DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC2743GS/µPC2744GS FREQUENCY DOWN CONVERTER FOR VHF-UHF BAND TV/VCR TUNER DESCRIPTION The µPC2743GS/µPC2744GS are Silicon monolithic ICs designed for TV/VCR tuner applications. These ICs consist of a double balanced mixer (DBM), local oscillator, preamplifier for prescaler operation, IF amplifier, regulator, UHF/VHF switching circuit, and so on. These one-chip ICs cover a wide frequency band from VHF to UHF bands. These ICs are packaged in 20-pin SOP (small outline package) suitable for surface mounting. So, these ICs enable to produce economical and physically small or high-density VHF-UHF tuner and reduced the tuner development time. FEATURES • VHF to UHF band operation. • Low distortion (µPC2743GS), high conversion gain and low noise figure (µPC2744GS). • Internal double balanced mixers (DBM) minimize carrier leak. • Low oscillation frequency drift against supply voltage and temperature fluctuation due to balanced type UHF oscillator. • Low output-impedance-fluctuation due to single-end push-pull IF amplifier. • Supply voltage: 9 V • Packaged in 20-pin SOP suitable for surface mounting ORDERING INFORMATION PART NUMBER PACKAGE PACKAGING STYLE µPC2743GS µPC2744GS 20-pin plastic SOP (300 mil) Plastic magazine case µPC2743GS-E1 µPC2744GS-E1 20-pin plastic SOP (300 mil) Embossed tape 24 mm wide, 2.5 k/REEL Pin 1 indicates pull-out direction of tape Caution electro-static sensitive device The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P10192EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1993,1999 µPC2743GS/µPC2744GS PIN CONFIGURATION (Top View) 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. UOSC COLLECTOR (Tr. 1) UOSC BASE (Tr. 2) UOSC BASE (Tr. 1) UOSC COLLECTOR (TR. 2) UB OSC OUTPUT GND VHF OSC BASE (BYPASS) VHF OSC BASE VHF OSC COLLECTOR VB (BYPASS) IF OUTPUT VCC MIXER OUTPUT1 MIXER OUTPUT2 VHF RF INPUT1 VHF RF INPUT2 GND UHF RF INPUT1 UHF RF INPUT2 INTERNAL BLOCK DIAGRAM 20 19 18 17 16 15 14 13 12 11 REG. U OSC 1 2 2 V OSC 3 4 5 6 Data Sheet P10192EJ3V0DS00 7 8 9 10 µPC2743GS/µPC2744GS PIN EXPLANATION Pin No. 1 2 Symbol UOSC collector (Tr. 1) UOSC bace (Tr. 2) Pin voltage TYP. above: V mode (V) below: U mode (U) — 8.3 — 4.6 3 UOSC base (Tr. 1) — 4.6 4 UOSC collector (Tr. 2) — 8.3 5 UB — 9.0 6 OSC output 4.4 Function and Explanation Equivalent circuit Collector pin of UHF oscillator. Assemble LC resonator with 2 pin through capacitor ~ 1 pF to oscillate with active feedback Loop. Base pin of UHF oscillator with balance amplifier. Connected to LC resonator through feedback capacitor ~ 300 pF. 3 1 4 Base pin of UHF oscillator with balance amplifier. Connected to LC resonator through feedback