VISHAY SUB75P03-08

SUP/SUB75P03-08
Vishay Siliconix
P-Channel 30-V (D-S), 175_C MOSFET
PRODUCT SUMMARY
V(BR)DSS (V)
rDS(on) (W)
ID (A)
–30
0.008
–75a
S
TO-220AB
TO-263
G
DRAIN connected to TAB
G
D S
Top View
G D S
D
SUB75P03-08
Top View
P-Channel MOSFET
SUP75P03-08
ABSOLUTE MAXIMUM RATINGS (TC = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Unit
VGS
"20
V
Gate-Source Voltage
–75a
TC = 25_C
Continuous Drain Current
(TJ = 175_C)
ID
TC = 125_C
Pulsed Drain Current
–200
IAR
–75
EAR
280
Avalanche Current
Repetitive Avalanche Energyb
L = 0.1 mH
–65
IDM
mJ
250d
TC = 25_C (TO-220AB and TO-263)
Power Dissipation
A
PD
TA = 25_C (TO-263)c
Operating Junction and Storage Temperature Range
W
3.7
TJ, Tstg
_C
–55 to 175
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient
Junction-to-Case
Symbol
Limit
PCB Mount (TO-263)c
RthJA
40
Free Air (TO-220AB)
RthJA
62.5
RthJC
0.6
Unit
_C/W
Notes:
a. Package limited.
b. Duty cycle v 1%.
c. When mounted on 1” square PCB (FR-4 material).
d. See SOA curve for voltage derating.
Document Number: 70772
S-05111—Rev. D, 10-Dec-99
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SUP/SUB75P03-08
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
V(BR)DSS
VGS = 0 V, ID = –250 mA
–30
VGS(th)
VDS = VGS, ID = –250 mA
–1
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = –30 V, VGS = 0 V
–1
VDS = –30 V, VGS = 0 V, TJ = 125_C
–50
VDS = –30 V, VGS = 0 V, TJ = 175_C
–150
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
IDSS
–3
ID(on)
VDS = –5 V, VGS = –10 V
VGS = –10 V, ID = –30 A
0.008
rDS(on)
VGS = –10 V, ID = –30 A, TJ = 125_C
0.012
VGS = –10 V, ID = –30 A, TJ = 175_C
0.015
gfs
VDS = –15 V, ID = –30 A
–120
V
nA
mA
m
A
30
W
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reversen Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
Gate-Drain
Chargec
Turn-On Delay Timec
Rise Timec
Turn-Off Delay
Timec
Fall Timec
6900
VGS = 0 V, VDS = –25 V, f = 1 MHz
1850
pF
570
115
VDS = –15 V, VGS = –10 V, ID = –75 A
140
30
nC
Qgd
10
td(on)
10
20
tr
VDD = –15 V, RL = 0.2 W
16
30
td(off)
ID ] –75 A, VGEN = –10 V, RG = 2.5 W
140
200
80
140
tf
ns
Source-Drain Diode Ratings and Characteristics (TC = 25_C)b
Continuous Current
Is
–75
Pulsed Current
ISM
–200
Forward Voltagea
VSD
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
A
IF = –75 A, VGS = 0 V
trr
IRM(REC)
Qrr
IF = –75 A, di/dt = 100 A/ms
m
–1.1
–1.4
V
60
100
ns
2.5
5
A
0.008
0.016
mC
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width v 300 ms, duty cycle v 2%.
c. Independent of operating temperature.
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Document Number: 70772
S-05111—Rev. D, 10-Dec-99
SUP/SUB75P03-08
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
200
150
VGS = 10, 9, 8, 7, 6 V
4V
TC = –55_C
25_C
120
I D – Drain Current (A)
I D – Drain Current (A)
160
120
5V
80
40
125_C
90
60
30
3V
0
0
2
4
6
8
0
0.0
10
1.5
VDS – Drain-to-Source Voltage (V)
3.0
4.5
6.0
VGS – Gate-to-Source Voltage (V)
Transconductance
On-Resistance vs. Drain Current
100
0.008
TC = –55_C
r DS(on)– On-Resistance ( W )
g fs – Transconductance (S)
VGS = 10 V
25_C
80
125_C
60
40
20
0
0.006
VGS = 20 V
0.004
0.002
0.000
0
15
30
45
0
60
20
40
VGS – Gate-to-Source Voltage (V)
60
80
100
ID – Drain Current (A)
Capacitance
Gate Charge
20
8500
V GS – Gate-to-Source Voltage (V)
C – Capacitance (pF)
Ciss
6500
4500
Coss
2500
Crss
500
VDS = 15 V
ID = 75 A
16
12
8
4
0
0
6
12
18
24
VDS – Drain-to-Source Voltage (V)
Document Number: 70772
S-05111—Rev. D, 10-Dec-99
30
0
30
60
90
120
150
180
210
Qg – Total Gate Charge (nC)
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SUP/SUB75P03-08
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
1.8
100
1.5
I S – Source Current (A)
r DS(on)– On-Resistance ( W )
(Normalized)
VGS = 10 V
ID = 30 A
1.2
0.9
0.6
–50
TJ = 150_C
TJ = 25_C
10
1
–25
0
25
50
75
100
125
150
175
0.0
0.3
TJ – Junction Temperature (_C)
0.6
0.9
1.2
1.5
VSD – Source-to-Drain Voltage (V)
THERMAL RATINGS
Maximum Avalanche and Drain Current
vs. Case Temperature
Safe Operating Area
100
I D – Drain Current (A)
I D – Drain Current (A)
80
60
40
100
Limited
by rDS(on)
100 ms
1 ms
10
10 ms
100 ms
dc, 1 s
TC = 25_C
Single Pulse
20
0
0
25
50
75
100
125
150
175
1
0.1
TC – Case Temperature (_C)
1.0
10.0
VDS – Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Case
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–5
10–4
10–3
10–2
10–1
1
3
Square Wave Pulse Duration (sec)
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Document Number: 70772
S-05111—Rev. D, 10-Dec-99