RoHS MCL855 D T ,. L Schottky Barrier Diode Features 1. High reliability 2. Saving space 3. Very low forward voltage 4. Micro Melf package, fits onto SOD 323/SOT 23 footprints Applications Applications where a very low forward voltage is required R T Absolute Maximum Ratings Tj=25℃ C E L Parameter Continuous reverse voltage O IC C O N Test Conditions Symbol Value Unit VR 30 V Forward continuous current Tamb=25℃ IF 200 mA Peak forward current Tamb=25℃ IFM 300 mA tp 1 s, Tamb=25℃ IFSM 600 mA Tamb=65℃ Ptot 200 mW Maximum junction temperature Tj 125 ℃ Ambient operating temperature range TA -65~+125 ℃ Storage temperature range Tstg -65~+150 ℃ Surge forward current E Power dissipation J E Maximum Thermal Resistance W Tj=25℃ Parameter Junction ambient Test Conditions Symbol Value Unit on PC board 50mm×50mm×1.6mm RthJA 250 K/W WEJ ELECTRONIC CO. Http:// www.wej.cn E-mail:[email protected] RoHS MCL855 D T ,. L Electrical Characteristics Tj=25℃ Parameter Symbol Reverse breakdown voltage Test Conditions V(BR)R Leakage current VF Pulse test tp<300μs, δ<2% Typ Max Unit 30 - - V VR=25V - - 2 μA IF=0.1mA - - 0.24 V IF=1mA - - 0.32 V IF=10mA - - 0.4 V - 0.5 - V - - 0.8 V - 10 pF - 5 ns IR=10μA (pulsed) IR Forward voltage Min IF=30mA IF=100mA Capacitance Ctot VR=1V, f=1MHz to IR =0.1mA IR R T J E IC IF=10mA to IR=10mA trr Reverse recovery time O C - - O N C E L E W WEJ ELECTRONIC CO. Http:// www.wej.cn E-mail:[email protected] RoHS MCL855 D T ,. L Ambient temperature: Ta(℃) Figure 1. Admissible power dissipation Reverse leakage current: IR(uA) vs. ambient temperature J E W R T C E L E O IC N WEJ ELECTRONIC CO. Forward voltage: VF(V) Figure 2. Typical instantaneous forward characteristics Reverse voltage: VR(V) Reverse voltage: VR(V) Figure 3. Typical reverse characteristics C O Junction capacitance : CP(pF) Power: Ptot(mW) Forward current: IF(mA) Characteristics (Tj=25℃ unless otherwise specified) Figure 4. Typical junction capacitance Http:// www.wej.cn E-mail:[email protected] RoHS MCL855 D T ,. L Dimensions in mm Cathode identification 1.35 Φ1.25 - 0.05 Glass R≥2.5 IC Glass 1.9±0.1 Glass Case Micro Melf J E R T O C O N C E L E W WEJ ELECTRONIC CO. Http:// www.wej.cn E-mail:[email protected]