capacitor ~ 300 pF. Collector pin of UHF oscillator with balance amplifier. Assemble LC resonator with 3 pin through capacitor ~ 1 pF to oscillate with active feedback Loop. Double balanced oscillator with transistor 1 and transistor 2. Switching pin for VHF or UHF operation. UHF operation = 9.0 V VHF operation = Open UHF and VHF oscillator output pin. In case of F/S tuner application, connected PLL symthesizer IC’s input pin. REG. 11 From OSC 6 4.5 7 OSC 0.0 GND 0.0 8 VOSC collector 9 VOSC base VOSC collector 2.5 5.1 5.8 11 VB VHF and UHF oscillators’ GND pin. Base pin of VHF oscillator with balance amplifier. Grounded through capacitor ~ 10 pF. 4.9 10 2 5 Base pin of VHF oscillator with balance amplifier. Assemble LC resonator with 10 pin to oscillate with active feedback Loop. 8 10 9 11 REG. Base pin of VHF oscillator with balance amplifier. Connected to LC resonator through feedback capacitor ~ 3 pF. 5.8 Monitor pin of regulator output 5.8 voltage. Data Sheet P10192EJ3V0DS00 3 µPC2743GS/µPC2744GS Pin No. 12 Symbol IF output Pin voltage TYP. above: V mode (V) below: U mode (U) 2.6 Function and Explanation Equivalent circuit IF output pin of VHF-UHF band functions. 13 75 Ω 12 2.6 13 14 15 16 17 18 19 VCC 9.0 Power supply for VHF-UHF band 9.0 functions. MIX 6.8 VHF and UHF MIX output pin. output 1 7.0 These pins should be equipped with MIX 6.8 output 2 7.0 VRF 3.0 input 3.1 VRF input 3.0 Bypass pin for VHF MIX input. (bypass) 3.1 Grounded through capacitor. MIX GND 0 GND pin of MIX, IF amplifier and 0 regulator. — Bypass pin for UHF MIX input. Grounded through capacitor. URF input (bypass) tank circuit to abjust frequency. VRF signal input pin from antenna. 2.7 20 URF input — URF signal input pin from antenna. 2.7 4 13 14 15 Data Sheet P10192EJ3V0DS00 17 16 14 15 19 From VHF OSC 20 From UHF OSC µPC2743GS/µPC2744GS ABSOLUTE MAXIMUM RATINGS Supply voltage 1 V CC Supply voltage 2 UB Power dissipation PD Operating temperature range Storage temperature range 11.0 V 11.0 V 750 mW TA –20 to +75 °C T stg –55 to +150 °C T A = 75 °C Note 1 Notes 1 Mounted on a 50 × 50 × 1.6 mm double copper epoxy glass board. RECOMMENDED OPERATING RANGE PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply voltage 1 VCC 8.0 9.0 10.0 V Supply voltage 2 UB 8.0 9.0 10.0 V Data Sheet P10192EJ3V0DS00 5 µPC2743GS/µPC2744GS µPC2743GS ELECTRICAL CHARACTERISTICS (TA = 25 °C, VCC = 9 V) PARAMETERS SYMBOL MIN. TYP. MAX. UNIT CONDITIONS Circuit current 1 (VHF) ICC1 37 47 57 mA No input signalNote 2 Circuit current 2 (UHF) ICC2 39 49 59 mA No input signalNote 2 Conversion gain 1 (VHF(L)) CG1 16.5 20 23.5 dB fRF = 55 MHz, Pin = –30 dBmNote 2 Conversion gain 2 (VHF(M)) CG2 16.5 20 23.5 dB fRF = 