
QGS
Gate-Drain Charge
QGD
Drain-Source Diode Characteristics and Maximun Ratings
Forward Diode Voltage
VSD
VGS = 0V,IS = -1.6A
http://www.twtysemi.com
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Min
Typ
Max
Units
-1
f100
V
ȝA
nA
-20
-0.35
-0.63
52
65
3.0
8
0.2
1.2
2.2
-0.8
-1.00
61
71
V
mȍ
mȍ
S
700
160
120
pF
pF
pF
25
55
90
60
13
ns
ns
ns
ns
nC
nC
nC
nC
V
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