ETC SUB70N04-10

SUP/SUB70N04-10
Vishay Siliconix
N-Channel 40-V (D-S), 175_C MOSFET
PRODUCT SUMMARY
V(BR)DSS (V)
40
rDS(on) (W)
ID (A)
0.010 @ VGS = 10 V
70
0.014 @ VGS = 4.5 V
58
D
TO-220AB
TO-263
G
DRAIN connected to TAB
G
D S
Top View
G D S
S
SUB70N04-10
Top View
N-Channel MOSFET
SUP70N04-10
ABSOLUTE MAXIMUM RATINGS (TC = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
40
Gate-Source Voltage
VGS
"20
TC = 25_C
Continuous Drain Current (TJ = 175_C)
_
TC = 100_C
Pulsed Drain Current
V
70
ID
47
IDM
Avalanche Current
Unit
A
140
IAR
60
Repetitive Avalanche Energya
L = 0.1 mH
EAR
180
mJ
Power Dissipation
TC = 25_C
PD
107b
W
TJ, Tstg
–55 to 175
_C
Operating Junction and Storage Temperature Range
THERMAL RESISTANCE RATINGS
Parameter
Symbol
PCB Mount (TO-263)c
Junction-to-Ambient
Junction-to-Case
Free Air (TO-220)
RthJA
RthJC
Typical
Maximum
35
40
45
50
1.2
1.4
Unit
_C/W
C/W
Notes:
a. Duty cycle v 1%.
b. See SOA curve for voltage derating.
c. Surface mounted on 1” FR4 board.
Document Number: 70783
S-05110—Rev. D, 10-Dec-01
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2-1
SUP/SUB70N04-10
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
V(BR)DSS
VGS = 0 V, ID = 250 mA
40
VGS(th)
VDS = VGS, IDS = 250 mA
1
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 40 V, VGS = 0 V
1
VDS = 40 V, VGS = 0 V, TJ = 125_C
50
VDS = 40 V, VGS = 0 V, TJ = 175_C
150
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward
Transconductancea
IDSS
ID(on)
rDS(on)
gfs
VDS = 5 V, VGS = 10 V
3
70
VGS = 10 V, ID = 30 A
0.008
0.010
0.014
0.017
VGS = 10 V, ID = 30 A, TJ = 175_C
0.0175
0.022
VGS = 4.5 V, ID = 20 A
0.011
0.014
VGS = 4.5 V, ID = 20 A, TJ = 125_C
0.019
0.024
VGS = 4.5 V, ID = 20 A, TJ = 175_C
0.024
0.031
20
nA
mA
m
A
VGS = 10 V, ID = 30 A, TJ = 125_C
VDS = 15 V, ID = 30 A
V
57
W
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reversen Transfer Capacitance
Crss
160
Total Gate Chargec
Qg
50
Gate-Source Chargec
Qgs
10
Gate-Drain Chargec
Qgd
9
Turn-On Delay Timec
td(on)
14
30
tr
VDD = 15 V, RL = 0.2 W
12
30
td(off)
ID ] 70 A, VGEN = 10 V, RG = 2.5 W
58
100
30
60
Rise Timec
Turn-Off Delay
Timec
Fall Timec
2700
VGS = 0 V, VDS = 25 V, f = 1 MHz
VDS = 15 V, VGS = 10 V, ID = 70 A
tf
600
pF
100
nC
ns
Source-Drain Diode Ratings and Characteristics (TC = 25_C)b
Continuous Current
Is
70
Pulsed Current
ISM
140
Forward Voltagea
VSD
IF = 70 A, VGS = 0 V
1.0
1.5
V
trr
IF = 70 A, di/dt = 100 A/ms
50
100
ns
Reverse Recovery Time
A
Notes:
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
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Document Number: 70783
S-05110—Rev. D, 10-Dec-01
SUP/SUB70N04-10
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
150
150
TC = –55_C
VGS = 10 thru 6 V
5V
120
I D – Drain Current (A)
I D – Drain Current (A)
120
90
4V
60
30
25_C
125_C
90
60
30
3V
0
0
0
2
4
6
8
10
0
VDS – Drain-to-Source Voltage (V)
1
2
3
4
5
6
7
VGS – Gate-to-Source Voltage (V)
Transconductance
On-Resistance vs. Drain Current
100
0.030
TC = –55_C
g fs – Transconductance (S)
r DS(on) – On-Resistance ( Ω )
25_C
80
125_C
60
40
20
0
0.024
0.018
VGS = 4.5 V
0.012
VGS = 10 V
0.006
0.000
0
20
40
60
80
100
120
0
20
40
VGS – Gate-to-Source Voltage (V)
80
100
120
ID – Drain Current (A)
Capacitance
Gate Charge
10
V GS – Gate-to-Source Voltage (V)
4000
Ciss
3200
C – Capacitance (pF)
60
2400
1600
Coss
800
Crss
0
VGS = 15 V
ID = 70 A
8
6
4
2
0
0
8
16
24
32
VDS – Drain-to-Source Voltage (V)
Document Number: 70783
S-05110—Rev. D, 10-Dec-01
40
0
10
20
30
40
50
Qg – Total Gate Charge (nC)
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SUP/SUB70N04-10
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
2.5
100
2.0
TJ = 150_C
I S – Source Current (A)
r DS(on) – On-Resistance ( Ω )
(Normalized)
VGS = 10 V
ID = 30 A
1.5
1.0
TJ = 25_C
10
0.5
0.0
–50
1
–25
0
25
50
75
100
125
150
175
0.0
0.2
TJ – Junction Temperature (_C)
0.4
0.6
0.8
1.0
1.2
1.4
VSD – Source-to-Drain Voltage (V)
THERMAL RATINGS
Maximum Drain Current vs.
Ambiemt Temperature
Safe Operating Area
200
80
10 ms
100
Limited
by rDS(on)
I D – Drain Current (A)
I D – Drain Current (A)
60
40
20
0
100 ms
10
1 ms
10 ms
100 ms
dc
TC = 25_C
Single Pulse
1
0.1
0
25
50
75
100
125
150
175
0.1
TA – Ambient Temperature (_C)
1
10
VDS – Drain-to-Source Voltage (V)
50
Normalized Thermal Transient Impedance, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–5
10–4
10–3
10–2
10–1
1
3
Square Wave Pulse Duration (sec)
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2-4
Document Number: 70783
S-05110—Rev. D, 10-Dec-01