200 MHz, Pin = –30 dBmNote 2 Conversion gain 3 (VHF(H)) CG3 16.5 20 23.5 dB fRF = 470 MHz, Pin = –30 dBmNote 2 Conversion gain 4 (UHF(L)) CG4 19.5 23 26.5 dB fRF = 470 MHz, Pin = –30 dBmNote 2 Conversion gain 5 (UHF(H)) CG5 19.5 23 26.5 dB fRF = 890 MHz, Pin = –30 dBmNote 2 Noise figure 1 (VHF(L)) NF1 13 16 dB fRF = 55 MHzNote 2 Noise figure 2 (VHF(M)) NF2 13 16 dB fRF = 200 MHzNote 2 Noise figure 3 (VHF(H)) NF3 13 16 dB fRF = 470 MHzNote 2 Noise figure 4 (VHF(L)) NF4 12 15 dB fRF = 470 MHzNote 2 Noise figure 5 (VHF(H)) NF5 12 15 dB fRF = 890 MHzNote 2 Maximum output power 1 (VHF(L)) PO(SAT)1 +10 +13 dBm fRF = 55 MHz, Pin = 0 dBmNote 2 Maximum output power 2 (VHF(M)) PO(SAT)2 +10 +13 dBm fRF = 200 MHz, Pin = 0 dBmNote 2 Maximum output power 3 (VHF(H)) PO(SAT)3 +10 +13 dBm fRF = 470 MHz, Pin = 0 dBmNote 2 Maximum output power 4 (UHF(L)) PO(SAT)4 +10 +13 dBm fRF = 470 MHz, Pin = 0 dBmNote 2 Maximum output power 5 (UHF(H)) PO(SAT)5 +10 +13 dBm fRF = 890 MHz, Pin = 0 dBmNote 2 PPSC –20 dBm Note 3 Oscillation output level 0 STANDARD CHARACTERISTICS (REFERENCE VALUES) (TA = 25 °C, VCC = 9 V)Note 3 SYMBOL Value for reference UNIT CG1 22.0 dB fRF = 55 MHz, Pin = –30 Bdm Conversion gain 2 (VHF(H)) CG2 22.5 dB fRF = 360 MHz, Pin = –30 Bdm Conversion gain 3 (UHF(L)) CG3 27.0 dB fRF = 400 MHz, Pin = –30 Bdm Conversion gain 4 (UHF(H)) CG4 26.5 dB fRF = 800 MHz, Pin = –30 Bdm Noise figure 1 (VHF(L)) NF1 12.3 dB fRF = 55 MHz Noise figure 2 (VHF(H)) NF2 13.4 dB fRF = 360 MHz Noise figure 3 (UHF(L)) NF3 11.0 dB fRF = 400 MHz Noise figure 4 (UHF(H)) NF4 12.7 dB fRF = 800 MHz 1 % cross-modulation distortion 1 (VHF(L)) CM1 97 dBµ fdes = 55 MHz,Note 4 1 % cross-modulation distortion 2 (VHF(H)) CM2 94 dBµ fdes = 55 MHzNote 4 1 % cross-modulation distortion 3 (UHF(L)) CM3 92 dBµ fdes = 55 MHzNote 4 1 % cross-modulation distortion 4 (UHF(H)) CM4 90 dBµ fdes = 55 MHzNote 4 PARAMETERS Conversion gain 1 (VHF(L)) 6 channel beat CONDITIONS S/I 57.5 dBc Note 5 Oscillator output power 1 (VHF(L)) POSC1 –4 dBm fOSC = 100 MHz Oscillator output power 2 (VHF(H)) POSC2 –5 dBm fOSC = 405 MHz Oscillator output power 3 (UHF(L)) POSC3 –9 dBm fOSC = 445 MHz Oscillator output power 4 (UHF(H)) POSC4 –13 dBm fOSC = 845 MHz Notes 2. By measurement circuit 3. By application circuit 4. fundes = fdes + 12 MHz, Pin = –30 dBm, AM100 kHz 30 % modulation, DES/CM = 46 dBc, the cross-modulation values are level of undesired signals at open impedance. 5. fP = 83.25 MHz, fS = 87.75 MHz, Pin = –30 dBm each, fOSC = 129 MHz 6 Data Sheet P10192EJ3V0DS00 µPC2743GS/µPC2744GS µPC2744GS ELECTRICAL CHARACTERISTICS (TA = 25 °C, VCC = 9 V) PARAMETERS SYMBOL MIN. TYP. MAX. UNIT CONDITIONS Circuit current 1 (VHF) ICC1 37 47 57 mA No input signalNote 2 Circuit current 2 (UHF) ICC2 39 49 59 mA No input signalNote 2 Conversion gain 1 (VHF(L)) CG1 21.5 25 28.5 dB fRF = 55 MHz, Pin = –30 dBmNote 2 Conversion gain 2 (VHF(M)) CG2 21.5 25 28.5 dB fRF = 200 MHz, Pin = –30 dBmNote 2 Conversion gain 3 (VHF(H)) CG3 21.5 25 28.5 dB fRF = 470 MHz, Pin = –30 dBmNote 2 Conversion gain 4 (UHF(L)) CG4 27.5 31 34.5 dB fRF = 470 MHz, Pin = –30 dBmNote 2 Conversion gain 5 (UHF(H)) CG5 27.5 31 34.5 dB fRF = 890 MHz, Pin = –30 dBmNote 2 Noise figure 1 (VHF(L)) NF1 13 14 dB fRF = 55 MHzNote 2 Noise figure 2 (VHF(M)) NF2 13 14 dB fRF = 200 MHzNote 2 Noise figure 3 (VHF(H)) NF3 13 14 dB fRF = 470 MHzNote 2 Noise figure 4 (VHF(L)) NF4 12 13 dB fRF = 470 MHzNote 2 Noise figure 5 (VHF(H)) NF5 12 13 dB fRF = 890 MHzNote 2 Maximum output power 1 (VHF(L)) PO(SAT)1 +10 +13 dBm fRF = 55 MHz, Pin = 0 dBmNote 2 Maximum output power 2 (VHF(M)) PO(SAT)2 +10 +13 dBm fRF = 200 MHz, Pin = 0 dBmNote 2 Maximum output power 3 (VHF(H)) PO(SAT)3 +10 +13 dBm fRF = 470 MHz, Pin = 0 dBmNote 2 Maximum output power 4 (UHF(L)) PO(SAT)4 +10 +13 dBm fRF = 470 MHz, Pin = 0 dBmNote 2 Maximum output power 5 (UHF(H)) PO(SAT)5 +10 +13 dBm fRF = 890 MHz, Pin = 0 dBmNote 2 PPSC –20 dBm Note 3 Oscillation output level 0 STANDARD CHARACTERISTICS (REFERENCE VALUES) (TA = 25 °C, VCC = 9 V)Note 3 SYMBOL Value for reference UNIT Conversion gain 1 (VHF(L)) CG1 27.5 dB fRF = 55 MHz, Pin = –30 Bdm Conversion gain 2 (VHF(H)) CG2 28.0 dB fRF = 360 MHz, Pin = –30 Bdm Conversion gain 3 (UHF(L)) CG3 35.5 dB fRF = 400 MHz, Pin = –30 Bdm Conversion gain 4 (UHF(H)) CG4 35.0 dB fRF = 800 MHz, Pin = –30 Bdm Noise figure 1 (VHF(L)) NF1 9.2 dB fRF = 55 MHz Noise figure 2 (VHF(H)) NF2 9.4 dB fRF = 360 MHz Noise figure 3 (UHF(L)) NF3 8.3 dB fRF = 400 MHz Noise figure 4 (UHF(H)) NF4 10.0 dB fRF = 800 MHz 1 % cross-modulation distortion 1 (VHF(L)) CM1 92 dBµ fdes = 55 MHzNote 4 1 % cross-modulation distortion 2 (VHF(H)) CM2 90 dBµ fdes = 55 MHzNote 4 1 % cross-modulation distortion 3 (UHF(L)) CM3 82 dBµ fdes = 55 MHzNote 4 1 % cross-modulation distortion 4 (UHF(H)) CM4 80 dBµ fdes = 55 MHzNote 4 PARAMETERS 6 channel beat CONDITIONS S/I 53.5 dBc Note 5 Oscillator output power 1 (VHF(L)) POSC1 –4 dBm fOSC = 100 MHz Oscillator output power 2 (VHF(H)) POSC2 –5 dBm fOSC = 405 MHz Oscillator output power 3 (UHF(L)) POSC3 –9 dBm fOSC = 445 MHz Oscillator output power 4 (UHF(H)) POSC4 –13 dBm fOSC = 845 MHz Notes 2. By measurement circuit 3. By application circuit 4. fundes = fdes + 12 MHz, Pin = –30 dBm, AM100 kHz 30 % modulation, DES/CM = 46 dBc, the cross-modulation values are level of undesired signals at open impedance. 5. fP = 83.25 MHz, fS = 87.75 MHz, Pin = –30 dBm each, fOSC = 129 MHz Data Sheet P10192EJ3V0DS00 7 µPC2743GS/µPC2744GS TYPICAL CHARACTERISTICS (TA = 25 °C) – on Measurement Circuit – µ PC2743GS CIRCUIT CURRENT vs. SUPPLY VOLTAGE 60 VHF circuit 50 no input signal UHF circuit 50 no input signal ICC – Circuit Current – mA ICC – Circuit Current – mA CIRCUIT CURRENT vs. SUPPLY VOLTAGE 60 40 30 20 10 0 2 4 6 8 10 12 40 30 20 10 0 2 CONVERSION GAIN AND NOISE FIGURE vs. RF FREQUENCY VCC = 9 V fIF = 45 MHz Pin = –30 dBm 30 Pout – Output Power – dBm CG – Conversion Gain – dB NF – Noise Figure – dB 8 10 12 30 25 CG 20 15 NF 10 0 200 400 600 800 1 000 1 200 20 10 fRF = 890 MHz fRF = 200 MHz 0 –10 fIF = 45 MHz OSC LEVEL = –5 dBm –20 –30 –50 fRF – RF Frequency – MHz 8 6 OUTPUT POWER vs. INPUT POWER 35 5 4 VCC – Supply Voltage – V VCC – Supply Voltage – V –40 –30 –20 –10 Pin – Input Power – dBm Data Sheet P10192EJ3V0DS00 0 10 µPC2743GS/µPC2744GS TYPICAL CHARACTERISTICS (TA = 25 °C) – on Measurement Circuit – µPC2744GS CIRCUIT CURRENT vs. SUPPLY VOLTAGE 60 VHF circuit 50 no input signal UHF circuit 50 no input signal ICC – Circuit Current – mA ICC – Circuit Current – mA CIRCUIT CURRENT vs. SUPPLY VOLTAGE 60 40 30 20 10 0 2 4 6 8 10 12 40 30 20 10 0 2 VCC – Supply Voltage – V 30 fIF = 45 MHz Pin = –30 dBm 20 Pout – Output Power – dBm CG – Conversion Gain – dB NF – Noise Figure – dB 30 CG 20 15 5 NF 0 200 400 600 800 8 10 12 OUTPUT POWER vs. INPUT POWER 35 10 6 VCC – Supply Voltage – V CONVERSION GAIN AND NOISE FIGURE vs. RF FREQUENCY 25 4 1 000 1 200 10 fRF = 890 MHz fRF = 200 MHz 0 –10 fIF = 45 MHz OSC LEVEL = –5 dBm –20 –30 –50 fRF – RF Frequency – MHz –40 –30 –20 –10 0 10 Pin – Input Power – dBm Data Sheet P10192EJ3V0DS00 9 µPC2743GS/µPC2744GS TYPICAL CHARACTERISTICS (TA = 25 °C) – on Application Circuit – µ PC2743GS µ PC2744GS CONVERSION GAIN AND NOISE FIGURE vs. RF FREQUENCY 40 VCC = 9 V fIF = 45 MHz Pin = –30 dBm 35 CG – Conversion Gain – dB NF – Noise Figure – dB CG – Conversion Gain – dB NF – Noise Figure – dB 40 30 25 CG 20 15 NF 10 5 CONVERSION GAIN AND NOISE FIGURE vs. RF FREQUENCY 0 200 400 600 800 VCC = 9 V fIF = 45 MHz Pin = –30 dBm 35 30 CG 25 20 15 10 5 1 000 NF 0 200 fRF – RF Frequency – MHz –20 –30 –40 Pin – Pout 0 –10 6 channel beat –50 –60 0 –20 –30 –20 –10 –20 –30 –40 Pout – Output Level – dBm –10 µ PC2744GS 6 CHANNEL BEAT AND OUTPUT POWER vs. INPUT POWER fp = 83.25 MHz fs = 87.75 MHz 10 Pin = –30 dBm each fOSC = 129 MHz fp = 83.25 MHz fs = 87.75 MHz 10 Pin = –30 dBm each fOSC = 129 MHz –10 –60 6 channel beat –20 –30 –20 Pin – Input Level – dBm OSC TUNING VOLTAGE vs. OSC FREQUENCY Vtu – Tuning Voltage – V 20 VL U VH 10 200 300 400 500 600 700 fOSC – Oscillation Frequency – MHz 10 Pin – Pout 0 30 100 1 000 6 CHANNEL BEAT AND OUTPUT POWER vs. INPUT POWER Pin – Input Level – dBm 0 800 –50 –10 µ PC2743/44GS 600 fRF – RF Frequency – MHz 6 channel beat (dBm) 6 channel beat (dBm) 0 Pout – Output Level – dBm µ PC2743GS 400 Data Sheet P10192EJ3V0DS00 800 900 1 000 –10 µPC2743GS/µPC2744GS MEASUREMENT CIRCUIT 1 000 pF 1 000 pF 1 20 1 000 pF 1 000 pF UHF OSC IN UHF RF IN 2 19 3 18 4 17 5 16 6 15 NC 7 14 NC 8 13 1 000 pF 1 000 pF 1 000 pF VHF RF IN 1 000 pF UB 1 000 pF 1 000 pF 1 000 pF VCC 1 000 pF 1 000 pF 1 000 pF VHF OSC IN 9 12 10 11 IF OUT 1 000 pF 1 000 pF Data Sheet P10192EJ3V0DS00 Operation Mode VCC UB VHF 9V Open UHF 9V 9V 11 12 pF 12 pF 1 000 pF 18 3 300 pF 47 kΩ URF IN 19 3T U OSC 2 3T 20 1 pF 1 300 pF 47 kΩ IT363 1 pF 1 000 pF 17 4 VRF IN 1 000 pF 5 16 6 15 Data Sheet P10192EJ3V0DS00 UB(9 V) APPLICATION CIRCUIT EXAMPLE 12 1 000 pF VTU 1 000 pF OSC OUT 1 000 pF 6 pF 14 8 13 9 1SS317 3T IT363 3 pF 2.7 kΩ 1 000 pF 0.1 µF 47 KΩ LB (9 V) HB VTU (9 V) IT363 1 000 pF µPC2743GS/µPC2744GS 0.1 µF 47 kΩ IF OUT 1 000 pF 11 10 1 000 pF REG. 5T 1 000 pF VCC(9 V) 1 000 pF 12 200 pF V OSC 47 kΩ 7 10 pF 1.2 µ H µPC2743GS/µPC2744GS PACKAGE DIMENSIONS 20 PIN PLASTIC SOP (300 mil) (UNIT: mm) 20 11 detail of lead end 3° +7° –3° 1 10 12.7±0.3 7.7±0.3 5.6±0.2 1.55±0.1 0.78 MAX. 1.27 1.1 0.6±0.2 +0.10 0.4±0.1 0.12 M 0.10 0.20 –0.05 0.1±0.1 1.8 MAX. NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. Data Sheet P10192EJ3V0DS00 13 µPC2743GS/µPC2744GS RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering method and conditions than the recommended conditions are to be consulted with our sales representative. µ PC2743GS, µ PC2744GS Soldering process Infrared ray reflow VPS Wave soldering Partial heating method Notes 6 Soldering conditions Symbol Peak package’s surface temperature: 230 °C or below, Reflow time: 30 seconds or below (210 °C or higher), Number of reflow process: 1, Exposure limitNote 6: None IR30-00 Peak package’s surface temperature: 215 °C or below, Reflow time: 40 seconds or below (200 °C or higher), Number of reflow process: 1, Exposure limitNote 6: None VP15-00 Solder temperature: 260 °C or below, Flow time: 10 seconds or below, Number of flow process: 1, Exposure limitNote 6: None WS60-00 Terminal temperature: 300 °C or below, Flow time: 10 seconds or below, Exposure limitNote 6: None Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 ˚C and relative humidity at 65 % or less. Caution Apply only a single process at once, except for “Partial heating method”. For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 14 Data Sheet P10192EJ3V0DS00 µPC2743GS/µPC2744GS [MEMO] Data Sheet P10192EJ3V0DS00 15 µPC2743GS/µPC2744GS NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98.8